本文主要在探討不同結構之多層陶瓷元件的電性和界面匹配性。本研究主要分為兩部份：(1)多層式壓電致動器界面微觀與電性探討；(2)負溫度係數熱敏電阻元件電性與界面匹配研究。
在第一部分方面，目前壓電致動器元件，所面臨之主要問題為商用的壓電材料其燒結溫度均須1200℃以上，因此必須使用價格昂貴的貴金屬作為內電極，因此本實驗選用壓電特性優異的PZNZT材料系統，利用刮刀成型技術製備壓電陶瓷層，搭配70Ag-30Pd金屬內電極，運用共燒技術製作多層式壓電致動器(MLCA)，分別探討於不同溫度處理下其壓電、介電特性，最後對其電壓-位移量以及疲勞特性做一探討。由實驗結果顯示，試片燒結溫度可降低至900℃，並且於燒結1000℃持溫兩小時後其壓電特性Kp與d33分別達到最高的0.7和385 pc/N。在SEM微觀結構圖中得知，燒結1000℃持溫兩小時後其陶瓷與金屬界面接合性良好，並且陶瓷層與金屬電極厚度分別為100 μm與3 μm。電壓-位移量量測中發現，在200 V驅動電壓下其元件位移量與應變量分別為0.73 μm和0.073%。而疲勞特性量測則在105 cycle後開始衰減，主要原因來自於陶瓷/金屬電極界面破壞，使可作用電場降低，造成特性下降，另一原因為銀擴散至陶瓷層，造成陶瓷內部氧空缺的產生使得陶瓷材料容易產生電域釘鎖(domain pinning)的現象，疲勞提早發生。
在第二部份方面，以具有尖晶石結構之Mn系氧化物陶瓷，其電阻會隨著溫度上升而急速下降，此特性被應用於負溫度係數（NTC）熱敏電阻元件，隨著科技的發展，NTC元件的也開始朝向多層式結構發展。目前多層式負溫度係數熱敏電阻元件，所面臨之主要問題為陶瓷與內電極間匹配性不足，因此容易使元件產生翹曲、裂紋、脫層現象發生。因此本實驗選用Mn-Ni與Mn-Co-Cu兩種熱敏電阻材料系統，除了探討其材料的晶體結構、導電行為、相對應之電阻特性，並對其製做成多層元件後，其陶瓷與金屬間之界面結合性與反應行為做一研究。由實驗結果顯示，在Mn-Ni系統中，當Ni含量低於0.4以下容易形成Mn3O4二次相，並且隨著Ni含量的增加，電阻率有整體下降的趨勢，並於Ni=0.95時電阻率達到最低，而在Mn-Co-Cu系統中，隨著Cu含量的增加，電阻率有逐漸下降的趨勢，推斷為Cu＋與Cu2+離子在B-site位置的存在，促使更多Mn4+的生成，增大了載流子的濃度有關。而由SEM觀察得之，此兩材料系統各成份配比整體致密度高，無大量孔洞產生，並且其理論密度皆已達到95%~98%之間。由熱膨脹分析發現，此兩材料系統各成份配比的曲線都呈現穩定的斜率(TEC:12.7~18.9 10-6K-1)，並無任何劇烈的斜率轉折點。不過此值皆高於熱敏電阻元件常用之金屬內電極Pd(TEC:11.5×10-6K-1)。而在陶瓷與內電極之匹配方面，藉由在金屬內電極Pd膠內添加7wt%的NTC陶瓷材料，藉此拉近陶瓷/金屬間熱膨脹係數，經過改良後的電極與陶瓷間的匹配性的確獲得改善，並且無裂紋的產生。

This thesis discussed the electrical properties and interfacial compatibility of multilayer ceramic components. The thesis was divided into two parts: (1) microstructure and electrical properties of multilayer ceramic actuators (MLCA) and (2) interfacial compatibility and electrical properties of negative temperature coefficient (NTC) thermistor.
In the first part, PZNZT, whose piezoelectric properties were superior, was chosen as the piezoelectric layer, and 70Ag-30Pd was chosen as the metal electrode. The specimen was prepared by tape casting followed by co-firing. The study primarily analyzed the effect of various co-firing temperature on piezoelectric, dielectric, fatigue characteristics as well as voltage-displacement. The result showed that the lowest firing temperature was reduced to 900℃; also, Kp and d33 reached 0.7 and 385pC/N after firing at 1000℃ for two hours. For the same condition, the analysis of microstructure from SEM micrographs revealed that the piezoelectric and metal layer remained adhered to each other. The thickness of former and later was 100 μm and 3μm, respectively. The measurement of voltage-displacement gave that the displacement and strain percentage was 0.73μm and 0.073%. For the fatigue test, displacement decreased obviously after 105 cycles. One reason could be that the electric field was reduced due to the loss of adherence of interface. The other reason was that the diffusion of Ag into piezoelectric layer caused the generation of oxygen vacancy, resulting in the so-called domain pinning, so the fatigue occurred at less cycles.
In the second part, Mn-Ni and Mn-Co-Cu, NTC materials, were chosen for studying their crystal structure, conducting behavior, and NTC characteristics. In addition, those two materials were used in fabrication of multilayer components, so the adherence to metal electrodes and interfacial reactions were also studied. In Mn-Ni system, the second phase, Mn3O4, was formed if the content of Ni was lower than 0.4. Furthermore, the overall resistivity decreased as the content of Ni increased. In Mn-Co-Cu system, as the content of Cu increased, the resistivity decreased gradually. The reason could be that Cu+ and Cu2+ occupied B-site; therefore, the creation of extra Mn4+ increased the concentration of carriers. The SEM micrographs showed that the specimens of two systems were dense with theoretical density 95%~98%, and no enormous voids were observed. Thermal Dilatometric analysis (TDA) revealed that thermal expansion coefficient (TEC) ranged from 12.7 to 18.9*10-6K-1; moreover, no abrupt slope changes or turning points were found. The result for the compatibility between the ceramics and electrodes showed that adding 7 wt% NTC ceramics into Pd electrode reduced the difference of TEC, and no cracking was found. The interfacial compatibility was improved

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