本研究利用高功率半導體雷射進行金屬積層製造，將高分子材料均勻披覆於不鏽鋼粉末(17-4PH)外層，利用雷射熔化高分子材料後能使金屬粒子間透過高分子熔融產生黏滯現象進而成型，透過半導體雷射機台控制其成型厚度，如此逐層堆疊成型。
本研究探討如何利用高功率半導體雷射模組將金屬粉末燒結成形。以波長808nm之半導體雷射模組使用在材料上，在相同波長雷射比較不同功率之成型狀況並將其進行脫脂燒結，在各個階段比較不同參數產生的結果，最後分析不同雷射參數所燒結得出結果之差異。
此研究應用高功率半導體雷射進行金屬材料之積層製造，利用雷射能量將高分子材料熔融產生黏結，並成功使用半導體雷射列印出物件，最終發現在高分子含量10wt%時能有較佳之成型效果，而在雷射能量密度0.25 J/mm2與0.375 J/mm2下得到物件成型效果較佳，並發現能量越高之物件因穿透深度較佳有利於提升物件密度，其重量也隨能量越高而增加。

In this research, a high-power semiconductor laser is used for metal additive manufacturing, and the polymer material is uniformly coated on the outer layer of stainless steel powder (17-4PH). After the polymer material is melted by the laser, the metal particles can be viscous through the polymer melting. The phenomenon is then formed, and the forming thickness is controlled by the semiconductor laser machine, and the forming is stacked layer by layer.
This research explores how to use high-power semiconductor laser modules to sinter metal powders. A semiconductor laser module with a wavelength of 808nm is used on the material, compare the molding conditions of different powers of the laser at the same wavelength after that can de-binding and sintering. Compare the results of different parameters at each stage, analyzed the result between different sintered parameters.
This research attempted to use high-power semiconductor lasers for multi-layer manufacturing of metal materials, the laser energy is used to melt the polymer materials to produce bonding. Finally, it is found that when the polymer content is 10wt% would have better molding effect, and the object molding effect is better under the energy density of 0.25 J/mm2 and 0.375 J/mm2, and it is found that the object of the higher energy due to the better penetration depth is beneficial to increase the object density. With higher power, the weight has increased.

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