本論文利用低壓電漿聚合技術製備含胺基之薄膜，並直接使金屬離子螯合於薄膜，進而還原成金屬奈米粒子；利用此種製程，可製備具抗菌效果的複合薄膜並可應用於化學鍍銅程序，省略敏化及活化步驟，直接將此高分子金屬複合薄膜作為化學鍍銅的材料。在製備電漿聚合正庚胺薄膜實驗中，本研究以橢圓偏光儀定量分析了薄膜厚度並得到在實驗參數（電漿聚合操作壓力：200 mTorr，使用功率： 40 W，前驅物加熱溫度： 40 ˚C）下的沉積速率約為4 nm/min；以ATR-FTIR分析薄膜表面的化學鍵結組成可以在沉積時間5分鐘至90分鐘下製備出之正庚胺薄膜皆具胺官能基訊號。
　　在以硼氫化鈉以及熱還原兩種方法製備正庚胺＠銀後，以掃描式電子顯微鏡可以觀察到電漿聚合正庚胺薄膜表面具有均勻分布的奈米銀粒。在以此二種還原方法製備之複合薄膜中皆可觀察到在電漿沉積時間較短的薄膜表面具有粒徑約50奈米之銀粒子；在電漿沉積較長的薄膜表面具有粒徑約20~30奈米之銀粒子。
　　在光學密度式抗菌測試結果中，正庚胺＠銀複合薄膜的抑菌能力明顯優於未處理之電漿聚合正庚胺薄膜。其中，使用以硼氫化鈉還原法製備之正庚胺@銀複合薄膜抑制大腸桿菌時抑制率可達70.1 %；抑制金黃色葡萄球菌之抑制率可達68.2 %；以熱還原法製備之正庚胺@銀複合薄膜抑制大腸桿菌時抑制率可達70.3 %；抑制金黃色葡萄球菌之抑制率可達28.2 %。
　　在以正庚胺@銀複合薄膜作為化學鍍銅基材之實驗中，可以直接以複合薄膜作為以活化表面之基材並成功於表面製備出銅層，以四點探針分析銅層電學性質，可以得到與金屬銅非常相近之導電度；亦可以利用固體膜具製造出具有形狀排列之銅層。

In this study, a plasma polymerized thin film (pp-thin film) containing amine functionalities was reported to show antibacterial properties against the colonization of E. coli and S. aureus and also applied in copper electroless plating. In addition, the plasma polymers revaled the feasibility to integrate silver nanoparticles by directly reducing metal ions in two methods. The precursor utilized for plasma polymerization was heptylamine in order to generate amine-containing matrices. The subsequent immersion of the amine functionalized pp-thin films in metal salt solutions allowed the formation of amine-metal complexes Ag@HApp flims. The results obtained by SEM analyses revealed clearly that the existence of the spherical Ag particles on the pp-thin films associated closely to the thickness of the prepared pp-thin films , the reducing method, and the time period for immobilization. The results showed that the Ag@HApp films possessed 70.1 % and 68.2 % antibacterial ability against to E. coli and S. auresus, respectively. In addition, Ag@HApp can serve as the activated surface to do Cu electroless plating. The electrical properties of Cu layer were analyzed by four-point probe and showed that there are almost no differences between Cu layer and bulk Cu metal. Moreover, the polymeric film between Cu layers and substrate can be the adhesion promoter layer.

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