本研究之目的係利用二極體固態雷射，應用於QFN(Quad Flat No-lead)封裝材料之最適化切割參數研究，在雷射切割QFN路徑中包含2種材料，一種是epoxy另一種為銅。針對此兩種材料之切割方式，本研究運用田口實驗分析法及變異數分析來獲得較佳的雷射切割參數組合，並找出參數對品質特性的重要性，同時提供一種判別雷射切割品質之量化方式。
在切割5x5 QFN 樣品之九種不同參數實驗中其最適合參數組合為電流強度29A、頻率2 kHz(約8.9W )及切割速度為1.5 mm/sec。經計算結果得到其影響雷射切割品質之主要控制因子順序為(a)雷射頻率( 50.722﹪)、(b)切割速度( 24.529﹪)及(c)雷射能量( 22.307﹪)。
因此在系統參數尋找方法中能提供一個實際有效的參考方向於切割QFN Packaging的參數選擇，希望此研究能對雷射應用於其他相關產業中有所的幫助。

The purpose of this search is to study the optimal cutting parameters of applying a solid diode laser for cutting QFN (Quad Flat No-lead) packages. The Laser cutting path of a QFN package includes two different materials, one is epoxy and the other is copper circuit-pad bonding epoxy. To cut those two kinds of material, we apply the Taguchi’s matrix-experiment method and Analysis of Variance (ANOVA) to obtain the optimal combinatorial parameters, which can help us examine the relationship between the cutting quality and the laser parameters. At the same time, a quantified manner to examine the laser cutting quality for a QFN package was also proposed.
During the experiment of cutting several 5×5 QFN samples with nine kinds of parameters, the optimal parameters were obtained as 29A for driving current, 2 kHz (8.9W) for laser frequency, and 1.5 mm/sec for cutting speed. The experimental results show that the main factors of affecting the cutting quality are（a）laser frequency(50.722%), （b）cutting speed(24.529%), and （c）laser driving current(22.307%).
The systematic parameter-searching rules may give practical guides in the parameter design for cutting a QFN package. I hope this reseach will be useful for laser applications in other industry fields.

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