摘 要
本論文應用HFSS電磁模擬軟體來進行微型晶片天線之設計與相關模擬分析，其中晶片天線是採用嵌入式射出成型技術，將天線導體線路製作在構裝體上，並模擬以嵌入射出成型方式使用介電複合材封裝此構裝體，來製造晶片天線。此套天線製程與一般常見的低溫共燒陶瓷晶片天線製程相比，乃具有技術門檻較低、製作成本較少、天線設計自由度佳、良率高等優點，非常適合應用於製造晶片天線。本研究依照此天線製程要求設計了多頻帶微型晶片天線，其中包含GSM、PCS、DCS、3G、HSDPA等頻段，其大小為22×21.6×0.8mm3，並且製作了晶片天線導體線路構裝體，並測量此微型晶片天線的反射損失與遠場輻射場型，而所得測量結果與HFSS程式模擬結果相當吻合，驗證了晶片天線設計分析模型的正確性，且由天線輻射場型可以看出所製作之晶片天線的輻射效率甚佳。
此外，本研究亦將所設計之微型晶片天線應用於無線網路卡產品上，來分析與探討微型晶片天線在實際應用於產品時的使用情形，同時也針對晶片天線的外部封裝材料介電係數、封裝材料厚度、不同淨空區域大小與產品封裝外殼等變數進行詳細的模擬與實測，期能對晶片天線特性有更完整的瞭解與掌握。

Abstract
This thesis apply HFSS to design and analyze miniaturize chip antennas. Simulate an Insert Molding Technology is employed to manufacture the chip antennas, where the radiating structure of the antenna is fabricated on a substrate and composite dielectric material is attached by applying the Insert Molding Technology to form the chip antenna. Compared with a more popular Low Temperature Co-firing Ceramic Technology, our approach has the advantages of smaller technology barrier, lower cost, better design flexibility and higher production yield, very suitable for manufacturing the chip antennas. In this study, The low band include GSM band and high band include DCS,PCS,3G with HSDPA for miniaturize chip antenna with a volume of 22×21.6×0.8mm3 has been designed and fabricated. Then, return loss and far-field radiation patterns of the chip antenna have been measured. Good agreements between measurements and HFSS simulations are obtained, which verify the program simulations. Also, the antenna radiation patterns indicate that the efficiency of the chip antenna is very good.
Furthermore, the tiny chip antennas have been applied to WLAN cards to analyze and evaluate how they work in practice. Also, simulations and measurements have been performed to study the effects due to the dielectric constant and the thickness of the molding material, and required empty area on the cards. Thus, the properties of the chip antennas may be understood and handled more comprehensively.

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