本文探討軟性電路板之外觀檢測系統之研發。此系統硬體採用真空吸器盤來放置軟板，並使用一組數位影像擷取模組和雙軸線性馬達平台整合成單一機台。至於軟體的部分主要包含特徵樣板的訓練和瑕疵檢測兩大部分。其中特徵樣板的訓練是先由操作員進行標準物件特徵的框選，系統將自動統計框選範圍內像素值的分佈，並根據統計結果計算出分辨金面、印刷層、沖孔區和全物件四種特徵樣板所需的二值化門檻值。當系統進行瑕疵檢測時，是先依據特徵樣板影像上的顆粒資訊對待測物影像進行自動定位框選，繼而對框選邊界進行邊線的偵測和調整。最後檢測出金面、文字、印刷線段和沖孔區等四類瑕疵提出完整的報告。

This work develops an inspection system for the appearance defects of flexible printed circuit boards, FPC. The hardware of the system includes a vacuumplate, a CMOS camera and a platform driven by linear motors. The software developed has two parts, which are template training and defect inspection. In the training process, the operator needs to specify the locations of features on the images of golden samples. The system then evaluates the distribution of pixel values of different features and finds out the necessary thresholds to create four FPC templates, which are pad, print layer, punching area and entire features. During the inspection, the feature parameters obtained from the previous training step are used to estimate the regions of interest on the specimen images before the system captures the pixels of features through several image process techniques. Finally, the system will report the defects found on the pads, character strings, printed-lines or punching areas.

[1] 2011年PCB產業趨勢展望，工研院產經中心(2011)
[2] 嘉聯益科技股份有限公司網站，http://www.careergroups.com
[3] TPCA-F-001，軟性電路板(FPC)外觀品質允收準則規範，台灣電路板協會 (2010)
[4] F. Ercal, F. Bunyak, F. Hao, and L. Zheng, “A fast modular RLE-based inspection scheme for PCBs”, Proceedings of SPIE - The International Society for Optical Engineering 3203, pp. 49-59,(1997)
[5] M. Moganti, F. Ercal, “A Subpattern Level Inspection System for Printed Circuit Boards”, COMPUTER VISION AND IMAGE UNDERSTANDING, Vol. 70, No. 1, April, pp. 51–62, (1998)
[6] F. Ercal, F. Bunyak, H. Feng, “Context-Sensitive Filtering in RLE for PCB Inspection”, Proceedings of SPIE - The International Society for Optical Engineering 3517, pp. 286-293,(1999)
[7] F. Ercal, M. Allen, and H. Feng , “A Systolic Image Difference Algorithm for RLE-Compressed Images”, IEEE Transactions on Parallel and Distributed Systems, Vol. 11, No. 5, (2000)
[8] Z. Ibrahim, S.A.R. Al-Attas, Z. Aspar, M.M. Mokji, “Performance Evaluation of Wavelet-Based Pcb Defect Detection and Localization Algorithm” , Industrial Technology, 2002. IEEE ICIT '02. International Conference , 226 - 231 vol.1, (2001)
[9] Z. Ibrahim, S.A.R. Al-Attas, Z. Aspar, “Analysis of the Wavelet-Based Image Difference Algorithim for PCB Inspection”, SICE 2002. Proceedings of the 41st SICE Annual Conference, (2002)
[10] Z. Ibrahim, S.A.R. Al-Attas, “Wavelet-Based Printed Circuit Board Inspection System ” , International Journal of Information and Communication Engineering, (2005)
[11] X. Zhou, Y. Li, G. Liu, “Research on the Image Multilayer Matching Comparison Method in PCB Defects Inspection”, Proceedings of SPIE - The International Society for Optical Engineering 7129, no. 71290D, (2008)
[12] J. X. Huang, D. Li, F. Ye, Z. J. Dong, “Flexible Printed Circuit Defective Detection Based on Image Registration”, Proceedings - 2010 3rd International Congress on Image and Signal Processing, CISP 2010 6 , art. no. 5648173 , pp. 2570-2574, (2010)
[13] J. Feng, M. L. Dong, “An Auto Multi-threshold Segmentation Approach of PCB Image Based on Iteration”, ICINA 2010 - 2010 International Conference on Information, Networking and Automation, Proceedings 1 , art. no. 5636526 , pp. V1420-V1423, (2010)
[14] Z. Chen, Q. Wang, “Research of PCB Image Segmentation Based on Color Features”, ICACTE 2010 - 2010 3rd International Conference on Advanced Computer Theory and Engineering, Proceedings 2 , art. no. 5579447 , pp. V2543-V2545, (2010)
[15] W.Y. Wu, M.J. Wang, and C.M. Liu, “Automated inspection of printed circuit boards through machine vision”, Computers in Industry, vol. 28, pp. 103-111, (1996)
[16] 許辰合，「印刷電路板基本元件圖像之萃取系統」，碩士論文，成功大學(2002)
[17] 許鴻德，「具位移容忍之快速印刷電路板線路瑕疵檢測法」，碩士論文，元智大學(2003)
[18] 周志賢，「應用次像素插值方法改善印刷電路板缺陷直接檢測之可行性評估」，碩士論文，清華大學(2004)
[19] 徐國峯，「應用相關係數法於印刷電路板底片缺陷之檢測」，碩士論文，中華大學 (2005)
[20] 陳家振，「軟板線路瑕疵檢測系統與分類演算法之研究」，碩士論文，中華大學 (2007)
[21] 禹道青，「大同 應用週期展開斜向小波轉換實現軟性電路板」，碩士論文，大同大學 (2008)
[22] 奧寶科技Orbotech，http://www.orbotech.com/Tch/
[23] 牧德科技MACHVISION，http://www.machvision.com.tw/zh-tw/
[24] PCB資源網，http://www.pcbres.com/pcbnews/cn/20070703361.html
[25] Camtek，http://www.camtek.tw/
[26] 創新應材股份有限公司，http://www.intech-m.com.tw/product_PIF.html
[27] 中國樂凱膠片集團公司，http://www.luckyfilm.com.cn/files/product/hf/ptjuzhibomo.jpg
[28] 電子製造(ResearchMFG)，http://www.researchmfg.com/
[29] 蘇友偉，「波形參數對通孔鍍銅之影響」，碩士論文，逢甲大學 (2004)
[30] 上村化學(上海)有限公司，「PTH與電鍍銅」，投影片資料
[31] 林定皓，2011軟性電路板簡介，台灣電路板協會 (2011)
[32] I.D.E.A.S，http://www.ideastraining.com/
[33] 肯定資訊，http://www.surevision.com.tw/
[34] 欣懋科技，http://www.sinmou.com.tw/about.html
[35] MORITEX，MCV-Light產品型錄
[36] 曜宇科技，http://www.exlite.com
[37] Engineering ToolBox，http://www.engineeringtoolbox.com/
[38] CONVUM，http://www.convum.co.jp
[39] 美商國家儀器公司，http://taiwan.ni.com/
[40] 廣華電子，http://shop.cpu.com.tw/
[41] 英國雷尼紹公司(RENISHAW)，http://www.renishaw.com.tw
[42] 上銀科技，http://www.hiwin.com.tw
[43] 飛斯妥股份有限公司(FESTO)，http://www.festo.com
[44] 佳能電子(C anon)，http://cpn.canon-europe.com
[45] 互聯網，CSS3 HSL colors 使用说明，http://www.alixixi.com/web/a/2012030779055.shtml