高鉛銲料常使用於電子元件內部連接，近年由於歐盟正式立法，對含鉛的電子產品有所限制，因此電子構裝技術朝無鉛化發展。本研究以開發高溫無鉛銲料為主要目標，以Zn-Sn-Al-Cu合金為主要銲料成分，並添加Ni、Ge等少量元素，用以調整合金物理及化學特性。此外，也以Cu/alloy/Ni/Cu之反應偶結構，在300及350℃分別迴焊1、2以及4小時，觀察接合情形及界面生成相。
實驗結果顯示，Zn-Sn-Al-Cu基合金的熱分析，液相線溫度在275oC至375oC之間，隨Zn含量的提高液相線溫度隨著提高。而Zn的增加將使得硬度及強度較佳的(Zn)及CuZn5相增加故將促使合金硬度及最大抗拉強度的提升；而Al的添加也將提升其機械強度。Cu/alloy/Ni/Cu反應偶在迴焊後與Cu接合處產生三或四種型態不同的介金屬相(IMC)，有CuZn、、CuZn5及Al4Cu3Zn相，相為-Al4Cu9與-Cu5Zn8所形成連續的固溶相，而相的生成與否與合金中Al/Zn的比例有關；於Ni/Cu端的合金內則可觀察到CuZn5、Al4Cu3Zn、(Zn)、(Al)及-Sn相，其中Ni皆不參與界面反應。

Despite numerous studies on the research and development for high-temperature lead free solders, high-lead solder are still in used because high-temperature lead free solders also has been facing several serious problems during these years. Establishing high-temperature lead-free solder is an urgent priority. This study investigates the development of high-temperature lead-free solders and their properties by improve its wettability and oxidation resitivity after addition of Ni and Ge in Zn-Sn-Al-Cu based alloy. The solders are examined for microstructure, thermal properties, mechanical properties and investigate the interfacial reaction between Zn-Sn-Al-Cu based alloy with Cu and Ni/Cu at 300 and 350oC for 1, 2 and 4 hours.
The experimental results indicate that the liquilidus temperature of Zn-Sn-Al-Cu based alloys is between 275oC to 375oC with Zn content. As Zn contents increase the (Zn) and CuZn5 increase, therefore resulting in the increase of micro-hardness and ultimate tensile strength and the addition of Al improve mechanical properties. Three or four intermetallic compounds (IMCs) are formed at the interface in the Cu/alloy diffusion couple. The reaction phases are identified as CuZn5, Al4Cu3Zn, phase and CuZn is formed facing to the Cu substrate. The phase is formed or not that is related to Al/Zn ratio. The IMCs are indentified as CuZn5, Al4Cu3Zn, (Zn), (Al) and-Sn phase in the alloys near the Ni/Cu substrate after reflow.

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