針對異方性導電膜（Anisotropic Conductive Film，ACF）未來應用之需求，期望開發出能快速硬化，儲存壽命長之配料系統，並能符合應用之性能。
本研究使用不同加工方式及不同條件前處理，來製備類（仿）微膠囊，使用咪唑化合物做為環氧樹脂之硬化劑，epoxy resin聚合結構是利用FT-IR進行官能基分析及鑑定；使用DSC分析類（仿）微膠囊之潛在硬化行為，利用TGA、TMA及peeling test進行熱性質與接著性之分析，經由類（仿）微膠囊包覆，能夠有效延遲環氧樹脂與硬化劑反應時間，可經由選擇殼層材質，製備不同反應速率之潛在型硬化劑。

In this study, we aim to develop rapid hardening and long shelf life anisotropic conductive film (ACF) for the application in future. The experimental employed different manufacture processing and conditions to fabricate microcapsules. The imidazole was used as hardener for epoxy. Then the microcapsules were evaluated by FTIR, DSC, TGA, TMA, peeling test to characterize the physical-chemical properties. Through microencapsulation, the epoxy/hardener reaction time increase and the latent hardener in varied reaction time could be synthesized from different microencapsulate shell material.

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