本研究使用一種具有柔性高深寬比的柱狀陣列仿生材料薄膜進行SERS基板製備，其優點為製備簡易、再現性高以及具有大面積製造潛力，這些關鍵特性對於未來的大規模生產至關重要。本研究主要通過使用物理氣相沉積方法—熱蒸鍍法與濺鍍法進行奈米結構基板的金屬化製程。並利用電子束蒸鍍法(E-gun evaporation)、濺鍍法(Sputtering)與間歇濺鍍(intermittent sputtering)，調控出三種不同銀奈米粒子(Ag NPs)形貌的SERS基板。此三種基板的SERS訊號變異係數(CV)在4英吋直徑區域內皆小於15%。蒸鍍製程的基板具有良好的SERS效果，但塑膠基材容易裸露導致受到基板拉曼背景干擾。濺鍍法製程具有較佳的金屬覆膜特性，但增強因子不如預期。因此本研究採用間歇濺鍍的製程來改良上述的缺點，最終製作出訊背比(S/B ratio)大於1.06的SERS基板，並以其中製程最好的條件為間歇濺鍍(70nm)對污染物三聚氰胺(Melamine)進行微量檢測與定量分析，其濃度曲線的線性度(R2)為0.97，檢測限(LoD)為~5.6×10^-7M，SERS基板增強因子(EF)則是3.05×10^6。

In this study, a flexible high-aspect-ratio pillar array biomimetic material film was used for SERS substrate preparation. The benefit of these substrates are easy fabrication process, high reproducibility, and great potential for large area fabrication, which are key parameters for mass production in the future. In this research, the physical vapor evaporation methods was used to perform the metallization process on nanostructured substrates, which are thermal evaporation and sputter. There are three kinds of silver nanoparticles (Ag NPs) decorated on SERS substrates by E-gun evaporation, sputtering, and intermittent sputtering method. The coefficients of variation (CV) of SERS signals for these three substrates were all less than 15% over a 4-inch diameter area.
The substrate by E-gun evaporation method has great SERS effect, however, the drawback is the interference of SERS signal with background induced by exposure of polymer nanostructure template.The substrate by sputtering method has better step coverage of metal deposition, however, the enhancement factor is not as expected. Therefore, we proposed the intermittent sputtering method to solve these problems, and the SERS substrate with signal to background ratio larger than 1.06 was accomplished. The trace detection and quantitative analysis of the melamine contaminant was carried out by the SERS substrate of the best process condition (70nm Ag, intermittent sputtering). The linearity (R2) of the melamine concentration curve was 0.97, the limit of detection (LoD) was about 5.6×10^-7M, and the enhancement factor (EF) of SERS substrate was 3.05×10^6.

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