研究生: |
郭筱薇 Siao-wei Guo |
---|---|
論文名稱: |
鋅-錫-鋁-銅基高溫無鉛銲料之研究 Developement of High-temperature Lead-free solders: Zn-Sn-Al-Cu Based Alloy |
指導教授: |
顏怡文
Yee-wen Yen |
口試委員: |
吳子嘉
Albert T. Wu 施劭儒 Shao-ju Shih 陳志銘 C. M. Chen |
學位類別: |
碩士 Master |
系所名稱: |
工程學院 - 材料科學與工程系 Department of Materials Science and Engineering |
論文出版年: | 2011 |
畢業學年度: | 99 |
語文別: | 中文 |
論文頁數: | 86 |
中文關鍵詞: | 鋅-錫-鋁-銅合金 、液相線溫度 、硬度 、拉伸強度 、界面反應 |
外文關鍵詞: | Zn-Sn-Al-Cu alloy, liquildus temperature, hardness, tensile strength, interfical reaction |
相關次數: | 點閱:280 下載:1 |
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高鉛銲料常使用於電子元件內部連接,近年由於歐盟正式立法,對含鉛的電子產品有所限制,因此電子構裝技術朝無鉛化發展。本研究以開發高溫無鉛銲料為主要目標,以Zn-Sn-Al-Cu合金為主要銲料成分,並添加Ni、Ge等少量元素,用以調整合金物理及化學特性。此外,也以Cu/alloy/Ni/Cu之反應偶結構,在300及350℃分別迴焊1、2以及4小時,觀察接合情形及界面生成相。
實驗結果顯示,Zn-Sn-Al-Cu基合金的熱分析,液相線溫度在275oC至375oC之間,隨Zn含量的提高液相線溫度隨著提高。而Zn的增加將使得硬度及強度較佳的(Zn)及CuZn5相增加故將促使合金硬度及最大抗拉強度的提升;而Al的添加也將提升其機械強度。Cu/alloy/Ni/Cu反應偶在迴焊後與Cu接合處產生三或四種型態不同的介金屬相(IMC),有CuZn、、CuZn5及Al4Cu3Zn相,相為-Al4Cu9與-Cu5Zn8所形成連續的固溶相,而相的生成與否與合金中Al/Zn的比例有關;於Ni/Cu端的合金內則可觀察到CuZn5、Al4Cu3Zn、(Zn)、(Al)及-Sn相,其中Ni皆不參與界面反應。
Despite numerous studies on the research and development for high-temperature lead free solders, high-lead solder are still in used because high-temperature lead free solders also has been facing several serious problems during these years. Establishing high-temperature lead-free solder is an urgent priority. This study investigates the development of high-temperature lead-free solders and their properties by improve its wettability and oxidation resitivity after addition of Ni and Ge in Zn-Sn-Al-Cu based alloy. The solders are examined for microstructure, thermal properties, mechanical properties and investigate the interfacial reaction between Zn-Sn-Al-Cu based alloy with Cu and Ni/Cu at 300 and 350oC for 1, 2 and 4 hours.
The experimental results indicate that the liquilidus temperature of Zn-Sn-Al-Cu based alloys is between 275oC to 375oC with Zn content. As Zn contents increase the (Zn) and CuZn5 increase, therefore resulting in the increase of micro-hardness and ultimate tensile strength and the addition of Al improve mechanical properties. Three or four intermetallic compounds (IMCs) are formed at the interface in the Cu/alloy diffusion couple. The reaction phases are identified as CuZn5, Al4Cu3Zn, phase and CuZn is formed facing to the Cu substrate. The phase is formed or not that is related to Al/Zn ratio. The IMCs are indentified as CuZn5, Al4Cu3Zn, (Zn), (Al) and-Sn phase in the alloys near the Ni/Cu substrate after reflow.
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