本研究主要是針對LED的設計參數-封裝矽膠與金線弧度的變化，利用高溫點亮測試及冷熱衝擊測試進行產品的可靠度驗證，找出該兩項參數與LED產品可靠度的影響性。兩款不同的封裝矽膠，首先以高溫點亮的老化測試進行試驗，由LED的溫度及電壓( DC Forward Current)兩項數值的變化，發現高溫點亮的測試方法並無法在短時間有效找出導致LED可靠度的變異；因而，接著採用高低溫急速變化的冷熱衝擊測試，驗證出該測試項目可以有效幫助於縮短試驗時間，找出LED的失效。
在第二項控制變數中，以冷熱衝擊測試來實驗4種不同的LED金線弧度設計的變化組合，由試驗找出其中最佳的設計。由測試結果發現，金線長度較長的兩種形式LED容易受到環境應力影響導致產品失效，而另外兩款的金線弧度設計，即Type C “chip與外圍電極連接弧度小，chip與chip連接弧度正常”以及Type D “chip與外圍電極連接弧度正常，chip與chip連接弧度小”，則是可以完全的通過冷熱衝擊測試。

This study focuses on the design parameters of silicone packages materials and gold wire bonding on performance of LED modules; we used the high-temperature aging testing and thermal shock testing to verify the reliability testing criteria of LED modules. First, doing the high temperature aging testing with different LED packages materials, during the testing observing the values of LED's temperature and the forward voltage, based on the testing records from the tests it shows that the high-temperature testing couldn’t point out the failure of the LED modules properly during while testing; but after using of the thermal shock test, it is more effectively to find out the failure of LED modules in the short time.
Secondly, to do the thermal shock testing with four different types of gold wire bonding design, accounting to the testing and validation results that we find out the better way are the two types of golden wire bonding design; they are Type C and Type D.

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