本文利用元素矽水解法合成無機二氧化矽奈米顆粒，並可以有效控制其顆粒大小，亦探討在苯乙烯/乙烯基酯樹脂/特用添加劑三成份系統之聚合固化反應動力、玻璃轉移溫度及X光散射特性之影響，其特用添加劑，分別為 (1)反應性微膠顆粒 (2)氧化石墨烯 (3)熱脫層氧化石墨烯 (4)高分子接枝之熱脫層氧化石墨烯 (5)矽烷接枝之氧化石墨烯 及 (6)矽烷接枝之二氧化矽。

吾人利用動態光散射儀測量二氧化矽奈米顆粒的粒徑分布，以及由X-ray散射儀鑑定 (1)氧化石墨烯 (2) 熱脫層氧化石墨烯 (3)高分子接枝之熱脫層氧化石墨烯 (4)矽烷接枝之氧化石墨烯之微結構，以及(5) 苯乙烯/乙烯基酯樹脂之稀薄溶液的環動半徑，亦使用微示差掃描熱卡分析儀及傅立葉轉化紅外線光譜儀，測量苯乙烯/乙烯基酯樹脂雙成份系統與苯乙烯/乙烯基酯樹脂/特用添加劑之三成份系統在聚合固化過程中的反應動力，以及使用落球式黏度計測量苯乙烯/乙烯基酯樹脂/特用添加劑之三成份系統的黏度。根據Takayanagi機械模式，苯乙烯/乙烯基酯樹脂/特用添加劑聚合固化系統其在每一相區的玻璃轉移溫度，吾人亦使用動態機械分析儀測定之。

In this study, silica nanoparticles(SNP) with a diameter ranging from15 nm to 60 nm were synthesized by size-controllable hydrolysis of elemental silicon. The effects of six other additives, including (1) reactive microgel particles, (2)graphene oxide,(3)thermally reduced graphene oxide, (4) polymer-grafted thermally reduced graphene oxide, (5) silane-grafted graphene oxide, and (6) silane-grafted silica nanoparticles on the cure kinetics, glass transition temperature and X-ray scattering characteristics for the styrene(St)/vinyl ester resin(VER)/special additives ternary systems after the cure have also been investigated.

The particle size distribution of silica nanoparticles was measured by dynamic light scattering (DLS) samples such as and identified (1) graphene oxide, (2) thermally reduced graphene oxide, (3) polymer-grafted thermally reduced graphene oxide, (4) silane-grafted graphene oxide, and (5) the VER in dilute St/VER binary system were also characterized by X-ray scattering methods (SAXS and WAXS).

Moreover, the reaction kinetics for the St/VER/special additive ternary system during the cure was measured by differential scanning calorimetry (DSC) and Fourier transform infrared spectroscopy (FTIR). The viscosity of the St/VER/special additive ternary system was measured by using a falling ball viscometer. Finally, based on the Takayanagi mechanical models, the glass transition temperature in each region of the cured samples for St/VER/special additive ternary system has been measured by dynamic mechanical analysis (DMA).

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