此論文提出利用微機電製程製作的可調式數位電容陣列，將其並聯至 LTE
行動裝置的天線開關模組輸出端匹配網路，讓此輸出端匹配網路的阻抗匹配值可
以依據不同頻段做調整，降低每個頻段的消耗電流。此可調式數位電容陣列具備
了高線性度，低插入損耗，高 Q 值的優點，相當適合應用在射頻前端電路中。
而且現今的 LTE 頻段已經相較 3G 時代多出許多，但是在傳統的射頻前端架構限
制下，天線開關模組輸出端仍然只能維持一組匹配網路，為了讓匹配網路能適用
於每個頻段，此匹配網路的阻抗匹配值通常只能維持在 50Ω，因此將可調式數
位電容陣列並聯入此匹配網路中，形成可調式匹配網路。接著再依據不同頻段而
調整阻抗匹配值，可提升測詴頻段的附加功率效率與改善線性度。依據測詴頻段
的不同，消耗電流改善 2.08%～5.64%。在線性度方面，依據測詴通道的不同可
改善相鄰通道洩漏比例 0.97dB～3.6dB。依據測詴結果，此可調式匹配網路確實
可以針對各測詴通道與測詴頻段的不同，改善其消耗電流與線性度。

In this thesis, we present a method which shunts a digital tunable capacitor arrays in
the matching network at the antenna switch module output port. This digital tunable
capacitor arrays has the advantage of low insertion loss, high quality factor and high
linearity. It is suitable to be a RF front-end component.
Nowadays the LTE frequency bands are more than 3G frequency bands but we still
use only one matching network at the antenna switch output. The impedance in this
matching network is close to 50ohm, so we put a digital tunable capacitor arrays into
this matching network and make it to be a tunable matching network. We can
optimize the impedance matching network on each operation frequency bands. We
can improve the power-added efficiency and linearity. We get 2.08% ~ 5.64%
improvements on the current consumption on each operation frequency bands. In the
linearity, we got 0.97dB ~ 3.6dB improvements on the adjacent channel leakage ratio
on each operation frequency bands. Referring to the test results, this tunable matching
network is a workable solution for improving the current consumption and linearity in
each operation frequency bands.

[1] 3GPP TS 36.101 version 15.2.0 Release 15, “3rd Generation Partnership Project; Technical Specification Group Radio Access Network; Evolved Universal Terrestrial Radio Access (E-UTRA); User Equipment (UE) radio transmission and reception”.
[2] 3GPP TS 36.306 version 14.2.0 Release 14, “LTE; Evolved Universal Terrestrial Radio Access (E-UTRA); User Equipment (UE) radio access capabilities”.
[3] 3GPP TR 36.807 V10.0.0 (2012-07), “3rd Generation Partnership Project; Technical Specification Group Radio Access Network; Evolved Universal Terrestrial Radio Access (E-UTRA); User Equipment (UE) radio transmission and reception”.
[4] J. Jeon, J. Oh, J. Jung, “Multimode Multiband Power Amplifier Module Integrated Duplexer for Mobile Applications”, IEEE International Symposium on Radio-Frequency Integration Technology, pp. 110-112, September 2017.
[5] F. M. Ghannouchi, M. S. Hashmi, Load-Pull Techniques with Applications to Power Amplifier Design, Springer, 2012.
[6] A. Eroglu, Introduction to RF Power Amplifier Design and Simulation, Fort Wayne, CRC Press, 2015.
[7] B. Razavi, RF Microelectronics, Upper Saddle River, NJ, Prentice Hall, 2012.
[8] A. Raffo, G. Crupi, Microwave Wireless Communications, Amsterdam, ELSEIVER, 2016.
[9] B. Sahu, G. A. Rincon-Mora, “A High Efficiency, Linear RF Power Amplifier With a Power-Tracking, Dynamically Adaptive Buck-Boost Supply”, IEEE Transactions on Microwave Theory and Techniques, pp. 112-120, January 2004.
[10] S. Jin, K. Moon, M. Kwon, B. Kim, “Linearization of CMOS Cascode Power Amplifiers Through Adaptive Bias Control”, IEEE Transactions on Microwave Theory and Techniques”, pp. 4534-4543, November 2013.
[11] D. Kang, D. Kim, J. Choi, J. Kim, Y. Cho, B. Kim, “A Multimode/Multiband Power Amplifier With a Boosted Supply Modulator”, IEEE Transactions on Microwave Theory and Techniques, pp. 2598-2608, September 2010.
[12] J. S. Paek, Y. S. Youn, J. H. Choi, D. S. Kim, J. H. Jung, Y. H. Choo, S. J. Lee, S. C. Lee, T. B. Cho, I. Y. Kang, “An RF-PA Supply Modulator Achieving 83% Efficiency and -136dBm/Hz Noise for LTE-40MHz and GSM35dBm Applications”, IEEE International Solid-State Circuits Conference, pp. 354-355, February 2016.
[13] M. Mukherjee, Advanced Microwave And Millimeter Wave Technologies: Semiconductor Devices, Circuits and Systems, In-Teh, 2010.
[14] I. J. Bahl, Fundamentals of RF and Microwave Transistor Amplifiers, John Wiley & Sons, 2009.
[15] R. Ludwig, P. Bretchko, RF Circuit Design Theory and Applications, Upper Saddle River, Prentice Hall, 2000.
[16] M. Mukherjee, Advanced Microwave And Millimeter Wave Technologies: Semiconductor Devices, Circuits and Systems, In-Teh, 2010.
[17] G. M. Rebeiz, RF MEMS THEORY, DESIGN and TECHNOLOGY, John Wiley & Sons, 2003.
[18] T. Vähä-Heikkilä, MEMS tuning and matching circuits, and millimeter wave on-wafer measurements, Espoo, VTT, 2006.
[19] V. K. Varadan, K. J. Vinoy, K. A. Jose, RF MEMS and Their Applications, John Wiley & Sons, 2003.
[20] C. Gamlath, E. Arabi, K. Morris, M. Beach, “A 0.4-6GHz CMOS Tunable Load with Independent Q Tuning for 5G Filtering Applications”, Active and Passive RF Devices, pp. 1-5, February 2018.
[21] H. Wang, A. Anand, X. Liu, “A Miniature 800-1100-MHz Tunable Filter with High-Q Ceramic Coaxial Resonators and Commercial RF-MEMS Tunable Digital Capacitors”, IEEE 18th Wireless and Microwave Technology Conference, pp. 1-3, May 2017.
[22] N. Mohabbatian, E. Abbaspour-Sani, M. Ghasemzadeh, “An Electrostatic Tunable RF MEMS Capacitor with Improved Quality Factor”, 22nd Iranian Conference on Electrical Engineering, pp. 422-427, January 2015.
[23] Q. Gu, J. R. De Luis, “RF MEMS Tunable Capacitor Applications in Mobile Phones”, IEEE International Conference on Solid-State and Integrated Circuit, pp. 635-638, December 2010.
[24] N. Emami, M. Bakri-Kassem, “Slotted Multi-Step RF MEMS-CMOS Parallel Plate Variable Capacitor”, IEEE 59th International Midwest Symposium on Circuits and Systems, pp. 1-4, March 2017.
[25] K. Sharma, S. Bansal, S. Roy, A. Kumar, K. Prakash, N. Gupta, A. K. Singh, “Analysis of Actuation Voltage Using High Dielectric Materials in Radio Frequency MEMS Switch”, Internal Conference on Signal Processing and Communication, pp. 398-402, July 2017.
[26] S. P. Natarajan, S. J. Cunningham, A. S. Morris III, D. R. Dereus, “CMOS Integrated Digital RF MEMS Capacitor”, IEEE 11th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, pp. 173-176, February 2011.
[27] 3GPP TS 36.521-1 V13.1.0, “LTE; Evolved Universal Terrestrial Radio Access (E-UTRA); User Equipment (UE) conformance specification; Radio transmission and reception; Part 1: Conformance testing”.
[28] E. McCune, “Operating Modes of Dynamic Power Supply Transmitter Amplifiers”, IEEE Transactions on Microwave Theory and Techniques, pp. 2511-2517, October 2014.
[29] N. Cheng, J. P. Young, “Challenges and Requirements of Multimode Multiband Power Amplifier for Mobile Applications”, IEEE Compound Semiconductor Integrated Circuit Symposium, pp. 1-4, November 2011.
[30] J. Birchall, P. Enrico de Falco, K. Morris, M. Beach, “Efficiency Enhancement of M2M Communications over LTE using Adaptive Load Pull Techniques”, IEEE Radio and Wireless Symposium, pp. 26-28, March 2017.
[31] A. A. Aziz, R. R. Mansour, “Design, Fabriacation and Characterization of Compact 4-bit RF MEMS Capacitor Bank in Standard CMOS 0.35μm Process”, IEEE MTT-S International Microwave Symposium, pp. 572-574, October 2017.
[32] K. Nadaud, F. Roubeau, A. Pothier, P. Blondy, L. Y. Zhang, R. Stefanini, “High Q Zero Level Packaged RF-MEMS Switched Capacitor Arrays”, 46th European Microwave Conference, pp. 1377-1380, January 2017.
[33] D. Molinero, S. Cunningham, A. Morris, “New Power Handling Characterization for RF MEMS Capacitive Switches”, 47th European Microwave Conference, pp. 316-319, December 2017.
[34] N. Habbachi, H. Boussetta, A. Boukabache, M. A. Kallala, P. Pons, K. Besbes, “Tunable MEMS capacitor: influence of fluids”, Electronics Letters, pp. 72-73, January 2017.
[35] E. Arabi, X. Jiao, K. Morris, M. Beach, “Analysis of Coverage of Tunable Matching Networks with Three Tunable Elements”, IEEE MTT-S International Microwave Symposium, pp. 904-906, October 2017.
[36] F. C. W. Po, R. Abdaoui, A. Giry, “Multi-band dual-mode antenna tunable matching network for broadband applications”, IEEE International Conference on Electronics, Circuits and Systems, pp. 492-495, February 2017.
[37] K. Han, Y. Yang, C. J. You, X. Zhu, X. Du, “Reconfigurable Continuous Class-F Power Amplifier Using Tunable Output Matching Network”, IEEE 17th International Conference on Communication Technology, pp. 1201-1204, May 2018.