隨著國內半導體與光電產業的蓬勃發展，相關製程技術不斷提昇，微型化之電子或機械元件的熱傳問題分析，已從巨觀邁入微觀現象的層面，本文以微奈米尺度介電材質的一維薄膜微觀熱傳現象作為研究方向，以聲子輻射熱傳方程式作為理論基礎，並假設傳熱情況為雙熱通量模型，使用數值分析的有限差分法進行模擬，探討鬆弛時間、薄膜性質與薄膜材質對薄膜內部溫度及熱通量分布的影響。

Manufacturing technologies develop with internal semiconductor and photoelectric industry. The problem about heat transfer of microelectronics or micromachines have entered from macroscale to microscale. This study discusses micro/nano scale heat transfer phenomenon of one-dimension film in dielectric materials. Assume the condition of heat transfer is two-flux model, according to equation of phonon radiative transfer, using finite difference method to numerical analysis. Observes the distribution of temperature and heat flux in film when relax time、film properties and film materials change.

[1] Maxwell﹐J﹒C﹒﹐“On the Dynamic Theory of Gases﹐”Philosophical Transaction﹐London﹐Vol﹒157﹐pp﹒49–88﹐1867﹒
[2] Kaganov﹐M﹒I﹒﹐Lifshitz﹐I﹒M﹒and Tanatarov﹐M﹒V﹒﹐“Relaxation Between Electrons and Crystalline Lattices﹐”Soviet Physics JETP﹐1957﹐4﹐173–178﹒
[3] Guyer﹐R﹒A﹒and Krumhansl﹐J﹒A﹒﹐“Solution of the Linearized Boltzmann Equation﹐”Physical Review﹐1966﹐148﹐766–778﹒
[4] Klitsner﹐J﹒E﹒﹐VanCleve﹐J﹒E﹒﹐Fischer﹐H﹒E﹒and Pohl﹐R﹒Q﹒﹐“Phonon Radiative Heat Transfer and Surface Scattering﹐”Physical Review B﹐Vol﹒38﹐pp﹒7576–7594﹐1988﹒
[5] Flik﹐M﹒I﹒﹐Choi﹐B﹒I﹒﹐and Goodson﹐K﹒E﹒﹐“Heat Transfer Regimes in Microstructures﹐”ASME Journal of Heat Transfer﹐Vol﹒114﹐pp﹒666–674﹐1992﹒
[6] Majumdar﹐A﹒﹐“Microscale Heat Conduction in Dielectric Thin Film﹐”ASME Journal of Heat Transfer﹐Vol﹒115﹐pp﹒7–16﹐1993﹒
[7] Joshi﹐A﹒A﹒﹐and Majumdar﹐A﹒﹐“Transient Ballistic and Diffusive Phonon Heat Transport in Thin Film﹐”Journal of Applied Physics﹐Vol﹒74﹐pp﹒31–39﹐1993﹒
[8] Polsky﹐Y﹒﹐and Bayazitoglu﹐Y﹒﹐“Derivation of the Casimir Limit Phonon Distribution Using the Boltzmann Transport Equation﹐”ASME Journal of Heat Transfer﹐Vol﹒117﹐pp﹒751–755﹐1995﹒
[9] Raisi﹐A﹒﹐and Rostami﹐A﹒A﹒﹐“Unsteady Heat Transport in Direction Perpendicular to a Double–layer Thin–Film Structure﹐”Numerical Heat Transfer﹐Part A﹐Vol﹒41﹐pp﹒373–390﹐2002﹒
[10] Murthy﹐J﹒Y﹒﹐and Mathur﹐S﹒R﹒﹐“Computation of Sub–Micro Thermal Transport Using an Unstructured Finite Volume Method﹐”ASME Journal of Heat Transfer﹐Vol﹒124﹐pp﹒1176–1181﹐2002﹒
[11] Tien﹐C﹒L﹒and Chen﹐G﹒﹐“Challenges in Microscale Conductive and Radiative Heat Transfer﹐”ASME Journal of Heat Transfer﹐Vol﹒116﹐pp﹒799–807﹐1994﹒
[12] Tzou﹐D﹒Y﹒﹐Macro–to Microscale Heat Transfer︰the Lagging Behavior﹐Taylor＆Francis﹐Washington﹐DC﹐1996﹒
[13] Rohsenow﹐W﹒﹐Hartnett﹐J﹒P﹒﹐Handbook of Heat Transfer﹐McGraw–Hill﹐New York﹐1973﹒
[14] Ziman﹐J﹒M﹒﹐Electrons and Phonons：the Theory of Transport Phenomena in Solids﹐Clarendon Press﹐Oxford﹐1960﹒
[15] 施閔華﹐微奈米尺度薄膜熱傳現象之研究﹐國立中央大學機械工程研究所碩士論文﹐桃園﹐2003﹒
[16] 吳世國﹐薄膜內微觀熱傳導分析﹐國立交通大學機械工程研究所碩士論文﹐新竹﹐1998﹒
[17] J﹒P﹒Holman﹐Heat Transfer﹐9th ed﹐The McGraw–Hill Companies﹐2001﹒
[18] Steven C﹒Chapra and Raymond P﹒Canale﹐Numerical Methods for Engineers﹐2 nd ed﹐The McGraw–Hill Companies﹐1989﹒
[19] 劉靜﹐微米奈米尺度傳熱學﹐五南圖書出版公司﹐2004﹒
[20] 洪源鍵﹐尺寸效應和界面熱阻對熱電致冷器性能之影響﹐國立交通大學機械工程研究所碩士論文﹐新竹﹐2004﹒