隨著次世代面板廠(六代、七代甚至八代等)興建的腳步不斷延續，製程技術也在不斷的進步，面板廠之製程技術為提升生產效率與產出良率之重要關鍵，為了要在此一競爭中脫穎而出，所有廠商都在不斷地做改善，尤其是設備機器方面。因此，本研究重點就針對TFT-LCD面板製程中，需使用多次之熱烤箱(Annealing Oven，ANOV)做一系列的研究與探討；本研究選擇以數值模擬方式來觀察熱烤箱間的流場變化，並分析其內部流場之物理現象以及探討發生之原因。本文藉由數值模擬分析出箱體內部出風道之流場變化，針對原始設計的出風道區域做改良，接著以裝設擋板及配置整流板做進一步改善，並與原始設計比較其差異性、分析所得之改善結果，通過改善後的流場變化，得到較佳的設計參數，使得ANOV的箱體設計更加完善，並使其達到最佳氣流均勻性之分佈。改善完成後的ANOV玻璃基板入口流量提升了3.9％，整體來看各方面的表現都比原型要來得優異許多。本研究之完成，預計可建立一套ANOV之分析與設計模式，對於提升生產效率與產出良率將有所助益，可協助業界取得更高之市場佔有率，同時亦可增加國內產業與國外產品之需求的競爭優勢，進而提昇該項產品之國際競爭力。

As LCD factory advances to the 8.5 generation, the improvement on the manufacture facilities has draw significant attention for enhancing the competition advantage. However, the drying process, which is needed several times during the manufacturing procedure, is becoming more difficult due to the increasing LCD size. Therefore, designing annealing oven (ANOV) for drying LCD substrate is an essential and challenging task for TFT-LCD industry and become the goal of this study. At first, the flow visualization is performed numerically via CFD code Fluent to identify the detailed flow patterns inside the original ANOV. It follows that a severe non-uniform velocity distribution along the different rows of LCD plates and several serious reversed flows are found inside the utility air plenum and the LCD drying region. Afterwards, several modifications are imposed to assure the uniform velocity distribution at the exit of utility air chamber and the inlet side of LCD substrates. These improvements includes the removal of ventilation opening, the elimination of improper barriers at fan exit, the location adjustment of fan, adjusting the straightener’s porous ratio, additions of the flow straighteners, the blockage plates, and the corner guiding plates. Trough a systematic and comprehensive CFD analysis, it is demonstrated that a slight airstream increase 3.9%, the uniform velocity distribution, and the substantial reductions on the reversed and circulated flow patterns are achieved successfully. Also, the corresponding influences on the parameters are discussed and summarized for the designer’s reference.

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