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研究生: 王育
Yu-Wang
論文名稱: 利用模流分析發展膠芯製造策略
Development of manufacturing strategies using plastic simulation analysis
指導教授: 施劭儒
Shao-Ju-Shih
口試委員: 王丞浩
Chen-Hao-Wang
周育任
yu-jen-chou
學位類別: 碩士
Master
系所名稱: 工程學院 - 高階科技研發碩士學位學程
Executive Master of Research and Development
論文出版年: 2022
畢業學年度: 110
語文別: 中文
論文頁數: 151
中文關鍵詞: 連接器LCP液晶高分子翹曲模流分析射出機精密塑膠模具差異化
外文關鍵詞: Connector, LCP (liquid crystal polymer), Warpage, Moldex3D/mold flow analysis, Injection machine, Precision of plastic mold,, Differentiation
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近年來,從美中關稅貿易戰拉開全球電子產業競爭的序幕,致使全球產業鏈結構開始出現變化,直至Covid-19的全球爆發到後,疫情時代改變了全球人類的生活模式。受到上述影響,無論是工業應用、醫療、汽車、消費性以及涵蓋這些電子產品所需要的雲端設備、伺服器等硬體設備,都與連接器產品相關,這也讓連接器產品的相關需求日益提高,相對的品質要求也越來越高。
本文研究討論是以連接器塑膠零件做探討;透過模流分析發展史到目前模流分析的應用發展,以及當前模流分析關鍵的材料應用中,針對LCP(Liquid-crystal polymer)液晶高分子工程材料對5G網路設備應用發展的重要性,另外,也說明過去LCP液晶高分子在模流分析軟體應用中所遇到的瓶頸,在文中說明該瓶頸與模流分析軟體現狀,待解決的工作項目做交待。
再來透過第三章節的工具應用說明後,在第四章節會先做整個連接器產業,從個案公司開始做分析到周圍的競爭對手研發費用比率以及公司的核心競爭價值比較後,利用PEST(政治、經濟、社會與技術)、五力分析、SWOT(優勢、劣勢、機會、威脅)以及BCG矩陣(波士頓矩陣)分析,把這些分析工具中的內容融合彙整為以伺服器相關之關鍵應用的連接器作為模流分析技術發展連接器精密塑膠模具製造技術的策略規劃藍圖(T-Plan),在T-Plan中,會從短期的材料的發展融入模流分析軟體後,到中長期後的射出機之機台鑑定與連接器精密塑膠模具的技術做結合,透過技術策略藍圖規畫後,可以做出與連接器產業的差異化,走出紅海競爭環境,航向藍海市場的邊緣。


In recent years, US-China Trade War reshapes the global electronics supply chain until Covid-19 changed the world. Semiconductors are integral in producing essential electronic circuit components, which are found in the wide range of consumer electronics, such as industrial applications, medical, automotive, consumer, and cloud devices, servers, and other hardware needed to cover these electronic products. Especially, this also increases the related demand for connector products, and the relative quality requirements are also getting higher and higher.
The connector of LCP (Liquid-crystal polymer) housing with the mold flow / Moldex3D analysis development for 5G (5th generation mobile networks) impacts transmission signal due to the plastic warpage issue. Through the current status, bottlenecks of Moldex3D analysis explanation, and the progress need to be solved. These references were introduced in Chapters 1 and 2.
By the related tools in chapters 3 and 4, this thesis used the PEST (Political, Economic, Social, Technological), SWOT (Strength, Weakness, Opportunity, Threat), BCG matrix and financial analysis for individual companies and competitors. Finally, the thesis integrated all the tools into a T-Plan (Technology roadmaps, TRMs), and then the differentiation from the connector industry can be made. The targeted company will be out of the red sea competitive environment and be sailing to the edge of the blue sea market.

摘 要 Abstract 誌 謝 目錄 表目錄 圖目錄 第一章、 緒論 1.1 研究背景與動機 1.2 研究目的 1.3 論文架構 第二章、 文獻探討與技術分析 2.1 連接器產業產值與產業鏈近況說明 2.2 連接器零件與塑膠翹曲探討 2.3 模流仿真現有技術發展說明 2.4 模流仿真技術趨勢結論 第三章、 探究方法 3.1 市場競爭中企業資料方法與蒐集 3.2 探究範圍整理總掃描PEST 3.3 波特五力分析 3.4 企業內部分析優劣到外部契機威迫SWOT 3.5 布魯斯的矩陣圖BCG產品定位分析 3.6 配合產品技術發展策略規劃藍圖(T-Plan) 第四章、 探究分析與規劃 4.1 連接器產業環境競爭力的企業分析 4.2 產品/塑膠模具對應模流分析開發策略跟佈局 4.3 模流分析精度提升及配合產品發展T-Plan 規劃 第五章、 結論 5.1 結論 5.2 未來建議方向 5.3 探究的限制 參考文獻

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