近年來，由於金屬玻璃薄膜具有獨特的性質，因此已在許多不同領域中被研究及工程上的應用，例如醫療器具、微機電系統元件以及改善材料的機械性職等。金屬玻璃薄膜用於特定的應用潛力，其電學性質、機械性質及熱性質已被熟知，因此金屬玻璃薄膜的壓痕接觸變形恢復性質必須被考慮。本研究中，探討退火溫度、持溫時間、自由體積、探針尖端幾何形狀、薄膜成分及薄膜厚度對於鋯基、銅基、鉿基及鐵基金屬玻璃薄膜壓痕恢復的影響。
關於濺鍍的鋯基金屬玻璃薄膜於加熱後的壓痕恢復性質研究，由於表面張力驅動黏性流動，壓痕的形狀於不同的溫度及持溫時間具有不同程度的恢復，我們發現其在過冷液態區間退火後可達到59.8%最大壓痕深度恢復，薄膜中的自由體積量在壓痕恢復中扮演重要的角色。原子力顯微鏡結果顯示在過冷液態區間退火後，所量測到薄膜的粗糙度降低到最小值。此外我們使用模擬系統來解釋實驗上所觀察到的壓痕恢復，模擬結果顯示，於退火後，壓印所造成的凹陷恢復了許多。
關於探針尖端幾何形狀、薄膜厚度及薄膜成分對於鋯基、銅基、鉿基及鐵基金屬玻璃薄膜壓痕恢復的影響研究，我們在室溫下使用兩種三面錐體探針尖端 (Berkovich and Cube-corner) 進行奈米壓印，接著退火於過冷液態區間，結果顯示，由Berkovich 探針尖端所壓印的壓痕其壓痕恢復程度大於Cube-corner 探針尖端所壓印的壓痕，其原因為，相較於Cube-corner，Berkovich 探針尖端具有較大的曲率半徑，因此在壓印後，Berkovich的壓痕下具有較高的壓應力，於鋯基金屬玻璃薄膜的深度剖析模擬中顯示愈鈍的探針尖端所形成的壓痕具有較高的恢復率，較厚的薄膜也顯示具有較高的恢復率。此外，由於薄膜成分中元素組成不同所造成園子間鍵結的差異，相較於銅基、鉿基及鐵基金屬玻璃薄膜，鋯基金屬玻璃薄膜具有較高的恢復率。
當金屬玻璃薄膜於結晶溫度附近進行退火且有較長的持溫時間時，其具有較大的壓痕恢復，此外，若薄膜由較鈍的探針尖端所壓印、具有較厚的膜厚以及具有較低的玻璃轉移溫度其所顯示的壓痕恢復率較大。

Because of their unique properties, most recently, thin film metallic glasses (TFMGs) have been studied for various research and engineering applications, such as for medical tools, microelectromechanical system (MEMS) devices, and improving mechanical properties of materials. TFMGs to be used for a particular potential application, their electrical, mechanical, and thermal properties should be well known and thus, indentation recovery property of TFMGs following contact deformation must be considered. In this study, the effects of annealing temperature, holding time, free volume, indenter geometry, film composition, and film thickness on indentation recovery property of Zr50.3Cu28.1Al14Ni7.6, Cu48Zr42Al6Ti4, Hf45.9Cu44.8Al6.5Ti2.8, and Fe65Ti13Co8Ni7B6Nb1 (in at. %) TFMGs are examined.
The indentation recovery property of a sputtered Zr50.3Cu28.1Al14Ni7.6 (in at. %) thin film metallic glass upon heating is examined. Due to the surface tension-driven viscous flow, the shape of indentation appears to recover to different extents at various temperatures and holding times. It is found that a maximum of 59.8% indentation depth recovery is achieved after annealing within the supercooled liquid region (SCLR). The amount of free volume in the film is found to play a role in the recovery. Atomic force microscopy results reveal a decrease in film roughness to a minimum value after annealing within SCLR. To elucidate the experimentally observed shape recovery, a numerical modelling has been employed. It is evident that the depressed region caused by indentation is elevated after annealing.
The influences of indenter tip geometry, film thickness and film composition on indentation recovery of Zr-, Cu-, Hf-, and Fe-based TFMGs have been studied. Nanoindentations are performed at room temperature with two three-sided pyramidal indenters (Berkovich and cube-corner), followed by annealing performed within the supercooled liquid temperatures. The results reveal that the extent of recovery of indentation by Berkovich indenter is higher than that of cube-corner owing to higher compressive stress underneath of Berkovich tip and larger radius of curvature of the indent left behind after Berkovich indentation. The numerical modelling of depth profile of Zr-based TFMG shows the blunter the indenter tip is the higher the recovery. The thicker film also shows larger recovery. In addition, because of the bonding force difference between constituent elements, Zr-based TFMG exhibits larger recovery than Cu-, Hf- and Fe-based TFMGs.
Larger indentation recovery is achieved when TFMGs are annealed at around their corresponding crystallization temperature and longer holding time. In addition, films indented by blunter indenter, the thicker film, and the film that has lower glass transition temperature showed larger indentation recovery.

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