研究生: |
陳瑋呈 Wei-Cheng Chen |
---|---|
論文名稱: |
同步式與分段式互穿網型結構之環氧樹脂/交鏈CTBN奈米複材之微相形態及其性質研究 Morphologies and properties of the IPN-structured epoxy resin/vulcanized CTBN nanocomposites through sequential and simultaneous processes |
指導教授: |
許應舉
Ying-Gev Hsu |
口試委員: |
謝國煌
Kuo-Huang Hsieh 林河木 Ho-Mu Lin 黃介銘 Jieh-Ming Huang 陳耿明 Keng-Ming Chen |
學位類別: |
碩士 Master |
系所名稱: |
工程學院 - 材料科學與工程系 Department of Materials Science and Engineering |
論文出版年: | 2008 |
畢業學年度: | 96 |
語文別: | 中文 |
論文頁數: | 66 |
中文關鍵詞: | 互穿型網狀高分子 、環氧樹脂 、交鏈CTBN 、穿透式電子顯微鏡 、拉伸韌性 |
外文關鍵詞: | Interpenetrating polymer networks, epoxy, Cross-Linked CTBN, TEM, tensile toughness |
相關次數: | 點閱:272 下載:3 |
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本研究將鄰-甲酚環氧樹脂(o-cresol novolac epoxy resin, CNE)、4,4’-二胺基二苯基碸(4,4’-diamino diphenyl sulfone, DDS)、2-甲基咪唑(2-methyl imidazole, 2-MI)、端羧基丁腈橡膠(carboxyl-terminated butadiene acrylonitrile rubber, CTBN)、過氧化苯甲醯基(benzoyl peroxide, BPO)混合均勻,調製成透明黏液─CNE/DDS/2-MI/CTBN/BPO─後加熱進行熱硬化反應,使CNE/DDS/2-MI及CTBN/BPO兩種不同機制的聚合反應以分段式或同步式引發相分離,製備二種系列─SEQ-IPN(sequential-IPN)及SIM-IPN(simultaneous-IPN)─之IPN結構Epoxy/CL-CTBN(Cross-Linked CTBN)奈米複材,以DSC、IR、TEM、SAXS、DMA、Instron與TGA等儀器測定SIM-IPN及SEQ-IPN系列複材之形態和各種物性。實驗結果發現,經由TEM與SAXS觀察分析,SIM-IPN系列複材中CL-CTBN是以奈米級尺寸分佈在環氧基質中,形成兩相互相穿梭程度高且非常緻密的微細構造;在DMA之分析測試中,SIM-IPN之α-relaxation peak形狀更為寬廣且Tg點更高,表示在相同硬化條件下其反應性更佳,架橋密度更高,影響所及β-與ω-relaxation的運動過程受到抑制,於tan δ曲線上較不顯著;而就熱安定性與拉伸韌性而言,SIM-IPN系列複材的特性均明顯優於相對應之傳統混掺與SEQ-IPN系列複材。
The interpenetrating-network-structured (IPN-structured) epoxy resin/vulcanized CTBN composites were prepared. By in situ heat-curing the homogeneous mixture of o-cresol novolac epoxy resin (CNE), 4,4’-diaminodiphenyl sulfone (DDS), carboxyl-terminated butadiene acrylonitrile rubber (CTBN), 2-methyl imidazole (2-MI), and benzoyl peroxide (BPO) via respective sequential and simultaneous processes involving chemically induced phase separation (CIPS), the nanocomposites with different morphologies were afforded. The epoxy network was obtained by step-growth polyaddition polymerization of CNE and DDS catalyzed by 2-MI, while the vulcanized CTBN network was obtained by free radical polymerization of CTBN initiated by BPO. The morphologies and properties of the IPN-structured nanocomposites from the two different processes were investigated and analyzed by DSC, IR, TEM, SAXS, DMA, Instron, and TGA...etc. It was found that for the nanocomposites, SIM-IPN (simultaneous-IPN) series, obtained from the simultaneous process, the nanometer-sized domain of the dispersed vulcanized CTBN in the CNE/DDS matrix was smaller and evener than that of nanocomposites, SEQ-IPN (sequential-IPN) series, obtained from the sequential process. The properties such as dynamic mechanical property, thermal resistance, and tensile toughness of the SIM-IPN series were improved and enhanced more significantly than that of the SEQ-IPN series and the conventional blends.
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