隨著全球性競爭趨勢，價格不再是顧客要求重點，品質要求與日俱增。表面黏著技術(Surface Mount Technology, SMT)製程其製程變因繁多故本研究主要利用品質改善手法，改善現有問題的流程。研究結論歸納如下；
一、 個案公司因應經營策略及業務型態的調整，所以需提升台灣工廠製造能力與品質水準，而首要之急是針對現有產能及產線配置進行評估調整。
二、 個案公司為朝向SMT零缺點製程所做的努力，SMT生產設備中關鍵製程的持續性改善對其提昇產品品質是息息相關。
三、 個案公司為達SMT製程改善目的所進行改善專案，包括有：全面導入電子化排程、置件改善專案、檢驗輔助工具的利用及制定工作指導規範等，其措施可做為欲推動製程通路零缺點改善的參考。
四、 本研究利用要因圖針對主要關鍵製程：印刷、置件、迴焊生產製程進行瞭解分析及改善並朝向通往品質零缺點目標邁進為主要目的。
五、 經由本研究之探討可瞭解近年來個案公司的製程品質已有顯著提昇，也提高表面黏著組裝技術生產線上之績效，但品質改善仍需持續進行才能繼續維持下去。

Following the trend of global competition, prices are no longer essential to customers, but they are demanding more on quality instead. As there is a big variance in Surface Mount Technology (SMT) process, hence, the main interest of this study is to use quality improvement method to improve the problems of existing process. The research conclusion is summarized as follows:
1. The case company should adjust its production process according to management strategy and business pattern. So, there is a need for Taiwan factories to upgrade their manufacturing capabilities and quality standards, and the urgent priority is to carry out adjustment assessment on their existing production capacity and production layout.
2. The effort that the case company should do in achieving zero-defect process is to emphasize continuity improvement of key SMT production equipment. This has direct influences on improving the quality of products.
3. The improvement plans that the case company should do to achieve SMT process goal include: a full implementation of electronic scheduling, insertion improvement project, utilization of auxiliary testing tools, and establishment of work guidance standards, etc. These measures can be used as a reference in promoting the achievement of zero-defect improvement process.
4. This study uses case-and-effect diagram aiming at the key manufacturing process to perform understanding analysis and improvement measures, and the objective is to move towards the goal of zero-defect quality.
5. Through the exploration of this study, we have come to know that the production process quality of the case company has improved significantly in recent years, and that the performance of SMT assembly technique on the production line has also been upgraded. However, for the company to maintain sustainable management, it should continue to upgrade quality continuously.

中文部份：
(1)小僑，「表面黏著技術的主角—取置機」，表面黏著技術，p.118-120，1992年。
(2)王興昇，「表面黏著元件取放機開發」，表面黏著技術，p.132-136，1992年。
(3)丘黃元，「SMT 的第一步—SMC」，表面黏著技術，1992年。
(4)電子技術編輯 ，「表面黏著技術(SMT) 」，台北：電子技術出版社，1991年。
(5)台灣電路板協會，「表面黏著技術SMT」，台北：台灣電路板協會，2006年。
(6)吳安妮，「品質與生產力提昇之道—標竿制度」，會計研究月刊，第105期，p.59，1998年。
(7)李崇玲，「多線表面黏著技術生產系統之排程問題」，國立清華大學碩士論文,p.8，1996年。
(8)杜順榮，「以系統評估模式選擇生產力改善技術之研究」，國立交通大學工業工程研究所碩士論文，1994年。
(9)宗其元，「表面粘著技術的重點—焊接」，表面黏著技術，p.150，1992年。
(10)林崇智，「SMT 生產線最適化設計」，國立清華大學工業工程研所碩士論文，1997年。
(11)柯志豐，「結合生產力、品質與彈性之製造系統整合績效評詁模式」，大葉大學工業工程研究所碩士論文，1998年。
(12)陳啟斌，「簡易系統模擬法運用於SMT電子組裝生產線平衡」，中國工業工程學會年會論文集，第二冊，p.873，1997年。
(13)廖淑慧，「表面黏著技術之取置系統生產排程與生產平衡」，國立清華大學碩士論文，1995年。
(14)欀潁堅，「製造業生產力診斷系統之發展—以國內大型機械製造業為例」，國立成功大學工業管理所碩士論文，1994年。
(15)紀國鍾、鄭晃忠主編，「液晶顯示器技術手冊-第四版」，台北：台灣電子材料與元件協會，2004年。

英文部份：
(1)Arulvanan, P., Zhong, Z., Shi, X. Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints. Microelectronics and Reliability, Vol.46, Issues 2-4,432-439, 2006.
(2)Bob keelley ,Process Control,Surface Mount Technology Magazine, 2000.
(3)Erik Nilsson ,Is the Industry Yet? Surface Mount Technology, 2000.
(4)Fujiuchi, S., and Toriyama, K. Collective screen printing for carrier bump and SMT pads. Proceedings of IEEE/CPMT International Electronic Manufacturing Technology Symposium, 109-112, 1994.
(5)James K.Hollomon Jr. Sur face-Mount Technology for PC Boards,Prompt Publications，p407-430, 1995.
(6)Jung, S.W., Jung, J.P., Zhou, Y. Characteristics of Sn–Cu Solder Bump Formed by Electroplating for Flip Chip. IEEE Transactions on Electronics Packaging Manufacturing, Vol.29, Issue 1, 10-16, 2006 .
(7)Kusiak, A. and Kurasek, C. Data mining of printed-circuit board defects. IEEE Transactions on Robotics and Automation, Vol.17, No.2, 191-196, 2001.
(8)Lau, F. K. H. and Yeung, V. W. S. A hierarchical evaluation of the solder paste printing process. Journal of Materials Processing Technology, Vol.69, 79-89, 1997.
(9)Lideen, J.D., Dahl, A.O. Printing techniques for fine pitch screen printing, Proceedings of the Technical Program- NEPCON West, 1862-1877, 1994.
(10)Liu, Y., Tian, G., Gale, S., Johnson, R.W., Crane, L.Lead-free chip scale packages: assembly and drop test reliability. IEEE Transactions on Electronics Packaging Manufacturing, Vol.29, Issue 1,1-9, 2006.
(11)Mannan, S. H., Ekere, N. N., Ismail, I., and Ko, E. K. Squeegee Deformation Study in the Stencil Printing of Solder Pastes. IEEE Transactions on Components, Hybrids, and Manufacturing Technology-Part A, Vol.17, No.3, 470-475, 1994.
(12)Markstein, H. W. Controlling the Variables in Stencil Printing.Electronic Packaging and Production, Vol.37, No.2, 48-56, 1997.
(13)Mervyn Thomas DFM and PCB design, Printed circuit design,pp.20-23, 1992.
(14)Montgomery, D. C., Keats, J. B., Perry, L. A., Thompson, J. R., and Messina, W. S. Using statistically designed experiments for process development and improvement: an application in electronics manufacturing. Robotics and Computer-Integrated Manufacturing, Vol.16,Issue 1, 55-63, 2000.
(15)Pan, J., Tonkay, G. L., Storer, R. H., Sallade, R.M., and Leandri, D. J. Critical variables of solder paste stencil printing for micro-BGA and fine-pitch QFP. IEEE Transactions on Electronics Packaging Manufacturing, Vol.27,Issue 2, 125-132, 2004.
(16)Poon, N. M., Wu, C. M. L., Lai, J. K. L., Chan, Y.C., Residual shear strength of Sn-Ag and Sn-Bi lead-free SMT joints after thermal shock, IEEE Transactions on Advanced Packaging, Vol.23, Issue 4, 708-714, 2000.
(17)printing New York Mcgraw-Hill book company.
(18)Ramkumar, S. M., Ghaffarian, R., and Varanasi, A. Lead-free 0201 manufacturing, assembly and reliability test results. Microelectronics and Reliability, Vol.46, Issues 2-4, 244-262, 2006.
(19)Ray P.Prasad, General DFM Guidelines,Surface Mount Technology Magazine, 2000.
(20)Scott Buttars ,Design For Manufacture, surface Mount Technology Magazine, 2000.
(21)Shapiro, A. A., Bonner, J. K., Ogunseitan, O. A., Saphores, J.-D. M.,Schoenung, J. M. Implications of Pb-free microelectronics assembly in aerospace applications. IEEE Transactions on Components and Packaging Technologies, Vol.29, Issue 1, 60-70, 2006.
(22)Sumanth,DJ ,Productivity engineering and management,1st, 1985
(23)Whitmore, M., Mackay, C., and Hobby, A., Plastic Stencils for Bottom-Side Chip Attach. Electronic Packaging and Production, Vol.37,No.13, 68-72, 1997.
(24)Wu, C. M. L., Huang, M. L., Microstructural evolution of leadfree Sn-Bi-Ag-Cu SMT joints during aging, IEEE Transactions on Advanced Packaging, Vol.28, Issue 1, 128-133, 2005.
(25)Yang, T., Tsai, T. N., and Yeh, J. , A neural network-based prediction model for fine pitch stencil-printing quality in surface mount assembly. Engineering Applications of Artificial Intelligence, Vol.18, Issue 3, 335-341, 2005.