近年來隨著科技技術的不斷進步，相關的應用不斷的推陳出新，電子終端產品對於IC的要求也日益提升，除了操作速度的提升、低功耗的要求，更希望能將IC做的愈來愈小，用以縮小電子產品的體積。整個半導體產業鏈，也因為應用層面廣泛，已不是過往單一IDM大廠在有限的時間下，就可以獨立完成一個成功的產品，此篇論文將以群聯電子為例，了解其如何藉由異業結盟—與研發不同IC之設計公司結盟，將1+1大於2的合作模式發揮完善，並讓合作結果發酵，促使日後可共生共榮。本研究中也將針對個案公司做進一步的研究與探討，了解合作結盟後所帶來的助益，以及對其未來發展導向之影響。
群聯電子 (Phison) 從西元2000年創業開始，期間歷經了幾次經營危機，個案公司的執行長靈活地運用了一些合作聯盟的策略，幫助個案公司渡過了危機，並開展出近年來的傲人研發成果及市場銷售表現，更從第一顆PCIe Gen4 SSD推出後，開始與不少競爭對手拉開更具優勢的距離。在本研究將透過商業經營分析方式，探討策略聯盟所帶來的助益。主要的研究分析方式，會從影響個案公司的內部因素、外部因素、商業模式、策略方針、策略聯盟來做探討，藉由這些分析方法及相關數據的蒐集，同時考慮整個NAND Flash產業之發展，用以研究未來新的應用市場及發展機會。本研究中也將為個案公司繪製一份近三年可使用的技術藍圖，予以長期發展計劃之建議。最後，在本研究中將總結此範例公司之優、劣勢分析，及其未來競爭力的分析與發展建議，並期許本研究之內容及分析結果，可做為日後其它相關研究的參考，更應用在不同的產業上。

In recent years, with the continuous evolution of technology, related applications are constantly innovating. The requirements for ICs in electronic end products are also increasing day by day. In addition to the improvement of operating speed and the demand for low power consumption, it is hoped that ICs can be further enhanced. As electronic products become smaller, IC is needed to reduce their size. The entire semiconductor industry chain, due to its wide range of applications, is no longer a situation where a single IDM giant can independently complete a successful product in a limited time. This paper will take Phison as an example to understand how it forms alliances with different IC design companies through cross-industry partnerships, leveraging a collaborative model where 1+1 is greater than 2, allowing the collaborative results to ferment and promote mutual prosperity in the future. In this study, a further study and discussion will be conducted on the case company to understand the benefits brought by collaboration alliances and their impact on future development directions. Phison Electronics Corporation (Phison) started its business in the year 2000. Throughout the years, the company has faced several operational crises. The CEO of the company has flexibly utilized strategic alliances to help the company overcome these crises. As a result, Phison has achieved impressive research and development outcomes and market sales performance in recent years. Since the launch of the first PCIe Gen4 SSD, Phison has been able to establish a more competitive advantage over many of its rivals. This study will analyze the benefits brought by strategic alliances through a business management perspective. The main research and analysis method will discuss the internal factors, external factors, business models, strategic policies, and strategic alliances that affect the individual case company. Through these analytical methods and collected data results, while considering the development of the entire NAND Flash industry, and use for new future application markets and development opportunities. This study will also draw up a technology blueprint for the case company that can be used for the next three years, providing recommendations for long-term development plans. Finally, this research paper will summarize the strengths and weaknesses analysis of this sample company, as well as the analysis of its future competitiveness and development recommendations. It is hoped that the content and analysis results of this research can serve as a reference for future research and be applied in different industries.

中文文獻
HSU, Y.-P. (107). 記憶體模組公司策略聯盟之個案研究 國立臺灣科技大學].
林巖. (2021). 因應5G應用市場需求探討PC產業相關技術策略研究 國立台灣科技大學].
許小婷. (2018). 車用電子產業分析 國立台灣大學].
陳繼勻. (2017). 記憶體模組廠在智慧城市應用中的產品與技術發展之個案研究 [中文, 國立台灣科技大學].
蔡美倫. (2006). IC設計產業之廠商定位策略分析 國立臺灣科技大學].

英文文獻
JIANG, X., & FU, L. (1982). FEASIBILITY STUDY.
MEHENDALE, M., & RAO, J. (2008). INTRODUCTION TO SYSTEM-ON-CHIP (SOC). IN R. R. TUMMALA (ED.), SYSTEM ON PACKAGE: MINIATURIZATION OF THE ENTIRE SYSTEM (1ST EDITION ED.). MCGRAW-HILL EDUCATION. HTTPS://WWW.ACCESSENGINEERINGLIBRARY.COM/CONTENT/BOOK/9780071459068/CHAPTER/CHAPTER2
VERNON, R. (1979). THE PRODUCT CYCLE HYPOTHESIS IN A NEW INTERNATIONAL ENVIRONMENT. OXFORD BULLETIN OF ECONOMICS AND STATISTICS, 41(4), 255-267.

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