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研究生: 陳怡如
I-Ju Chen
論文名稱: TIR透鏡之LED晶粒成像與黃圈現象分析
Analysis of LED Die-Imaging and Yellow Hue Phenomena in TIR Lens
指導教授: 黃忠偉
Allen Jong-Woei Whang 
口試委員: 陳省三
Sing-San Chen
胡能忠
Neng-Chung Hu 
蕭弘清
Horng-Ching Hsiao
趙涵捷
Han-Chieh Chao
學位類別: 碩士
Master
系所名稱: 電資學院 - 光電工程研究所
Graduate Institute of Electro-Optical Engineering
論文出版年: 2008
畢業學年度: 96
語文別: 中文
論文頁數: 89
中文關鍵詞: 發光二極體二次光學設計晶粒成像黃圈現象色差
外文關鍵詞: LED, Secondary Optical Design, Die-Imaging Phenomenon, Yellow Hue Phenomenon, Color Difference
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發光二極體光學產品常需要二次光學元件來搭配,設計出產品所需求的光學特性,因此二次光學元件設計日益受到人們重視。二次光學元件設計現今存在發光二極體晶粒成像問題和黃圈現象。本論文將針對上述兩點問題作探討,二次光學元件部份以TIR Lens為基礎架構,驗證光路徑屬點對點和點對面的兩款透鏡和發光二極體晶粒成像問題之關係,透過光學軟體TracePro模擬並進行分析和開模量測。由於發光二極體本身製程關係,所以搭配二次光學元件衍生的黃圈現象是不可避免的,本文利用色彩學中的色差概念來給予黃圈定量,建立一套簡易判斷黃圈嚴重程度的方法。


For various applications designers often use secondary optical elements of LEDs to make proper adjustments of the optical properties. Therefore secondary optical design is more important. Secondary optical designs for LEDs have to deal with Die-Imaging and Yellow Hue phenomena. In this literature signal optical element LED with a TIR Lens, issued. First part is focus on the relationship between the die-imaging phenomenon and the TIR lens design of point-to-point and point-to-plane. Producing yellow hue phenomenon in secondary optical design is unavoidable because the LEDs with defects in the manufacture. Our goal is to simulate a TIR lens with a white LED by TracePro. For identifying the seriousness of yellow hue phenomenon we via color difference method. Set up a set of simple and easy method to make a diagnosis.

摘要 Abstract 致謝 論文目錄 圖目錄 表目錄 第一章 緒論 1.1 前言 1.2 研究背景與動機 1.3 研究目的 1.4 論文架構 第二章 文獻回顧 2.1 高功率白光LED介紹 2.2 LED封裝對光學特性之改變 2.3 LED的二次光學元件簡介 2.4 LED晶粒成像問題和黃圈現象 2.5 LED和二次光學元件的現況和光學設計問題 2.6 本章小結 第三章 基礎理論 3.1 光度學單位定義 3.1.1 CIE 127-The Measurement of LEDs量測規範 3.1.2 積分球(Integrating sphere) 3.2 色彩學概念 3.3 本章小結 第四章 LED二次光學元件 - TIR Lens設計 4.1 設計流程 4.2 LED光源模擬 4.3 TIR Lens設計 4.3.1 設計全反射面之曲率 4.3.2 設計入光面和出光面曲率組合 4.4 本章小結 第五章 TIR Lens搭配LED模擬結果 5.1 LED晶粒成像的光路徑分析 5.2 黃圈現象分析 5.3 成品量測驗證 5.4 本章小結 第六章 結論與未來展望 參考文獻

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