本研究與科技公司合作，根據科技公司的損壞之測試需求，探討印刷電路板經由三點彎曲試驗(Three-Point Flexural Test)下壓受力後的位移及應變後，對於安裝於印刷電路板上之多層陶瓷電容(Multilayer Ceramic Capacitor, MLCC)的影響，將於三點彎曲試驗中對多層陶瓷電容量測其靜態電容值、動態電容值及動態阻抗值，判斷其是否失效；另外也對多層陶瓷電容進行金相觀察，透過金相顯微鏡，觀察多層陶瓷電容外部及內部的結構是否破裂。
本研究會先針對玻璃纖維板進行拉伸試驗及三點彎曲試驗，將得到玻纖板的材料常數輸入有限元素模擬，並與後續實驗進行討論。在三點彎曲試驗後，可得到多層陶瓷電容失效時的極限位移與其對應的極限應變值，可供日後設計電路板及安裝多層陶瓷電容時參考。另外，透過對測試板進行鑲埋及研磨處理，可由金相顯微鏡觀察多層陶瓷電容內部裂紋失效的情形，其中電容大小和金屬內電極層是影響多層陶瓷電容的重要因素。

This study is an industry-academia cooperation with technology company. According to the testing requirements, this study investigates the influence of the displacement and strain on the Multilayer Ceramic Capacitor (MLCC) mounted on the printed circuit board after being subjected to three-point flexural test. In the three-point flexural test, the static capacitance value, dynamic capacitance value and dynamic impedance value of the multilayer ceramic capacitor will be measured to determine whether it is invalid. In addition, the metallographic observation of the multilayer ceramic capacitor will be carried out and the multilayer ceramic capacitor will be observed if the structure outside and inside the capacitor is broken through a metallographic microscope.
In this study, the tensile test and three-point flexural test of the glass fiber reinforced plastics will be carried out first, and the material constant will be input into the finite element simulation and discussed with subsequent experiments. After the three-point bending test, the displacement and ultimate strain of multilayer ceramic capacitors at failure can be obtained. The results can be used as a reference when designing circuit boards and multilayer ceramic capacitors in the future. In addition, by embedding and grinding the test plate, the failure of the internal cracks of the multilayer ceramic capacitor can be observed by a metallographic microscope. The size of the capacitor and the metal inner electrode layer are important factors affecting the multilayer ceramic capacitor.

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