針對異方性導電膜（Anisotropic Conductive Film, ACF）未來應用之需求，期望開發出能快速硬化，儲存壽命長之配料系統，並能符合應用之性能。
　　本研究選用咪唑化合物做為環氧樹脂之硬化劑。使用濕式研磨機降低硬化劑粒徑達奈米級，再以噴霧乾燥法製備微膠囊。咪唑之結構是利用傅立葉轉換紅外線光譜儀進行官能基分析及鑑定；利用熱重損失分析儀、熱示差掃描量熱儀與熱機械分析儀進行熱性質及熱機械性質之分析；以動態光散射儀及掃描式電子顯微鏡進行粒徑及型態學分析。
　　物理學方面，以動態光散射儀量測濕式研磨之粒徑變化，證實隨研磨時間增加，粒子逐漸變小達奈米級；掃描式電子顯微鏡觀察微膠囊表面型態為完整球體，可知硬化劑已完全包覆。熱性質方面，由熱示差掃描量熱儀及熱重損失分析觀察硬化劑經微膠囊化前後與環氧樹脂反應發現：經由微膠囊包覆，能夠有效延遲環氧樹脂與硬化劑反應時間，可經由選擇殼層材質，製備不同反應速率之潛在型硬化劑。

For the requirement and application of anisotropic conductive film (ACF) in the future, the development of ACF formulation is expected to be rapid hardening and long shelf life.
In this study imidazole compounds were employed to be hardener of the epoxy. Wet-milling method is used to reduce the particle size of hardener into nano-size scale; moreover the milled hardeners were microencapsulated by spray dryer. The chemical structures of imidazole compounds were characterized by Fourier Transform Infrared Spectrometer (FT-IR). The thermal properties and thermal mechanical properties of epoxy resin/hardener system were analyzed by thermogravimetric analysis (TGA), differential scanning calorimetry (DSC) and thermal mechanical analysis (TMA) respectively. In addition the particle size and morphology of epoxy resin/ hardener system were characterized by dynamic light scattering (DLS) and scanning electron microscopy (SEM) respectively.
DLS analysis showed that an increase in milling time causes the decrease in particle size to nano-size scale. SEM observation demonstrated the hardeners were fully-coated on PU as sphere-shape microcapsules. From DSC and TGA analysis, the reaction time of epoxy/hardener system increased due to microencapsulation and the latent hardener in varied reaction rate might be prepared from different microencapsule shell material.

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