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研究生： 蘇亮綱
Liang-kang Su
論文名稱： 利用TEST SPC提升測試設備綜合效率及使用率(OEE)/(OEU)
A Study of Applying Test SPC to Promote Test Operation OEE and OEU
指導教授： 徐世輝
Shey-Huei Sheu
口試委員: 許總欣
Tsung-shin Hsu
陳坤盛
Kuen-sheng chen
學位類別： 碩士
Master
系所名稱： 管理學院 - 工業管理系
Department of Industrial Management
論文出版年： 2005
畢業學年度： 93
語文別： 中文
論文頁數： 75
中文關鍵詞： 隨批抽測(L/A) 、統計製程品管(SPC) 、設備綜合效率 (OEE) 、設備綜合使用率(OEU) 、出貨量(NUB)
外文關鍵詞： L/A(Lot Accetance), Overall Equipment Efficiency (OEE), NUB (Net Unit Built), Overall Equipment Utilization(OEU), SPC (Statistic Process Control)
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    • 本研究主要係針對具有因龐大的設備投資導致成本過高的半導體測試產業為研究對象，結合製程統計品管（SPC，Statistic Process Control）的觀念與作法來追求生產設備綜合效率的最佳化，進而在營運成本，產品測試品質上臻於完美的境界。

    本研究所考慮的參數有：設備綜合效率（OEE），（OEU），隨批品保抽測的百分比 （L/A %），出貨量（NUB，Net Unit Built），客戶風險指標 （DPPM，Defect Per Million of units）。其基本的作法是以有效地管理測前生產作業上的所有變異數，如操作人員紀律的要求，硬體設備重要參數的衡量管理，測式程式的完整性來取代測後的隨批品保抽測，因為一般而言，隨批品保抽測及壞品重測是兩個主耍的無附加價值的作業。

    本研究所有的資料均是由實際的生產記錄蒐集而來。透過真實的TEST SPC導入、實際的證驗 其對OEE的影響。

    The purpose of this research is about implementation of the SPC concept to fine tune the semi-conductor test operation for chasing the optimum Overall Equipment Efficiency, as well as Overall Equipment Utilization (OEU), then eventually achieve the state of art performance in both of cost & quality.

    Parameters mainly considered in this paper include: Overall Equipment Efficiency (OEE), Lot acceptance %, Net Unit Built (NUB),Defect Piece Per Million (DPPM). The essential idea is to control variables like human being discipline, equipment hard ware,test program integrity prior to test to substitute the QA lot acceptance which is performed at right after 100% final test. Capacity consumed for L/A check as well as retest for securing the yiled are believed as the two of major resources of Non Value Added operations.

    In this study, data are collected from the real operation informations. Real practices of Test SPC kick-off are demonstrated & assessed to show up the impact to OEE result.

    目 錄 中文摘要………………………………………………………………………..……….I 英文摘要………………………………………………………………………..………II 誌謝………………………………………………………………………..…………...III 目錄………………………………………………………………………..…………...IV 圖目錄………………………………………………………………………..……..….VI 表目錄………………………………………………………………………..……….VIII 第一章 緒論 1.1 研究背景與動機.........................................................................................................1 1.2 研究目的與範圍.........................................................................................................3 1.3 研究方法與步驟.........................................................................................................4 1.4 論文架構.....................................................................................................................5 第二章 文獻回顧與探討 2.1 國內半導體封裝測試業之發展情況.........................................................................6 2.2 研究對象...................................................................................................................15 2.3 生產效率文獻回顧...................................................................................................18 2.4 統計製程管制SPC...................................................................................................22 第三章 模式發展與建構 3.1 研究架構....................................................................................................................28 3.2 測試作業流程............................................................................................................29 3.3 半導體測試的成效分析............................................................................................36 3.4 問題分析及改善模式................................................................................................38 第四章改善模式的導入確認與評估.. 4.1 TEST SP的導入........................................................................................................46 4.2 測試OEE的驗證.....................................................................................................53 4.3 推廣及成效...............................................................................................................68 第五章 結論與未來展望 5.1 研究結論...................................................................................................................73 5.2 後續研究建議...........................................................................................................74 參考文獻..........................................................................................................................75 圖 目 錄 圖 1-1. 研究流程 ...........................................................................................................4 圖 2-1 T公司構裝技術的變革........................................................................................9 圖 2-2 T公司全球佈局..................................................................................................15 圖 2-3 T 公司營放類別分佈.........................................................................................16 圖 2-4 WECO RULE 1...................................................................................................23 圖 2-5 WECO RULE 2...................................................................................................24 圖 2-6 WECO RULE 3...................................................................................................25 圖 2-7 WECO RULE 4...................................................................................................25 圖 2-8 WECO RULE 5...................................................................................................26 圖 2-9 WECO RULE 6...................................................................................................27 圖 2-10 WECO RULE 7.................................................................................................27 圖 3-1 A567 測試機台配置..........................................................................................29 圖 3-2 測試機台各部連接組合....................................................................................29 圖 3-3 YOKOGAWA吸放式HANDLER大部解說....................................................31 圖 3-4 YOKOGAWA吸放式HANDLER運作流程....................................................32 圖 3-5重力式機台MT9308..........................................................................................32 圖 3-6標準測試作業流程.............................................................................................33 圖 3-7T公司主力測試機型L/A產能使用率...............................................................37 圖 3-8 隨批品保抽測（L/A）流程..............................................................................39 圖 3-9出貨水準AQL與客戶風險的關係...................................................................40 圖 3-10 T公司HPX產品顧客報怨統計......................................................................41 圖 3-11 Bin 值的SPC管制...........................................................................................44 圖 4-1 既有流程與TEST SPC流程的比較.................................................................46 圖 4-2 測試程式的控管示意圖....................................................................................47 圖 4-3 機台自動進料圖................................................................................................47 圖 4-4 機台和腦的連線圖............................................................................................48 圖 4-5 機台溫度設定示意圖........................................................................................48 圖 4-6 機台溫度上/下限圖...........................................................................................49 圖 4-7 機台高/低溫待機圖...........................................................................................49 圖 4-8 機台BIN設定圖...............................................................................................50 圖 4-9 測試示意圖........................................................................................................51 圖 4-10 機台確認材料圖..............................................................................................52 圖 4-11 測試過程圖......................................................................................................55 圖 4-12 材料處置圖......................................................................................................56 圖 4-13 重測數量圖......................................................................................................57 圖 4-14 中斷作業流程圖..............................................................................................58 圖 4-15 TESP SPC對ELETRA OEE的影響...............................................................59 圖 4-16 ELETRA TEST SPC 成功率的走勢...............................................................64 圖 4-17 ELETRA TEST SPC 失敗原因分析...............................................................64 圖 4-18 VLCT TEST SPC 失敗率原因分析................................................................66 圖 4-19 T公司TEST SPC 推廣計劃...........................................................................69 圖 4-20 通過率的目標設定..........................................................................................71 圖 4-21 TITL OEE TREND............................................................................................72 表 目 錄 表 3-1 T公司主力測試機種及功能..............................................................................30 表 3-2 OSCAR型號測試時間分析...............................................................................36 表 3-3測試L/A流程的變革.........................................................................................38 表 3-4 AC/DC Bin 輸出值的管控.................................................................................43 表 4-1 T公司主力測試機台可規避隨批品保抽測（Skip L/A） 的比率分析..........53 表 4-2 T公司產品別相對、於測試機台的DPPM分析..............................................54 表 4-3 VLCT主要型號TEST SPC的優選分析...........................................................54 表 4-4 TEST SPC 前 VLCT 121 成效分析..................................................................61 表 4-5 TEST SPC 後 VLCT 121 成效分析..................................................................61 表 4-6 TEST SPC 導入前 OEU 事故分析...................................................................62 表 4-7 TEST SPC 導入後 OEU 事故分析...................................................................62 表 4-8 TEST SPC 導入前損失的屬性分析....................................................................63 表 4-9 TEST SPC 導入後損失的屬性分析....................................................................63 表 4-10 VLCT測試機台測試的重要型號，TEST SPC通過率表現...........................66 表 4-11 VLCT重要型號測試時間分析..........................................................................67 表 4-12 T公司TEST SPC 推廣計劃.............................................................................69 表 4-13 VLCT TEST 重要型號TEST SPC 轉換計劃..................................................70 表 4-14 通過率的資料....................................................................................................71

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    [7] Texas Instruments OEE / OEU training material (2004)

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