研究生: |
HUYEN-lynh DUONG HUYEN-lynh DUONG |
---|---|
論文名稱: |
應用於熱塑性材料微流體晶片之新型溶劑黏合方法 A Novel Solvent Bonding Method for Thermoplastic Microfluidic Chips |
指導教授: |
陳品銓
PIN-CHUAN CHEN |
口試委員: |
王孟菊
Meng-Jiy WANG 董亦鍾 Yi-Chung Tung |
學位類別: |
碩士 Master |
系所名稱: |
工程學院 - 機械工程系 Department of Mechanical Engineering |
論文出版年: | 2016 |
畢業學年度: | 104 |
語文別: | 英文 |
論文頁數: | 76 |
中文關鍵詞: | Bondingforthermoplasticsubstrates 、Ethanolsolventbonding 、Bondingofmicrofluidicchips |
外文關鍵詞: | Bonding for thermoplastic substrates, Ethanol solvent bonding, Bonding of microfluidic chips |
相關次數: | 點閱:233 下載:18 |
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This thesis presents a novel solvent bonding method aimed at improving the strength of bonds formed between PMMA/PMMA, PMMA/PC, and PMMA/PET thermoplastic substrates. A spin-coating procedure was applied as an alternative to the dropping method for the distribution of ethanol solutions on thermoplastic substrates. Initial experiments demonstrate the efficacy of this method in preventing evaporation of solvent and producing a uniform, bubble-free layer of solvent between thermoplastic substrates. Two groups of experiments in order to characterize the influence of solvent uniformity and interfacial roughness on bonding strength were conducted. In all of the experiments, microchannels milled on the surface of PMMA substrates were sealed with PMMA, PC, or PET substrates. Leakage tests, cross-sectional imaging using SEM, and burst pressure tests were then used to quantify the performance of bonding in the experiments. In one set of experiments, at least nine bars of bonding strength were achieved. Further investigations also demonstrated that higher interfacial roughness increases the failure rate of bonds, shortens the life of bonds, and reduces overall bonding strength.
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