本研究解決高熵合金在製程加工上的困難，提供一種新型製程方式獲得具有優異精度的小型客製化高熵合金，同時解決金屬在數位光處理列印因附著力不足導致的未完成部件掉落，並進一步討論高熵合金層厚設定對生胚之影響、固含量提升對固化深度和燒結收縮之影響。
　　高熵合金因其獨特的四大效應和優異的性能，在近幾年獲得大量學術和業界的關注，然而具有高混合熵之原因，使其擴散速度極為緩慢，運用傳統加工容易在冷卻速度不夠的情況下，由於元素間的差異，易使缺陷和相偏析產生，因此有必要開發新的加工方式，為此增材製造提供可行的方法，首先透過氣體霧化法獲得小粒徑高熵合金，因其快速冷卻，內外冷卻速率接近等優點，降低元素間的差異，以降低缺陷產生，後續透過數位光處理列印，由於使用光固化的方式成形，在樣品製程中不會因為溫度而影響其微觀結構，且先前陶瓷數位光處理列印技術發展較為成熟，同時比起其他增材製造具有較高列印速度和精度，因此使用數位光處理列印高熵合金被視為一個具有潛力的研究方向。
　　根據實驗結果，添加多官能基單體有助於提高寡聚物固化性質，然而添加過多會使材料脆化，當 TMPTA 30 wt%、7201M 60 wt%、TPO 10 wt% 時具有最佳附著力，高熵合金列印層厚在 1/2 固化深度能在具有最少尺寸變形同時確保每層的結合強度，當層厚設定少於 1/2 時會因為光折射和反射導致生胚周圍固化產生毛邊，大於則會因貼附不良導致層與層分離，而固化深度隨著固體含量增加而下降，燒結收縮量則會隨固體含量增加而減少，由於固化深度的限制，若單純提高曝光時間，讓高固體含量獲得相同的固化深度會使懸浮液過度固化，導致尺寸變形，因此透過改變每層厚度控制固化能量，同時使用軟體補償，最終在 60 vol% 固含量下可獲得尺寸變形量 0.8% 燒結收縮量 3.98% 之高熵合金成品，並對不同固體含量塊材燒結形貌進行分析，後續使用相同方式，成功列印出 100、200 μm 線徑。本研究提供一種新方式製備高熵合金，有助於解決高熵合金製程的難處，有望提升高熵合金應用價值和領域，並能以此為基礎製造精密高熵合金零件。

　　This study addresses the difficulties encountered in the processing of high-entropy alloys and proposes a novel manufacturing approach to obtain small-sized customized high-entropy alloys with excellent precision. It also addresses the issue of incomplete part retention in metal-based DLP (Digital Light Processing) printing due to insufficient adhesion. Furthermore, the influence of layer thickness setting on the size deformation of printed specimens and the shrinkage during sintering is discussed.
　　High-entropy alloys have gained significant academic and industrial attention in recent years due to their unique four major effects and outstanding properties. However, the high mixing entropy hinders diffusion, leading to the formation of defects and phase segregation under conventional processing methods when cooling rates are insufficient. Therefore, it is necessary to develop new processing techniques, particularly additive manufacturing, to provide feasible solutions. Initially, gas atomization is employed to obtain small-sized high-entropy alloy powders, which exhibit advantages such as rapid cooling and similar cooling rates inside and outside the particles, thus reducing element segregation and minimizing defect formation. Subsequently, digital light processing (DLP) printing is utilized, which utilizes light-induced curing to shape the samples without temperature-related effects on their microstructure. Additionally, ceramic DLP printing technology is more mature compared to other additive manufacturing methods and offers higher printing speed and precision. Therefore, DLP printing of high-entropy alloys is considered a promising research direction.
　　According to the experimental results, the addition of multifunctional monomers contributes to the improvement of oligomer curing properties. However, excessive addition leads to material embrittlement. Optimal adhesion is achieved with TMPTA 30 wt%, 7201M 60 wt%, and TPO 10 wt%. Setting the layer thickness of high-entropy alloy printing at 1/2 of the curing depth ensures minimal size deformation and maintains bonding strength in each layer. When the layer thickness is set below 1/2, edge defects occur due to light refraction and reflection during the solidification around the printed embryo. Conversely, a layer thickness greater than 1/2 results in poor adhesion between layers and layer separation. The curing depth decreases with an increase in solid content while sintering shrinkage decreases with an increase in solid content. However, due to the limitation of the curing depth, simply increasing the exposure time to achieve the same curing depth for high solid content would result in excessive solidification of the suspension, leading to size deformation. Therefore, controlling the curing energy by adjusting the thickness of each layer and employing software correction is necessary. Ultimately, a high-entropy alloy product with a size deformation of 0.8% and sintering shrinkage of 3.98% is obtained at a 60 vol% solid content. The sintering morphology of block samples with different solid contents is analyzed. Subsequently, 100 μm and 200 μm line diameters are successfully printed using the same approach. This study provides a new method for preparing high-entropy alloys, addressing the challenges encountered in their processing, and has the potential to enhance the application value and scope of high-entropy alloys, serving as a foundation for manufacturing precision high-entropy alloy components.

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