半導體封裝製程設備是技術與資本密集的產業，企業一直在面對景氣循環多變且競爭激烈的市場，考驗著企業經營的應變能力。當未來的不確定性越高，一般企業在進行投資規劃會採用保守原則，以避免發生產能過剩的情況，但也可能發生產能不足的情況。以半導體封裝製程設備業來說，為了取得營運彈性，會減少固定資產投資，採用外包策略解決產能資源不足問題。
半導體封裝製程設備產業之外包作業有其特異性，本研究主要針對該產業常遭遇的問題進行探討，分析其外包類型及外包考慮因素，探討不同外包模式的評量準則及應用方式，提供半導體封裝製程設備製造業者進行外包作業規劃的決策參考，採用最適合外包模式取得最佳利益。

Semiconductor IC assembly process equipments, such as plastic encapsulation machine, top laser marking machine, trim and form machine, etc., is a capital & technology intensive industry. The industry is always facing the business cycles, the very competitive marketplace and the adaptability to changes in business. For resolving the issue of uncertainty in the future, the industry will stay conservative on their investment policy in fixed assets to avoid the situation of capacity surplus. However, it is quite possible that capacity gap will happen too. Take IC assembly process equipment industry as an example, in order to get business flexibility, it is a good policy to reduce the investment dollars in fixed assets and take subcontracting strategy to solve the capacity gap issue.
There are a few specific characteristics in the subcontracting procedure of IC assembly process equipment. This study is aimed at three aspects. The 1st Frequent encountered questions in this industry, The 2nd Analysis subcontracting types & its consideration factors, The 3rd Discuss the evaluation system for each subcontracting type & its ways of application and this study also provide the IC assembly process equipment supplier a decision marking process for subcontracting planning use and find out the most appropriate subcontracting type for obtaining the best profit purpose.

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