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研究生： 張俊堯
Chun-Yao Chang
論文名稱： 透輝石相玻璃陶瓷低溫共燒擴散效應與高頻天線特性探討
Low temperature co-fired diopside glass ceramic with silver, copper diffusion effect and microwave antenna characteristics
指導教授： 周振嘉
Chen-Chia Chou
口試委員: 馮奎智
NONE
廖文照
Wen-Jiao Liao
學位類別： 碩士
Master
系所名稱： 工程學院 - 機械工程系
Department of Mechanical Engineering
論文出版年： 2015
畢業學年度： 103
語文別： 中文
論文頁數： 126
中文關鍵詞： DRA天線 、銀電極共燒 、銅電極共燒 、LTCC天線 、低介電常數 、高品質因子 、微波介電 、趨近於零的共振溫度頻率係數 、透輝石相玻璃陶瓷
外文關鍵詞： DRA antenna, LTCC antenna
相關次數： 點閱：324  下載：2 
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    • 本研究探討所開發之微波介電材料應用於高頻元件製作。透輝石相玻璃陶瓷(CaMgSi2O6)具低介電常數 (low dielectric constant, k)、高品質因子值(high quality factor, Qxf) 和低共振溫度頻率係數(Temperature coefficient of the resonance frequency, τf)等特性，因此適用於微波電路元件使用。本研究深入探討此材料系統共燒特性，發展出可於大氣下與銀共燒、氮氣下與銅電極共燒匹配(≦1000℃)材料系統，並使用低溫共燒技術(LTCC, low temperature co-fired ceramic)製作微波元件。
    首先為了建立CaMgSi2O6玻璃陶瓷在微波元件適用性，將此材料做成塊材與特殊電路饋入形成DRA天線(dielectric resonator antenna)，利用透輝石相玻璃陶瓷高品質因子值之特性設計優越天線元件，大氣及氮氣燒結透輝石相玻璃陶瓷系統，其兩系統製成DRA天線其S11反射係數分別為-12.008dB、-12.679 dB；效率則高達75.08%、82.59%，顯示優良元件特性。
    為發揮透輝石相玻璃陶瓷低溫燒結優勢，利用低溫共燒技術製成微波元件是一大特點，因此探討此系統分別與銀及銅異質共燒效應。而此系統共燒過程與大部分LTCC材料相似，皆有銀擴散現象發生，但擴散樣貌與其他文獻有些許不同；本系統屬高結晶度玻璃陶瓷，銀擴散是以銀氧化後與玻璃鍵結擴散，伴隨透輝石相玻璃陶瓷結晶過程會把銀推向玻璃基質，析出後銀會呈現不規則片狀並分布於電極邊界。在900 oC 2hr燒結條件下，銀會擴散至玻璃陶瓷體60μm，以相定量評估，銀會約以45%存在於擴散體中。為了解決銀擴散問題，本研究採用非晶質氧化矽添加。當非晶質氧化矽添加至4wt%，可以有效抑制銀擴散：因非晶質氧化矽可提高玻璃黏度、降低銀擴散動能，另外奈米非晶質氧化矽在達銀大量擴散溫度前，會慢慢結晶形成石英相（Quatz），阻絕原本融入玻璃體的銀繼續與玻璃體鍵結，因此可發現銀存在邊界約3μm距離，此區屬原本已融入玻璃體銀元素，在奈米石英相阻絕下抑制與其於玻璃體繼續擴散。
    銅共燒擴散反應與銀金屬不同，會形成銅化合物如Cu2MgO3、Ca2CuO3及Ca2MgSi2O7、Mg2SiO4、SiO2二次相，電極邊界元素不規則變化形成區塊性相分布，為抑制銅擴散需減少銅化合物Cu2MgO3、Ca2CuO3產生可能性，而添加4wt%氧化矽則可發揮抑制銀擴散相同機制，達到抑制銅擴散效果。
    最後以IEEE 802.11a 5.8GHz為目標規範，將CaMgSi2O6透輝石相玻璃陶製成LTCC微波天線，利用雙層介電質三層電極共燒，設計兩種激發模態使天線達寬頻化，而天線分別以不同程度銀擴散匹配製成元件，結果顯示材料設計對於元件製造非常重要，良好微波介電料開發及匹配可以發展優越微波通訊元件。而本研究中利用透輝石相玻璃陶瓷添加氧化矽(4wt%)抑制銀擴散製作優良匹配LTCC天線，其特性，反射損耗：-27.19dB、中心共振頻率：5.43GHz、頻寬：135MHz、增益：2.47dB、效率47.85%。

    The object of this study is to investigate the microwave dielectric materials used in the development of high-frequency components production. Diopside glass ceramics with low dielectric constant (k), high quality factor (Qxf) and low resonance frequency temperature coefficient (τf) is suitable for be used in the microwave circuit elements. Development the material system which can co-fired well with a silver and the copper electrodes,and manufactured microwave components by low temperature co-fired ceramic, were also carried out in this work .
    First, to establish applicability of CaMgSi2O6 in microwave components, making the cylinder CaMgSi2O6 fed into special circuitry to formed dielectric resonator antenna, designed outstanding antenna elements by using high quality factor material. Diopside sintered in atmospheric and in nitrogen, which S11 reflection coefficient are -12.008dB, -12.679 dB; efficiency 75.08%, 82.59%, respectively, showing excellent device characteristics.
    Furthermore, explore the co-firing effect with a silver and a copper in this system, however. Different from other LTCC material systems, Diopside ceramic glass is a highly crystalline materail, and the silver spread with glass bonding after oxidized, so the silver be pushed to the glass substrate in the bonding process, after precipitation, the silver will be distributed in electrode boundary by irregular flakes way, in the 900oC, 2hr sintering. Silver will spread to the glass ceramic body 60μm, and exist in the diffusion body about 45% by evaluated in quantitative Phase. On the other hand, in order to solve the problem of silver diffusion, this study added amorphous silicon oxide according to the literature. It can be effectively suppressed diffuse of silver when the amorphous silicon oxide is added, because the amorphous silicon oxide can increase the glass viscosity, reduced the kinetic energy of silver diffuse. In addition, before the nano amorphous silicon oxide particles reached the temperature of a large number of silver diffusion, it was gradually crystallized into quartz phase (Quartz) to block the silver which already integrated into the vitreous continue bond with the vitreous. So can be found the silver in the electrode boundary(3μm).Additionally, magnesium zinc silicon ceramics can reduce the amount of material in the vitreous, but it still can't suppressed the silver diffusion effectively.
    The diffusion reaction with the Copper is different from the silver metal,it will form copper compounds as Cu2MgO3, Ca2CuO3 and Ca2MgSi2O7, Mg2SiO4, SiO2 secondary phase, irregular changes of electrode boundary element formed block distribution. To suppress copper diffusion need to reduce the possibility of produced Cu2MgO3 and Ca2CuO3, when adding 4wt% silicon oxide, can be used in suppressed the diffusion of copper, using these method the boundary element distribution significantly.
    Finally, as IEEE 802.11a 5.8GHz as target specification to manufacture LTCC antenna by CaMgSi2O6, designed the broadband antenna using adjacent mode, and different degrees of diffusion of silver. In the result, making outstanding LTCC antenna by using CaMgSi2O6 added silicon oxide (4wt%) to suppress the diffusion of silver, the reflection loss: -27.19dB, center resonance frequency: 5.43GHz, Bandwidth: 135MHz, gain: 2.47dB, efficiency: 47.85%. Therefore, the excellent microwave dielectric electrical materials development and matching can develop a superior microwave communications component

    摘要 目錄 圖目錄 表目錄 第一章 緒論 1-1 背景 1-2 目的 第二章 文獻回顧 2-1 微波介電材料的特性與原理 2.1.1介電原理與性質 2.1.2品質因子 2.1.3共振頻率溫度係數 2.1.4微波材料量測技術 2-2 微波介電材料系統的發展 2-2-1 HTCC高溫共燒陶瓷系統之微波介電材料 2-2-2 LTCC低溫共燒陶瓷系統之微波介電材料 2-3 透輝石相玻璃陶瓷材料系統設計 2-3-1透輝石相之化學成分與結晶構造 2-4 微波天線 2-4-1天線規格 2-4-1-1阻抗匹配(Impedance) 2-4-1-2諧振頻率 2-4-1-3頻寬 2-4-1-4輻射場型 2-4-1-5天線效率與增益 2-4-2DRA天線 2-4-3 LTCC天線 2-5 LTCC製程應用與問題 2-5-1薄帶漿料配比與收縮 2-5-2電極匹配與擴散 2-5-2-1電極銀擴散 2-5-2-2抑制電極銀擴散 第三章 實驗流程與分析方法 3-1 不同介電常數試片製備過程 3-2 DRA天線製作 3-3 薄帶製作 3-3-1漿料配比 3-3-2刮刀成型 3-3-3熱疊壓 3.4 實驗儀器與規格 3.5 材料性質量測方法 3.5.1 SEM/BEI 微觀分析 3.5.2 XRD相結構分析 3.5. 3 品質因子與介電常數量測 3.5.4 共振溫度頻率係數量測 3.5.5天線s參數量測與輻射場型量測 第四章 結果與討論 4.1 透輝石相玻璃陶瓷DRA天線製作 4.1.1透輝石相玻璃陶瓷DRA天線噴膠黏貼 4.1.2透輝石相玻璃陶瓷DRA天線不導電膠黏貼 4.1.2.1開槽饋入(slot) 4.1.2.2圓圈饋入(circle) 4.1.3DRA天線微波場型與效率量測 4.2 透輝石相玻璃陶瓷薄帶特性與電極匹配 4.2.1透輝石相玻璃陶瓷燒結與疊壓 4.2.2透輝石相玻璃陶瓷銀電極擴散與抑制 4.2.2.1透輝石相玻璃陶瓷銀擴散 4.2.2.2透輝石相玻璃陶瓷材料改質抑制銀擴散 4.2.2.3透輝石相玻璃陶瓷抑制銀擴散 4.2.3透輝石相玻璃陶瓷銅電極擴散與抑制 4.2.3.1透輝石相玻璃陶瓷銅電極擴散 4.2.3.2透輝石相玻璃陶瓷抑制銅擴散 4.2.4電極表面分析 4.3 透輝石相玻璃陶瓷低溫共燒天線 4.3.1低溫共燒設計條件 4.3.2透輝石相玻璃陶瓷銀擴散效應與雙模態天線特性 4.3.2.1雙模態天線銀擴散 4.3.2.2銀擴散與雙模態天線阻抗匹配 4.3.2.3銀擴散與雙模態天線增益與效率 4.3.2.4銀擴散與雙模態天線特性 第五章 結論 第六章 參考文獻 附錄

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