本研究利用化學插層剝離法與自由基聚合法剝離六方氮化硼(hexagonal boron nitride, h-BN)之片層，製備氮化硼奈米片(BNNSs)，解決目前製備氮化硼奈米片之尺寸無法控制、製程複雜等問題，達到尺寸的控制與製程簡單。將h-BN、BNNSs及球型氧化鋁(Al2O3)應用於矽橡膠之填充，製備導熱矽膠墊(Thermal Conductive Pad)，分別探討單一與複合粒子導熱性能與力學性能的差異性；本研究分為BNNSs製備、導熱矽膠墊製備之最佳化參數設計及導熱矽膠墊實驗探討三個部分進行討論，利用複合粒子與填充奈米填料的方法，解決單一填料之導熱性能受限的問題，達到降低填料狀態下，導熱矽膠墊能具有高導熱與高力學性能之目的。
第一部分為氮化硼奈米片的製備，原料組成為六方氮化硼(h-BN)，插層劑N,N二甲基丙烯酰胺(N,N-Dimethylacrylamide, DMAA)提供銨鹽離子進行插層、引發劑偶氮二異丁腈(Azobisisobutyronitrile, AIBN)在熱環境中與插層劑引發自由基聚合反應，促使分子增長而達到片層剝離的效果。利用X光繞射分析儀(X-ray Diffractometer, XRD)與場發射穿透式電子顯微鏡(Field Emission Transmission Electron Microscopy, FE-TEM)分析BNNSs層間距離與晶相結構，場發射掃描式電子顯微鏡(Field-Emission Scanning Electron Microscope, FE-SEM)分析BNNSs片層厚度，研究結果顯示，添加AIBN 0.1phr、反應時間24小時，層間距離可達0.35nm，片層厚度達到5nm，且BNNSs經化學插層剝離後其晶型結構未被破壞。
第二部分為導熱矽膠墊的製備。將第一部分之BNNSs填充至矽橡膠中，佐證BNNSs之高導熱性，經實驗結果證實，單一填充BNNSs較填充h-BN更能有效提升矽橡膠的熱傳導性能及力學性能，因此本研究加入Al2O3，利用複合粒子的方法，製備複合粒子之導熱矽膠墊，解決提升單一填料之導熱性能受限的問題。使用熱傳導分析儀與萬能拉力試驗機進行測試，研究結果顯示，填充Al2O3 60wt%與BNNSs 20wt%，導熱係數及拉伸強度分別達到5.23W/mK與102 Psi，證實本研究製備之導熱矽膠墊在降低粉體填充量的狀態下，能兼具高導熱及高力學性能。
第三部分為導熱矽膠墊製程最佳化參數設計與實驗分析驗證，利用田口方法(Taguchi method)與本質轉換選擇消去法(Elimination et choice translating reality, ELECTRE)進行實驗規劃，將繁雜的實驗次數及成本降到最少，探討每一組控制因子對導熱墊品質特性的影響，尋找產品最佳化製程參數組合，進行導熱矽膠墊之物性測試，測得導熱矽膠墊之導熱係數與拉伸性能分別達5.14W/mK及102 Psi。證實填充BNNSs可有效提升導熱與力學性能，達到市售導熱矽膠墊使用上之需求規範。

In this study, the layers of hexagonal boron nitride (h-BN) were stripped by chemical intercalation and free radical polymerization to prepare boron nitride nanosheets (BNNSs) to solve the current preparation of boron nitride nanosheets. The size of the nano tablets cannot be controlled, the process is complicated, and the like, and the achieve size control and the process are simple. The h-BN, BNNSs and spherical alumina (Al2O3) were applied to the filling of the silicone rubber to prepare the Thermal Conductive Pad. The difference between the thermal conductivity and the mechanical properties of the single and composite particles was discussed. The optimal parameters design of BNNSs preparation, thermal conductivity silicone pad preparation and thermal conductivity silicone pad experiment are discussed in three parts. The method of composite particles and filled nanofiller is used to solve the problem of limited thermal conductivity of single filler. In the state, the thermal conductive rubber pad can have the purpose of high thermal conductivity and high mechanical properties.
The first part is the preparation of boron nitride nanosheets. The raw material composition is h-BN, and the intercalation agent dimethyl acrylamide (DMAA) provides ammonium salt ions for intercalation. The Azobisisobutyronitrile (AIBN) initiates a radical polymerization reaction with the intercalation agent in a thermal environment to promote molecular growth and achieve the effect of exfoliation. XRD and FE-TEM were used to analyze the interlayer distance and crystal structure of BNNSs. FE-SEM analysis of BNNSs sheet thickness, the results show that adding AIBN 0.1 phr, reaction time of 24 hours, interlayer distance of up to 0.35 nm, sheet thickness of 5 nm, and BNNSs chemical intercalation After the peeling, its crystal structure was not destroyed.
The second part is the preparation of a thermal conductive rubber pad. The first part of BNNSs was filled into ruthenium rubber to prove the high thermal conductivity of BNNSs. The experimental results confirmed that single-filled BNNSs can improve the thermal conductivity and mechanical properties of silicone rubber more than h-BN. Therefore, Al2O3 was added in this study. The method of composite particles is used to prepare a thermal conductive silicone pad of composite particles, which solves the problem of improving the thermal conductivity of a single filler. The results show that 60% by weight of Al2O3 and 20% by weight of BNNSs, thermal conductivity and tensile strength of 5.23 W/mK and 102 Psi, respectively, confirm that the thermal conductive mat prepared in this study is It can combine high thermal conductivity and high mechanical properties under the condition of reducing the powder filling amount.
The third part is the optimization parameter design and experimental analysis of the thermal conductive silicone pad process. The Taguchi method and the Elimination et selection translating reality (ELECTRE) are used for experimental planning, and the number of complicated experiments and the cost is reduced to the minimum. The influence of each control factor on the quality characteristics of the thermal pad is discussed. The combination of the optimized process parameters is found, and the physical properties of the thermal pad are measured. The thermal conductivity and tensile properties of the thermal pad are measured. 5.14 W/mK and 102 Psi. It is confirmed that the filling of BNNSs can effectively improve the thermal conductivity and mechanical properties, and meet the demand specification for the use of commercially available thermal conductive silicone pads.

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