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研究生: 葉至翔
JHIH-SIANG YE
論文名稱: 下照式光固化3D列印系統分離應力分析與研究
Research andAnalysis of Separating Stress on Bottom-Expose Stereolithography 3D Printing System
指導教授: 鄭正元
Jeng Ywam Jeng
口試委員: 蘇威年
Wei-Nien Su
江卓培
Cho-Pei Jiang
學位類別: 碩士
Master
系所名稱: 工程學院 - 機械工程系
Department of Mechanical Engineering
論文出版年: 2016
畢業學年度: 104
語文別: 中文
論文頁數: 89
中文關鍵詞: 光固化聚合技術分離應力懸浮帶電高分子導電高分子
外文關鍵詞: Vat polymerization, Separating Stress, Floating, Photocatalyst, conductive polymer
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  • 光固化3D列印試可分為上照式與下照式,下照式可以節省材料成本、速度快,但會產生分離應力,此力會導致建構失敗。本論文欲針對下照式光固化3D列印系統進行分析,探討如何降低分離應力。
    與現有商業機台相比,本研究系統架設於成型平台上加裝荷重元,以量測微電壓的變化,利用比例換算得到分離力,將其除以面積即得分離應力。
    因現有商業機台之底材大多為鐵氟龍膜,故本研究以鐵氟龍膜實驗數據作為比較基準。實驗方法使用水玻璃、瓊脂粉、矽膠薄膜、二氧化鈦作為底材、振動方法以及透過合成高電荷密度之樹脂單體或寡聚物作為光固化樹脂,於液態樹脂處建置一電場或磁場,經由控制電場或磁場之強度,使液態樹脂懸浮於空氣中,進而避免產生真空吸附力。
    研究結果顯示,矽膠薄膜與瓊脂粉為最佳方法,降低分離應力75%。


    Vat polymerization into upper-expose andbottom-expose, bottom-expose can save material, high speed, but incurredseparating stress, whichcause the failure of printing. The present study aim to explore the best method to reduce separating stress in the process of bottom-expose stereolithography 3D Printing System.
    The machine is not the same as machinesin the market, which have load cell to measure separating force,separating stress is separating force over curing area.
    The substrate of machines in the marketare mostly teflon film, thus, baseline data in this study was the experimental data of teflon film. The experimental method contained water glass, agarose powder, silicone film, titanium dioxide as a substrate, a vibration method and the synthesizing charged monomer or oligomer and set an electric or magnetic field to float the resin up to avoid stack on the tank.
    Compared all the experiment results, silicone film and agarose powder were the better methods, the effect of reduce separating stress was 75%.

    摘要 I Abstract IV 致謝 V 目錄 VI 圖目錄 IX 表目錄 XIII 第一章 緒論 1 1.1前言 1 1.2研究背景及目的 2 1.3論文架構 4 第二章 文獻探討 5 2.1積層製造技術 5 2.2下照式光固化DLP 13 2.2.1 DMD數位微鏡元件 16 2.3分離力的形成 20 2.3.1 市面上解決/降低分離應力之方法 23 第三章 下照式光固化3D列印系統分離力系統架設 29 3.1機台架設 29 3.1.1 投影機 29 3.1.2 S型拉壓荷重器 30 3.1.3紀錄器(放大器) 31 3.1.4 Z軸升降、成型平台 32 3.1.5 樹脂槽 33 3.2軟、硬體介紹 34 3.2.1 Arduino 34 3.2.2灰階與變形調校軟體 35 3.2.3光功率量測儀器(Power-meter) 37 3.3機台組裝 38 3.4 分離力之計算 39 第四章 實驗成果與討論 41 4.1分離力之實驗步驟 41 4.2物理方法 43 4.2.1 鐵氟龍膜 43 4.2.2 矽膠薄膜 45 4.2.3水玻璃與增稠劑 50 4.2.4瓊脂粉 54 4.2.5帶電樹脂 57 4.2.6振動 63 4.3化學方法 66 4.3.1 光觸媒 66 4.4結果與討論 68 第五章 結論 71 參考文獻 72

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