研究生: |
柯人豪 Jen-hao Ko |
---|---|
論文名稱: |
SFP與AMC高速連接器之設計 Design of SFP and AMC High Speed Connectors |
指導教授: |
楊成發
Chang-fa Yang |
口試委員: |
吳瑞北
Ruey-beei Wu 曾昭雄 Chao-hsiung Tseng 王蒼容 Chun-long Wang 廖文照 Wen-jiao Liao |
學位類別: |
碩士 Master |
系所名稱: |
電資學院 - 電機工程系 Department of Electrical Engineering |
論文出版年: | 2012 |
畢業學年度: | 100 |
語文別: | 中文 |
論文頁數: | 106 |
中文關鍵詞: | 高速連接器 、測試卡 、測試板 、SFP+ 、XFP 、AMC |
外文關鍵詞: | High speed connector, Test card, Test board, SFP+, XFP, AMC |
相關次數: | 點閱:182 下載:0 |
分享至: |
查詢本校圖書館目錄 查詢臺灣博碩士論文知識加值系統 勘誤回報 |
本論文係針對三款高速連接器進行模擬分析與設計,第一款高速連接器為雙層小封裝熱插拔收發器SFP+連接器,其數據傳輸數率為10 Gbps。第二款高速連接器為XFP連接器,數據傳輸數率亦為10 Gbps。第三款高速連接器為AMC連接器,其數據傳輸數率達12 Gbps。本論文應用電磁模擬軟體分析高速連接器之差模阻抗,並輔以時域反射儀量測驗證之,其模擬與量測趨勢大致相符,並測量連接器之反射損耗、饋入損耗、串音干擾、傳遞延遲差異與眼圖等。本論文提出調整塑膠本體之介電係數與端子尺寸來設計高速連接器,使其差模阻抗能符合規範標準。
This thesis proposes three kinds of high speed connectors analysis and design. The first design is about double-deckersmall form-factor pluggable transceiver (SFP+2X1) connector and the data rate is 10 Gbps. The second design is about 10 Gigabit Small Form Factor Pluggable(XFP) connector and the data rate is 10 Gbps. The third design is about Advanced Mezzanine Card (AMC) connector and the data rate is 12 Gbps. In this thesis an electromagnetic solver has been used to analyze the characteristic impedance and other electrical properties, and the experimental results are performed using the time-domain reflectometry (TDR). Good agreement between the simulated and measured results is obtained. And measure the return loss, insertion loss, crosstalk, delay skew and eye diagram. Eventually, the thesis also investigates a manner to increase the dielectric constant of the insulator and adjustment connector terminal size, so that the impedance standards can be well matched with our connector design.
[1] D. M. Pozar, Microwave Engineering, WILEY, 2005.
[2] Aurelian Tolescu, Paul Slvasta, “Characterization of Differential Interconnects from Time Domain Reflectometry Measurements,”24th International Spring Seminar on Electronics Technology, Calimanesti-Caciulata, Romania, May 5-9, 2001.
[3] Eric Bogatin, Signal Integrity–Simplified. Prentice Hall , 2003.
[4] Stephn H. Hall, Garrett W. Hall James A. McCall, High-Speed Digital System Design—A Handbook of Interconnect Theory and Design Practices, 2000.
[5] Chia-Hsiung Kao, Chun-Chieh Tseng, Fong-Ming Lee, and Mao-Fu Lai, “A Better Technique Using Multisegment Modeling and Analysis of High-Density and High-Speed Connectors,” IEEE TRANSACTIONS ON ADVANCED PACKAGING, VOL. 29, NO. 1, FEBRUARY , 2006.
[6] 謝清河,「壓接式連接器之針眼端子之分析與最佳化」,國立臺灣科技大學碩士論文, 民98年
[7] Mu-Shui Zhang, Yu-Shan Li, Li-Ping Li, and Chen Jia, “Modeling and Analyzing High-Speed and High-Density Connectors by Using Multisegment Multiple Transmission Lines Model,” I IEEE TRANSACTIONS ON ADVANCED PACKAGING, VOL. 31, NO. 1, FEBRUARY , 2008.
[8] Aurelian Tolescu, Paul Slvasta, “Compact 40-Gb/s EML Module Using Broadband FPC Connection Technique,”Optical Fiber Communication (OFC), collocated National Fiber Optic Engineers Conference(OFC/NFOEC) , 2010.
[9] SFF-8431, Specifications for Enhanced Small Form Factor Pluggable Module SFP+, Rev 4.1, July 6 , 2009.
[10] SFF-8083, Specification for 0.8mm Card Edge Connector for 8/10 Gbs Applications, Rev 2.5,January 19, 2010.
[11] Molex, Application Specification for Stacked SFP & SFP+ Connectors, June 4, 2011.
[12] Molex, Test Summary for Molex Series 74441 Connectors in SFP+ Applications, December 7 , 2006.
[13] INF-8077i for 10 Gigabit Small Form Factor Pluggable Module, Revision 4.5, August 31, 2005.
[14] Tyco Electronics, Vertical Card Edge Connector for Micro TCA Applications, November 12, 2007.