選擇性三維線路直接成型｜國立臺灣科技大學博碩士論文系統

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研究生：	童冠程 Guan-Cheng Tong
論文名稱：	選擇性三維線路直接成型 Directly selective molding of 3D circuits
指導教授：	王丞浩 Chen-Hao Wang
口試委員:	郭俞麟 Yu-Lin Kuo 邱智瑋 Chih-Wei Chiu 黃信智 Hsin-Chih Huang
學位類別：	碩士 Master
系所名稱：	工程學院 - 材料科學與工程系 Department of Materials Science and Engineering
論文出版年：	2020
畢業學年度：	108
語文別：	中文
論文頁數：	120
中文關鍵詞：	無電鍍銅、選擇性金屬化、三維成型
外文關鍵詞：	Electroless Metal Deposition, selective plating, 3D printing
相關次數：	點閱：147 下載：0
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無電鍍銅在基材上為產業界非常重要的應用。然而，如何選擇性的無電鍍是目前需要探討的問題，在過去。前人通常將觸媒配置成墨水再用噴塗的方式在基材上做出選擇性圖型，而無電鍍過程通常需要先表面清潔，基材表面處理，接著敏化步驟與觸媒活化步驟，最後便能無電鍍銅。而傳統無電鍍銅方式不僅需要大量同時成本也是值得去探討的問題，因此，吾人利用將觸媒混入至基材的方式，結合 3D列印技術，不僅能達到選擇性線路的效果，成品的展現上也能達到三維結構之模型。
本實驗為新型選擇性無電鍍技術，在過去雷射直接成型技術為主要做為選擇性電路的主要製程方法。然而，此法存在許多缺點，一為雷射的高耗能與設備昂貴，二為雷射僅只能在表面做處理。本實驗透過 3D列印的方式來改善 LDS製程無法完成的事情，並有以下幾個特點 : (1)可直接三維成型選擇性線路無結構上的限制 (2)可製造內線路製程，使無法透過雷射也能做到選擇性線路 (3)無雷射、無鈀製程大大地降低生產成本。透過此法所得到的選擇性電路可得到完整的銅層與良好的銅厚度。

Electroless copper plating is an appropriate process in 3C products. However, how to selectively do the electroplating is a serious problem. At present, most of the procedures are preparing the catalysts into a solution and using inkjet way to make selected pattern. After electroless copper plating, the pattern has catalyst on it and can help reduce the copper layer. This method requires surface treatment, sensitization, activation, and finally can do electroless plating. These processes are not only trivial but also wasting time and increasing cost. Therefore, we study a new way to achieve selective electroless copper plating. This work establishes a manufacturing method by mixing additives. This method couples the advantages of dual-material fused deposition modeling (FDM) 3D printing and selective electroless plating. The method relies on the selective sensitization/activation and metallization of dual-material FDM 3D printed structure.
This experiment is a new type of selective electroless plating technology. In the past, laser direct molding technology was mainly used as the main process method for selective circuits. However, lasers have high energy consumption and expensive equipment, and lasers can only be used for surface treatment. This experiment uses 3D printing to improve things that can't be done in the LDS process, and has the following characteristics: (1) Direct three-dimensional molding of selective circuits without structural restrictions (2) Manufacture internal circuit (3) Laser-free, palladium-free process greatly reduces production costs. The selective circuit obtained by this method can obtain a complete copper layer and good copper thickness.

摘要    I
Abstract    II
致謝    III
目錄    IV
圖目錄    X
表目錄    XV
第一章 緒論    1
1-1  前言    1
1-2  無電鍍製程應用    3
1-2-1  塑膠電鍍    3
1-2-2  多元合金鍍層    4
1-3  無電鍍銅製程    6
1-3-1  無電鍍銅製程沿革    6
1-3-2  行動裝置天線之無電鍍銅製程具體施行步驟    8
1-4  無電鍍鎳製程    12
1-4-1  無電鍍鎳製程沿革    12
1-4-2  行動裝置天線之無電鍍鎳製程具體施行步驟    13
1-5  研究動機與目的    15
摘要    I
Abstract    II
致謝    III
目錄    IV
圖目錄    X
表目錄    XV
第一章 緒論    1
1-1  前言    1
1-2  無電鍍製程應用    3
1-2-1  塑膠電鍍    3
1-2-2  多元合金鍍層    4
1-3  無電鍍銅製程    6
1-3-1  無電鍍銅製程沿革    6
1-3-2  行動裝置天線之無電鍍銅製程具體施行步驟    8
1-4  無電鍍鎳製程    12
1-4-1  無電鍍鎳製程沿革    12
1-4-2  行動裝置天線之無電鍍鎳製程具體施行步驟    13
1-5  研究動機與目的    15
第二章  實驗原理與文獻探討    16
2-1  雷射直接成型技術(LDS)    16
2-2  3D列印技術    19
2-2-1模型建模    19
2-2-2列印    20
2-2-3 熔融沉積型（Fused deposition modeling，FDM）    21
2-2-4 光固化立體造型（Stereolithography，SLA）    22
2-2-5 數位光處理（Digital Light Processing，DLP）    23
2-2-6 選擇性雷射燒結技術（Selective Laser Sintering）    24
2-3  表面處理    26
2-3-1溶漲及化學蝕刻    26
2-3-2電漿及雷射蝕刻    26
2-4 無電電鍍銅之催化及應用    28
2-4-1無電電鍍銅液組成與特性    29
2-4-2無電電鍍銅液內反應及觸媒催化機制    32
2-5 錫鈀膠製程及其他活化液製程及原理    36
2-6  非鈀系統觸媒    38
2-6-1  銀奈米觸媒於無電電鍍銅之催化機制    39
2-6-2 奈米銀之合成及其在無電電鍍銅上之應用    39
摘要    I
Abstract    II
致謝    III
目錄    IV
圖目錄    X
表目錄    XV
第一章 緒論    1
1-1  前言    1
1-2  無電鍍製程應用    3
1-2-1  塑膠電鍍    3
1-2-2  多元合金鍍層    4
1-3  無電鍍銅製程    6
1-3-1  無電鍍銅製程沿革    6
1-3-2  行動裝置天線之無電鍍銅製程具體施行步驟    8
1-4  無電鍍鎳製程    12
1-4-1  無電鍍鎳製程沿革    12
1-4-2  行動裝置天線之無電鍍鎳製程具體施行步驟    13
1-5  研究動機與目的    15
第二章  實驗原理與文獻探討    16
2-1  雷射直接成型技術(LDS)    16
2-2  3D列印技術    19
2-2-1模型建模    19
2-2-2列印    20
2-2-3 熔融沉積型（Fused deposition modeling，FDM）    21
2-2-4 光固化立體造型（Stereolithography，SLA）    22
2-2-5 數位光處理（Digital Light Processing，DLP）    23
2-2-6 選擇性雷射燒結技術（Selective Laser Sintering）    24
2-3  表面處理    26
2-3-1溶漲及化學蝕刻    26
2-3-2電漿及雷射蝕刻    26
2-4 無電電鍍銅之催化及應用    28
2-4-1無電電鍍銅液組成與特性    29
2-4-2無電電鍍銅液內反應及觸媒催化機制    32
2-5 錫鈀膠製程及其他活化液製程及原理    36
2-6  非鈀系統觸媒    38
2-6-1  銀奈米觸媒於無電電鍍銅之催化機制    39
2-6-2 奈米銀之合成及其在無電電鍍銅上之應用    39
第三章  實驗步驟與研究方法    42
3-1  實驗規劃    42
3-2  實驗材料及藥品    45
3-3  實驗儀器與設備    46
3-4  實驗步驟    47
3-4-1塑膠混煉    47
3-4-2 3D列印選擇性圖形    48
3-4-3 表面處理    49
3-4-4 觸媒活化    49
3-4-5 無電鍍銅    50
3-4-6 無電鍍鎳    50
3-5  儀器原理    52
3-5-1微型混煉機    52
3-5-2 FDM 3D列印機    54
3-5-3場發射掃描式電子顯微鏡（Scanning Electron Microscope, SEM）    55
3-5-4  X光繞射分析儀（X ray Diffraction Spectrometer, XRD）    57
3-5-5  X光螢光光譜儀（X-ray Fluorescence Measuring, XRF）    59
3-5-6  X射線光電子能譜（X-ray Photoelectron Spectroscopy, XPS）    61
3-5-7 拉伸試驗測試    63
3-5-8粗糙度輪廓儀    68
3-5-9石英晶體微量天平    69
3-5-10百格測試    71
第四章  結果與討論    72
4-1  ABS塑膠混合不同比例AgNO3    72
4-1-1 無電鍍成品圖    72
4-1-2 電子顯微鏡影像圖    74
4-1-3 拉伸強度測試    77
4-2  酸蝕刻表面處理    79
4-2-1 酸蝕刻表面處理之電子顯微鏡影像圖    79
4-2-2 不同酸蝕時間之鍍銅結果    81
4-3  觸媒活化    82
4-3-1不同觸媒活化時間之電子顯微鏡影像圖    82
4-3-2 不同觸媒活化時間之鍍銅成品圖    83
4-4  不同塑膠之無電鍍結果    84
4-4-1 聚乳酸(PLA)    85
4-4-2 丙烯腈-丁二烯-苯乙烯(ABS)    85
4-4-3 聚碳酸酯(PC)    86
4-4-4 聚對苯二甲酸環己烷二甲酯(PETG)    86
4-4-5 高抗衝聚苯乙烯(HIPS)    87
4-4-6 尼龍(nylon)    88
4-4-7 丙烯腈苯乙烯丙烯酸酯(ASA)    89
4-5  不同鍍銅時間之銅層厚度分析    91
4-5-1 銅層表面分析    91
4-5-2 銅層厚度分析    94
4-5-3 起鍍、增度銅厚度比較    97
4-5-4 導電度比較    99
4-5-5 表面粗糙度比較    101
4-5-6 水接觸角    103
4-6  二維與三維選擇性線路模型    104
4-6-1 二維平面選擇性線路    104
4-6-2 三維立體選擇性線路    106
4-6-3 插承式選擇性線路    107
4-6-4 基材與線路分界溢鍍觀察    108
4-7  元素分析    110
4-7-1 X光繞射分析(XRD)    110
4-7-2 X光電子能譜分析(XPS)    112
4-8  觸媒還原效率比較    113
4-9 無電鍍鎳    114
第五章  結論    115
第六章  參考資料    116



                                

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