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Author: 李銓富
CHUAN-FU LEE
Thesis Title: 積層製造技術專利分析與發展策略: 以Stratasys為例
Patent Analysis on Additive Manufacturing and Corporate Development Strategy : A Case Study of Stratasys
Advisor: 蘇威年
Wei-Nien Su
林瑞珠
JUI-CHU LIN
Committee: 李維楨
wclee@mail.ntust.edu.tw
Degree: 碩士
Master
Department: 應用科技學院 - 專利研究所
Graduate Institute of Patent
Thesis Publication Year: 2015
Graduation Academic Year: 103
Language: 中文
Pages: 95
Keywords (in Chinese): 積層製造3D列印熔融擠製成型專利分析與佈局專利訴訟
Keywords (in other languages): Fused deposition, Patent analysis and portfolios, Stratasys, Patent litigation.
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  • 在這近幾年間,積層製造的技術發展快速,透過專利的申請使得該技術獲得法律上的保障,也可對向行使權利來進行訴訟,而目前美國於積層製造產業的產業領導公司為Stratasys與3D Systems,其中Stratasys的熔融擠製技術相對於其他積層製造技術,具有技術門檻較低、使用機台與材料的價格較低的特點,對於想要進入該產業領域的公司而言,相對為最佳的選擇,因此市場規模發展快速。本文將對Stratasys的專利技術做深入的分析與探討。
    本研究整理美國熔融擠製技術(FDM)的專利,做一巨觀分析,分析其專利概況,再特別聚焦於該技術的領導公司Stratasys,並做其微觀分析,從以下幾個面向進行探討:(1) 運用專利技術功效矩陣來分析Stratasys佈局策略;(2)藉由專利技術與申請年份矩陣來找出由本體圖所分類出的技術源頭與專利申請趨勢;(3)藉由專利原創性、普遍性、Citation lags、平均被引用數等指標,來評估與比較關鍵專利與各技術源頭專利表現;(4)檢視Stratasys專利訴訟策略,探討Stratasys訴訟專利是否運用於訴訟中,同時參考積層製造產業的其它專利訴訟案件,了解目前該產業的專利訴訟概況;(5) 從Stratasys公開專利的功效矩陣,分析其近年來的技術佈局重點,並預測未來技術發展走向;(6)總結Stratasys的專利佈局與公司的發展策略,提供積層製造相關產業的參考與發展建議。


    In recent years, the development of Additive Manufacturing (AM) has attracted considerable attention and achieved substaintial commercial success. Patents endow the owners of developed technology with a set of exclusive rights, as well as an offensive litigation tool. Currently Stratasys and 3D Systems are two leading companies in this industry. The Fused Deoposition Modelling (FDM) developed by Stratasys has various advantages compared to other AM technologies, such as lower technologicial complexity, cheaper and multiple materials, affordable prices. All these factors contribute to the rapid growth of this type of sysyems, especially for the new start-ups. As a result, it will be of great interest to investigate the patent portfolio of Stratesys and analyze its technological features through patent mapping.
    This thesis focused on the US patents of FDM technology and Stratasys. So the research unfolded as follows. (1) Technology-fuction matrix was applied to analyze the patent portfolio of Stratasys. (2) Based on the ontological structure, source patents and key patents for each type of technologies were identified by the analysis. (3) Key patents and source patents were evaluated by different patent indicators, e.g. originality, generality, citation lags, and number of citations. (4) Referring the the litigation cases in 3D industries, the IPR strategies of Stratasys have been extensively reviewed. (5) The possible developing trends of this technology were also proposed by analyzing the patent applications. (6) Finally, the patent analysis and development strategy of Stratasys were summarized.

    摘要 I AbstractII 誌謝 III 目錄 IV 圖目錄 VII 表目錄 VIII 第一章 緒論 1 1.1 技術背景 1 1.1.1 積層製造-應用 1 1.1.2 積層製造-市場 2 1.1.3 積層製造-材料市場概況 3 1.1.4 光固化材料 4 1.1.5 熱塑性材料 4 1.1.6 積層製造-兩大龍頭公司 5 1.1.7 熔融擠製成形技術(Fused Deposition Modeling) 6 1.2 文獻討論 7 1.2.1 專利分析文獻 7 1.2.1.1 積層製造-專利分析 7 1.2.1.2 其他產業專利佈局分析 8 1.2.1.3 專利指標與專利品質 9 1.2.2 專利訴訟分析文獻 10 1.2.2.1 專利訴訟與鑑價 10 1.2.2.2 專利訴訟關係 11 1.2.3 產業相關文獻 11 1.2.3.1 產業技術應用 12 1.2.3.2 材料應用 13 1.2.3.3 自造者時代與展望 13 第二章 研究方法與目的 15 2.1 研究動機 15 2.2 研究目的 16 2.3 研究流程與架構 17 2.4 專利資訊分析定義 19 第三章 熔融擠製技術專利分析 22 3.1 技術定義 22 3.1.1 關鍵字提取 23 3.1.2 關鍵字擴充 23 3.2 專利統計分析 24 3.2.1 檢索歷程 25 3.2.2 申請件數 26 3.2.3 國際分類號(IPC) 28 3.2.4 專利家族概況 29 3.3 STRATASYS技術佈局與發展策略 30 3.3.1 Stratasys的併購策略 30 3.3.2 Stratasys技術功效矩陣 32 3.3.3 Stratasys可能的競爭對手 34 3.4 重要專利與發展趨勢分析 36 3.4.1 技術申請年份矩陣圖 36 3.4.2 重要專利指標分析 38 3.4.3 重要專利請求項分析 46 3.4.3.1 過期關鍵專利 46 3.4.3.2 後續各子技術專利 49 3.4.4 Stratasys近期的專利研發方向 55 3.5 小結 62 第四章 STRATASYS專利訴訟分析 65 4.1 何謂專利侵權 65 4.1.1 專利侵權鑑定要點 65 4.1.2 專利侵權責任認定 68 4.2 STRATASYS專利訴訟與訴狀 68 4.2.1 3D Systems v. Stratasys & Objet 及 Objet & Stratasys v. 3D Systems 71 4.2.2 Leseman, LLC v. Stratasys, Inc. 72 4.2.3 Stratasys Inc. v. Microboards Technology, Afinia 73 4.3 STRATASYS V AFINIA專利範圍解析 75 4.4 小結 78 第五章 結果與建議 80 5.1 專利技術分析 80 5.2 智權策略分析 81 5.3 未來方向與建議 82 國內外參考文獻 83 附件一Stratasys公司專利 87 附件二 Objet公司專利 93 附件三 Makerbot公司專利 95

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