研究生: |
陳建良 Ling - Chen |
---|---|
論文名稱: |
發光二極體中打線接合構裝技術之研究 Investigation of the Wire Bonging Technique in the Light-Emitting-Diode Packaging |
指導教授: |
顏怡文
Yee-wen Yen |
口試委員: |
吳子嘉
Albert T. Wu 陳志銘 C. M. Chen 施劭儒 Shao-Ju Shih |
學位類別: |
碩士 Master |
系所名稱: |
應用科技學院 - 醫學工程研究所 Graduate Institute of Biomedical Engineering |
論文出版年: | 2011 |
畢業學年度: | 99 |
語文別: | 中文 |
論文頁數: | 64 |
中文關鍵詞: | 發光二極體 、打線接合構裝技術 |
外文關鍵詞: | wire bonding process |
相關次數: | 點閱:363 下載:13 |
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在電子構裝製程中,打線接合技術一直是使用最廣的電路連線方式。打線接合過程中,控制參數的設定或是材料的選擇會對接合強度的大小有顯著的影響。本論文的目的,利用實驗計畫法,探討打線參數(接合時間、接合壓力、接合頻率)及瓷嘴和晶片表面構造與接合強度的關係。
本論文中發現使用粗化瓷嘴可以得到較佳的操作性,並且透過實驗計畫法得到最佳打線參數為:接合時間20 ms、接合頻率50 KHz、接合壓力40 gf、金球厚度15 μm,再由可靠度的長期監控下並無發現LED熄燈之問題,由此可以證明打線接合參數有達到佳化。
Among all electrical packaging, wire bonding process is most popular method for electrical interconnection. During the boning process , parameters and bonding material, for example, capillary and chip, played critical roles.
In this thesis, we investigated how bonding strength varies with capillary, surface roughness of chip, and wire bond parameters, such as bonding time, bonding force, ultrasonic frequency, by design of experiment method.
The design of experiment results indicated that rough capillary is most appropriate for different surface chip, and the optimized bonding parameters are 20 ms, 50 KHz, 40gf, 15um for bonding time, ultrasonic frequency, bonding force and ball thickness respectively.
Finally, we performed the long-term burn-in test on these sample and no defect was found which further confirmed the process optimization successful for the bonding process.
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