摘 要
從人類開始使用電腦以來，個人電腦的計算能力就不斷的增強，相對的，功耗與散熱問題變成為不容回避的問題。一般說來，PC內的主要的熱源來自於CPU、主機板(南橋、北橋及VRM部分)、顯示卡以及其他部件如硬體、光碟機等，這些原件在運作時消耗的電能會有相當大的一部分轉化為熱量。
原件的工作溫度直接決定其使用壽命和穩定性，為了要讓PC各部件的工作溫度保持在合理的範圍內，除了確認PC工作環境的溫度在合理範圍內之外，還必須要對其進行散熱處理。尤其對CPU而言，如果用戶進行了超頻，要保證其穩定地工作更必須有效地散熱。
為了有效的將熱傳遞到散熱片或散熱模組，因而產生各式各樣導熱材料，其中常見有導熱膏、導熱墊片及相變化材料等。這些材料都是利用有機與無機材料加以混合、有效的分散，然後成型，利用有機材料的一些加工特性，如矽樹脂的耐溫性及塗佈性，配合無機材料的良好散熱特性，達到解決電子元件散熱的需求。
本論文著重在於相變化材料，主要在於相變化材料有較優於導熱膏的操作性，且比導熱片有較佳的導熱效果。最常見的高導熱相變化材料主要以日本、美國為主，台灣幾乎無相變化材料。本研究希望藉由(1)不同的高分子對相變化材料相變化點影響，找出最合適的高分子基底。(2)不同的金屬成份與高分子基底的組成，找出最佳化的成份與比例，並達到有效的導熱效果。
在測試方面藉由ASTM-5470的熱傳導量測儀及散熱模組的實驗量測加以驗證，並平行比較其他業界材料，驗證其化學特性，可以得到最佳化的相變化材料。

Abstract
The human began using computers, PC computing power continues to increase, the relative power and cooling issues become unavoidable. Generally speaking, the PC main heat source from CPU, motherboard ( Northbridge and southbridge, VRM part ), display adapters, and other components such as hardware, optical drives, and so on, these original operation consumes a substantial part of it into heat.
Original operating temperature directly to determine their service life and stability, in order to allow various parts PC working temperature remains within reasonable limits, in addition to confirm PC working environment temperature within reasonable limits, you must to thermal processing. Especially for CPU, if the user is overclocked to guarantee their stable work more effective heat dissipation.
To effective heat transfer to the heat sink or heat radiation module, a wide range of thermal interface material, thermal paste, are common conductive gasket and phase change materials, etc. These materials are the use of organic and inorganic materials are mixed and effective decentralization and shaping, the use of organic materials some processing characteristics, such as silicone resin temperature resistance and coating of the inorganic materials with good thermal properties, to address the needs of the electronic component cooling.
This paper focuses on phase change materials, is principally a phase change material than heat conduction paste operations, and the ratio of heat sink a better thermal effect. The most common phase change materials with high thermal conductivity are mainly to Japan, America, and Taiwan almost no phase change materials.This study from (1) different polymer materials for phase change, phase change points to identify the most appropriate polymer substrate. (2) Different metal components and the composition of the polymer substrate, find out the optimization of composition and proportions, and achieve effective heat conduction.
In testing by ASTM-5470 volume meter of heat conduction and thermal module of experimental measurements to verify.

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