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研究生: 洪伯賢
Bo-shian Hong
論文名稱: 鋯基非晶薄膜提升金屬玻璃基材之彎曲韌性及延性研究
Bending Toughness and Ductility Improvements of Bulk Metallic Glass by a Zr-based Glass-forming Film
指導教授: 朱 瑾
Jinn Chu
口試委員: 林原慶
none
鄭憲清
Shian-ching Jang
張銀祐
none
學位類別: 碩士
Master
系所名稱: 應用科技學院 - 應用科技研究所
Graduate Institute of Applied Science and Technology
論文出版年: 2010
畢業學年度: 98
語文別: 英文
論文頁數: 122
中文關鍵詞: 金屬玻璃彎曲試驗
外文關鍵詞: bending, metallic glass
相關次數: 點閱:236下載:1
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  • 本研究主要目標是探討金屬玻璃基材所使用之鋯基金屬玻璃薄膜(Zr53Cu29Al12Ni6),並改善其薄膜的附著力,從而提高金屬玻璃塊材之韌性。
    在這項研究中,金屬玻璃薄膜退火後所量測得到之電阻率結果與在DSC分析中所測量出來之過冷液相區(ΔT),兩者都擁有一個類似的的範圍結果。且在鋯基金屬玻璃塊材濺鍍上,厚度為200 nm之鋯基金屬玻璃薄膜和數個nm之Ti黏著層,經由四點彎曲試驗後可發現其彎曲應力值從~2.2提高至~3.9GPa。所以當濺鍍鋯基金屬玻璃薄膜和黏著層時,其應力值會大幅度的增加 (增加約為原本值之77%),彎曲韌性(toughness)亦巨幅增加至~20倍,且表面延伸率(surface strain)從未鍍膜的0%則增為12~14%,因而試片有塑性變形的產生。其中原因為在表面產生剪切帶時,張力的表面即會產生伸長的效應;剪切帶的數量隨塑性變形的增加而增加,其密度高達~36/mm2。隨後,在進一步形成一條主要之剪切帶或裂紋。
    鋯基金屬玻璃薄膜,其擁有之高韌性以及高強度之性質,致使可以防止剪切帶的傳播,從而來提高其基材之韌性。鋯基金屬玻璃薄膜有良好的性質可以阻擋金屬玻璃基材所產生之多數微小的剪切帶,進而防止主要金屬玻璃基材之剪切帶的傳播來防範全面性的破裂,由此提高其金屬玻璃基材之韌性。


    The primary objectives of this study are to investigate the use of the Zr-based metallic glass thin film (MGTF) as a promising coating film to enhance bending property of the bulk metallic glass substrate.
    In this study, the annealing resistivity of Zr53Cu29Al12Ni6 glasses forming film in the supercooled liquid region (ΔT, SCLR) reveals a similar ΔT range to that of DSC result. The Zr-based BMG substrate was coated with 200 nm thickness Zr-based thin film and a few nanometer thick Ti buffer layer, and its maximum four-point bending stress was improved noticeably from ~2.2 to ~3.9 GPa, an increase of ~77%. The toughness and surface strain are also significantly improved ~20 folds and to 12~14%, respectively.
    As a result, the occurrence of the shear bands on the tension surface can create surface offsets, which serve as potential crack-initiation sites. Subsequently, more primary, secondary and tertiary shear bands are formed to accommodate large bending strains. The shear bands are highly populated to ~36/ mm2 for the MGTF/Ti-coated BMG substrate. The high ductility and strength of MGTF can prevent the shear band formations which can enhance its bending property. The good ductility of the MGTF can be attributed to the multiplication of the shear bands in the substrate, which prevents a catastrophic failure by primary shear band formations and increases the ductility of the Zr-based BMG substrate.

    摘要 I Abstract II Acknowledgements III Contents IV List of Figure VI List of table X Chapter 1 Introduction 1 Chapter 2 Background 2 2.1 Bulk Metallic Glasses (BMGs) 2 2.1.1 The Evolution of Metallic Glasses 2 2.1.2 Supercooled Liquid Region (SCLR) 6 2.1.3 Glasses Forming Ability (GFA) 8 2.1.4 Atomic Structure of Metallic Glasses 12 2.1.5 Zr-based Bulk Metallic Glass 14 2.2 Mechanical Properties of Metallic Glasses 15 2.2.1 Shear Band and Shear Transformation Zones 15 2.2.2 Improvement Ductility of Metallic Glass 19 2.2.3 Bending Test 26 2.3 Metallic Glass Thin Films (MGTFs) 29 2.3.1 Thermal Stability 31 2.3.1 Mechanical Properties 31 2.3.2 Adhesion Properties 34 2.3.3 Electrical Resistivity of MGTF 36 2.4 Sputter Deposition: a Physical Vapor Deposition (PVD) Method 38 2.4.1 The Principle of Sputtering 38 2.4.2 Vacuum Technology and Sputter Deposition 41 2.4.3 DC and RF Sputtering 43 2.5 Mechanical Property Improvements with Coatings 46 Chapter 3 Experimental Procedures 48 3.1 Preparation of Target and Substrate 48 3.2 Fabrication of Thin Films 50 3.3 Four-Point Bend Test 54 3.4 Material Characterizations 58 3.4.1 Electron Probe Micro-Analysis (EPMA) 58 3.4.2 X-ray Diffractometry (XRD) 59 3.4.3 Differential Scanning Calorimetery (DSC) 60 3.4.4 Scanning Electron Microscopy (SEM) 61 3.4.5 Measurement of Electrical Resistivity 62 3.4.6 Transmission Electron Microscopy (TEM) 63 3.4.7 Measurement of Film Adhesion 64 Chapter 4 Results and Discussion 65 4.1 Chemical Analysis (EPMA) 65 4.2 Crystal Structure (XRD) of MGTF 66 4.3 Thermal Analysis (Differential Scanning Calorimetry) of MGTF 68 4.4 Electrical Resistivity of MGTF 70 4.5 Adhesion Test of MGTF on BMG Substrate 72 4.6 Microstructure (TEM) and XRD of BMG Substrate 73 4.7 Bending Stress-surface Strain Result of BMG Substrate 75 4.8 Scanning Electron Microscopy (SEM) Observations 87 4.8.1 Microstructure on Tension Surface 87 4.8.2 Shear Band Formation 92 4.8.3 Fractography 98 4.8.3.1 Fracture Mode 98 4.8.3.2 Melting in the Fracture Region 100 Chapter 5 Conclusions 103 References 105

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