研究生: |
邵伯諺 BO-YAN SHAO |
---|---|
論文名稱: |
應用於太赫茲成像系統之基板合成波導號角天線與垂直極化端射天線 Substrate Integrated Waveguide Horn Antenna and Vertically Polarized End-fire Antenna For Terahertz Imaging System |
指導教授: |
馬自莊
Tzyh-Ghuang Ma |
口試委員: |
吳宗霖
Tzong-Lin Wu 陳晏笙 Yen-Sheng Chen 鄭宇翔 Yu-Hsiang Cheng |
學位類別: |
碩士 Master |
系所名稱: |
電資學院 - 電機工程系 Department of Electrical Engineering |
論文出版年: | 2023 |
畢業學年度: | 111 |
語文別: | 中文 |
論文頁數: | 145 |
中文關鍵詞: | D頻帶 、介質透鏡 、端射天線 、號角天線 、IPD製程 、基板合成波導 、基板整合波導轉接器 、太赫茲 、太赫茲成像系統 |
外文關鍵詞: | D-band, dielectric lens, end-fire antenna, horn antenna, IPD process, substrate integrated waveguide, substrate integrated waveguide transitions, terahertz, terahertz imaging system |
相關次數: | 點閱:461 下載:7 |
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本論文之研究主題為利用整合被動元件(Integrated Passive Devices,IPD)製程實現150 GHz端射天線,作為通訊/感測系統整合之用。
首先吾人在D頻帶完成了一T型接地共面波導共振器,其功用為識別IPD製程使用之基材工作於150 GHz介電特性與損耗正切,同時量測的結果得以驗證模擬軟體中對於材料特性的各項參數設定是否正確,為後續兩項研究提供初期利用軟體進行設計的基礎。
第一項研究為「應用於太赫茲成像系統之基板合成波導號角天線」,吾人同樣採用穩懋半導體所提供之IPD製程,於D頻帶完成了一基板合成波導號角天線,吾人將基板合成波導號角天線開口由晶片退後,利用裸露IPD基材表面矽化合物減緩IPD基材與空氣間的不連續,提搞阻抗匹配度,並引入了一耦合平行金屬轉接結構,有效增加天線頻寬響應;此外,吾人同時還提出了一種場型重塑金屬圍殼結構,用以克服IPD基材中的砷化鎵因高介電係數而造成天線輻射困難,進而實現預計之端射場型。
第二項研究為「應用於太赫茲成像系統之基板合成波導微型垂直極化端射天線」,基於前項研究,吾人在設計初期便引入了裸露IPD基材表面矽化合物、耦合平行金屬轉接結構與場型重塑金屬圍殼結構等,並結合開路之基板合成波導作為饋入,構成一工作於D頻帶的基板合成波導垂直極化端射天線,整體天線占用基材面積只有985 um×605 um,尺寸只有第一項研究之基板合成波導號角天線的40 %,因較微型化的尺寸,最終被選為整合於太赫茲成像通訊系統之天線。
This thesis aims at developing end-fire antennas at 150 GHz using Integrated Passive Devices (IPD) process provided by Win Semiconductors. First of all, a grounded coplanar waveguide T-resonator is realized to analyze the dielectric properties and loss tangent of the substrate used in the IPD process at 150 GHz, which provides the foundation for the following two studies dedicated for Terahertz Imaging/Communication System "
The first antenna design is a substrate integrated waveguide Horn Antenna at D band. In the proposed design, the opening of the SIW horn is moved backward from the chip edge so as to utilize the low-dielectric property of the silicon compound on the surface of the IPD substrate to smooth the impedance discontinuity between the IPD substrate and the air, and thereby guide the wave to radiation. In addition, a parallel metallic coupling structure is introduced to increase the bandwidth and a metallic antenna housing which dramatically shapes the radiation pattern is also applied to fulfill the end-fire radiation.
The second study is a vertically polarized end-fire substrate integrated waveguide antenna. The ideas of retreated SIW opening aperture, parallel metallic coupling structure, and metallic antenna housing are all applied in the second study. The main target of the second design is for size minimization. The antenna occupies a chip size of 985 um × 605 um, which is only 40% of that of the substrate integrated waveguide horn antenna in the first study. Due to its miniaturized size, it was selected as the antenna integrated in the terahertz imaging/communication system.
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