電子與半導體產業中使用了大量的微型鑽針進行印刷電路板的微細鑽孔作業。為確保鑽針品質，鑽針芯厚特徵的量測為品管檢驗中的關鍵項目。由於傳統的人工檢測費時且容易造成量測上的誤差，因此本研究提出利用機器視覺技術進行破壞性鑽針芯厚量測及以雷射量測儀進行破壞性檢測二種方法。破壞性的檢測程序是先透過影像模組對鑽針進行定位，而後利用鑽針研磨砂輪將鑽針磨至待檢測的截面；接著再將鑽針移動到影像檢測模組進行鑽針截面影像之擷取，最後搭配影像處理與芯厚量測計算方法得該截面之鑽針芯厚值。實踐此方法之硬體系統包含砂輪模組、運動平台、定位視覺模組及芯厚檢測視覺模組等部分，並透過電路控制整合各模組的動作流程。
基於執行上述方法須在破壞鑽針的情況下進行，在若干場合不容易滿足業者希望有效提昇產能的需求，因此本研究亦提出一種非破壞性的芯厚量測方法。此方法利用非接觸式的雷射測微儀量測鑽針外徑值並觀察軸心偏擺，而後配合雷射共焦儀量測鑽針鑽槽深度值，最後經計算並補償偏心量後得到鑽針芯厚值。非破壞性雷射量測系統包含量測與定位取放機構模組、雷射量測模組資料擷取模組等部分，並透過電路控制整合各模組的動作流程。
研究中使用標準鑽針進行實驗，數據資料顯示破壞性量測系統之重現性可達±0.0012mm，而在相同截面與工具顯微鏡的量測值最大差距僅0.0026mm。而非破壞性量測系統之重現性則可達±0.0018mm，而在相同截面與工具顯微鏡的量測值最大差距僅0.0010mm。上述的結果驗證本研究成功地完成兩項自動化檢測系統的開發。

Nowadays, the electronic and semiconductor industries use numerous micro-drills to produce tiny holes on printed circuit boards. Since the web thickness plays a key role to determine the rigidity and chip-removal ability of a micro-drill, the measurement of the web thickness is essential to ensure the quality of products. In order to improve the quality and efficiency of the conventional human inspection process, this work develops two automatic inspection methods based on the technologies of machine vision and laser measurement. In the proposed measuring procedures, the drill to be examined is first positioned at a specific location, which is confirmed by the images from one of optical modules. Next, the drill’s body is ground axially from the tip to a pre-defined cross-section. Another image of the drill’s cross section is then grabbed by the second optical device. Later, the web thickness can be determined through a series of image processing and numerical operations. This integrated destructive measuring system consists of a machine vision module, a grinding module and a two-axis-driven micro-drill fixture.
Because the destructive measuring system previously discussed may not be applicable in some circumstances, a non-destructive measuring method to determine the web thickness of micro-drills has been also developed by this research. Based on the second method, a laser confocal displacement meter (LCDM) is employed to measure the diameter and run-out error of the drill at first. Then, a laser micro-gauge (LMG) is used to scan the profile of the drill and the dual cross-sectional flute depths can be measured. Finally, the web thickness was determined after the amount of the run-out error has been excluded. This integrated laser inspection system includes a LMG, a LCDM and a two-axis-driven micro-drill fixture.
Three types of sample micro-drills are examined by both proposed measuring methods. The experimental data shows that the repeatability of web thickness measurement is approximately equal to ±0.0012mm in the destructive measuring system and ±0.0018mm in the non-destructive measuring system. The results indicate that the systems developed are able to undertake the web thickness measurements for certain micro-drills.

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