本論文呈現熱模擬分析在自然對流下冷卻的三種高亮度LED模組系統分別為3x3, 4x5, 7x7 LED晶片排列封裝在印刷電路板上，操作在不同的條件下之結果趨勢。評估LED模組系統輸入定額瓦數後使用熱電偶來量測溫度與模擬後熱源的分佈和熱的流動。主要設計執行封裝結構來研究熱源散佈的呈現，分析的結果顯示出晶片的封裝位置與接觸面積以及散熱鰭片大小，在LED封裝散熱上扮演著重要的角色。LED模組被建立成數值模型利用計算流體力學方法(computational fluid dynamics ; CFD)在自然對流下進行數值運算熱傳導過程，這熱傳導過程分析的研究目的是提供一個更詳細解釋LED模組在不同操作條件下的熱反應，將提供更準確的數據，在設定LED模組系統上給設計者採用設計的特徵與方向，有益於熱源管理的分佈使用更有效率執行。

This dissertation present a numerical study on heat transfer of validation natural convective air cooling of a high brightness 3x3, 4x5, 7x7 LED array package on a printed circuit board (PCB) during operation on difference conditions. Temperature distribution and heat flow of the LED modules are assessed by thermal profile measurement using a thermocouples and numerical method. Moreover, a design study on the thermal performance of the packaging structure is also performed. The analysis results show that the effect of LED’s chips position, contact areas and heat sink plays an important role in the heat dissipation of the LED modules. The heat transfer process of the LED modules system in natural convection is modeled and simulated using computational fluid dynamics (CFD) method. The proposed thermal analytical study provides a detailed understanding of the thermal response of an LED modules system under various operating conditions. The results provide criteria for setting up a LED modules system and for adopting design features that would be beneficial to effective thermal management.

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