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研究生: 許涵喻
Han-yu Hsu
論文名稱: 內容定址記憶體之高速測試與良率提昇技術
High-speed Testing and Yield Enhancement Techniques for Content-addressable Memories
指導教授: 呂學坤
Shyue-Kung Lu
口試委員: 李建模
none
李進福
none
黃錫瑜
none
王乃堅
none
學位類別: 碩士
Master
系所名稱: 電資學院 - 電機工程系
Department of Electrical Engineering
論文出版年: 2011
畢業學年度: 99
語文別: 英文
論文頁數: 68
中文關鍵詞: 內容定址記憶體串列測試的錯誤平行測試的錯誤區塊層級
外文關鍵詞: content-addressable memories (CAM), serial testable faults (STFs), parallel testable faults (PTFs), block-based
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  • 本篇提出內容定址記憶體 (CAMs) 的高速測試技術。根據 CAM 陣列的故障模型對電路所造成之影響,我們將故障模型分成兩類-串列測試的錯誤 (STFs) 和平行測試的錯誤 (PTFs),對 PTFs 而言 (例: stuck-mismatched fault),CAM 中所有的行可同時進行測試,然而,STFs 卻需一行一行循序的進行測試,所以 STFs 在測試時間中佔有很大的比例,當 CAM 的行數目增加時,測試時間就會相對的增加,為了解決這問題,我們將 CAM 陣列切割成 b 個row bank,並在每個row bank加入切換模組 (steering module),steering module 用來切換平行測試模式 (parallel test mode) 和循序測試模式 (serial test mode),所以 b 個 STFs 可同時進行測試,
    我們並將傳統的測試演算法加以平行化,並提出針對 BCAM 與 TCAM 提出對應之平行測試演算法,這技術可明顯地改善測試速度。在所提出的高速測試技術中,b 個row bank共用一個內建自我測試電路,所以這可將內建自我測試電路的面積最小化。我們實現了一個128 × 128 具有高速測試技術的二元內容定址模式記憶體 (BCAM) 陣列。
    另外為了提高內容定址模式記憶體的良率,我們也提出用區塊層級 (block level) 為單位的替換技術,例如當 defect density = 0.1時,內容定址模式記憶體切割成 16 個列區塊,每個列區塊包含兩個備用的列區塊 (row block),其良率約 70.68%。實驗結果顯示在 512 × 512 BCAM 陣列中測試時間的減少大概有 20.08%,在同樣位元大小的三元內容定址模式記憶體 (TCAM) 中,使用 Ttcam2 演算法測試約 18.75%。本篇論文同時分析額外硬體成本、良率與可靠度改善之情形,從分析結果中得知如果 CAM 陣列有較多的行數目,額外面積就幾乎可以忽略。


    High-speed testing techniques and yield enhancement techniques for content-addressable memories are proposed in this thesis. According to the fault effects of the widely used fault models for CAM arrays, the fault models can be categorized into two types-serial testable faults (STFs) and parallel testable faults (PTFs). For PTFs (e.g., stuck-mismatched faults), all CAM columns can be tested in a parallel manner. Alternatively, STFs can only be tested sequentially column by column. Therefore the test time is dominated by STFs. This situation is getting worse if the number of columns increases. To cure this dilemma, the CAM array is first partitioned into b row banks and a steering module is added for each row block. The steering module switches between the parallel test mode (for PTFs) and the serial test mode (for STFs). Therefore, b STFs can be tested at the same time. This will greatly decrease the overall test time. For the proposed techniques, the BIST circuit can be shared by b row banks. Therefore, the area of the BIST area will be minimized.
    As the density and capacity of CAMs increase, it is more prone to suffer from defects. Therefore, the fabrication yield will be very low. It is inevitable to seek for efficient fault-tolerance techniques for improving the yield of CAMs. In this thesis, instead of replacing faulty cells with an entire CAM word as used in the conventional techniques, the block-based approach is presented. Redundant columns are not added here for simplicity. According to simulation results, the hardware overhead is 1.31% for a 1024 × 1024-bit CAM array. We also compare the repair rates and reliabilities of our approach with previous fault-tolerant techniques. It is also found that our approach outperforms their results.

    Abstract (In Chinese) Abstract Acknowledgement Content List of Figures List of Tables Chapter 1 Introduction 1.1 Motivation and Background 1.2 Organization Chapter 2 Review of Binary Content- Addressable Memories and Ternary Content-AddressableMemories 2.1 Typical CAM Architecture 2.1.1 Structure of the BCAM Cell 2.1.2 Structure of the TCAM Cell 2.2 Fault Models 2.2.1 Fault Models of BCAM 2.2.2 Fault Models of TCAM 2.3 March-Like Test Algorithms 2.3.1 Test Algorithms for the BCAM’s 2.3.2 Test Algorithms for TCAM’s Chapter 3 Design-for-Testability Techniques for High-Speed Testing of CAMs 3.1 Classification of Fault Models 3.2 Divided CAM Structure for High-Speed Testing of CAMs 3.3 High-Speed Test Algorithms 3.3.1 BCAMs 3.3.2 TCAMs 3.4 An Example of the Proposed High-Speed Test Algorithms 3.5 Built-In Self-Test Architectures for BCAMs Chapter 4 Yield and Reliability Enhancement Techniques for CAMs 4.1 Block-Level Redundancy Techniques 4.2 Built-In Self-Repair Architectures 4.3 Generalized Redundancy Architectures 4.4 Reliability and Yield Analysis Chapter 5 Experimental Results 5.1 Cell-based Design Flow 5.2 Test time complexity 5.2.1 BCAM 5.2.2 TCAM 5.3 Hardware overhead for testable design of CAMs 5.3.1 BCAM 5.3.2 TCAM Chapter 6 Conclusions and Future Works 6.1 Conclusions 6.2 Future works Reference

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