平板電腦為目前3C產品中最為流行產品之一，其輕薄，攜帶方便之功能最為消費者能接受，因此如何能使平板電腦更加輕薄是目前業界所要追求之技術。目前技術發展都是朝向薄型化導光板為主，但大面積導光板薄型化之後，使得傳統射出成型技術面臨了生產良率低及微結構轉移率差等技術瓶頸。
本論文將研究利用微奈米轉印技術應用於大面積超薄型導光板製作之可行性；首先利用光學軟體TracePro模擬分析出使其擁有高照度與均勻度之最佳化導光板，再以蝕刻方式將所設計之網點微結構製作成模仁。為縮短熱壓轉印時間及提高轉寫率，本研究設計可模組化自動鎖模保壓模具，利用此模具進行導光板之熱壓轉印，由實驗結果得知，使用適當之製程參數，熱壓轉印成型超薄型導光板網點微結構之轉寫率可達98%以上；將熱壓轉印製作出來之超薄型導光板放入本實驗所製作之背光模組中，量測其照度與均勻度，並探討分析實作之背光模組與光學最佳化模擬結果之差異。

Tablet PC is one of the most popular 3C digital products recently. It is thin, light and easy to carry and therefore attracts from consumers. How to make the tablet thinner and lighter is the technology to be pursued by industry. Current technology development is primarily toward the thin light guide plate (LGP). However, this trend causes a bottleneck of large area LGP production since the yield rate and microstructure transfer rate could be very low if ultra-thin light guide plates are fabricated by the injection methods.
In this thesis, we will research to fabricate a large area of ultra-thin light guide plates by the nanoimprint technology. In order to obtain an optimized ultra-thin light guide which has high illuminance and uniform, we used optical simulation software TracePro to analysis the microstructure pattern design, and used the etching method to fabricate the mold with the optimized design. This research designed an automatic holding pressure module in order to shorten the imprinting time and increase the transfer rate, and used the module to fabricate the LGP by hot embossing. According to the experiment results, we prove that the designed microstructures of ultra-thin LGP can be fabricated by hot embossing with the module and the transfer rate has been achieved over 98%. Then, we used the ultra-thin LGP fabricated by hot embossing into a backlight module to measure its illuminance and uniformity. The measured results have also been compared and analyzed with the optical simulation.

[1] http://finance.sina.com/bg/tech/sinacn/20110410/0154260910.html
[2] Y. Koyama, “Ray-Tracing Simulation in LCD Development”, Sharp Technical Journal, Vol., No.80, pp.51-55, 2001.
[3] T. Ide, H. Mizuta, H. Numata, and Y. Taira, “Dot pattern generation technique using molecular dynamics”, Journal of The Optical society of America, Vol. 20, No. 2, pp. 248-255, 2003.
[4] W.Y. Lee, T. K. Lim, Y.W. Lee, and I.W. Lee, “Fast ray-tracing methods for LCD backlight simulation using the characteristics of the pattern”, Journal of Optical Engineering, Vol. 44, No. 1, 014004, 2005.
[5] K. Kashima and N. Yoshida, Back lighting device for a panel, US pattern 5093765, 1992/3/3.
[6] 張自恭、林奇峰、方育斌，”背光模組光學設計”，光連雙月凼第49期, 2004。
[7] 方育斌， ”LCD背光模組之光學最佳化設計”，國立成凾大學，工程科學系，碩士論文，2004年。
[8] 林奕村，”利用田口方式進行背光模組之設計”，國立台灣科技大學機械工程系，碩士論文，2006年。
[9] S. Boxwell, S.G. Fox, and J.F. Roman, “Design and optimization of optical components using genetic algorithms”, Journal of Optical Engineering, Vol. 43, No. 7, pp. 1643-1646, 2004.
[10] L.J. Heyderman, H. Schift, C. David, J. Gobrecht, and T. Schweizer, “Flow behaviour of thin polymer films used for hot embossing lithography”, Microelectronic Engineering, Vol.54, No.3, pp.229–245, 2000.
[11] A. Lebib, Y. Chen , E. Cambril, P. Youinou, V. Studer, M. Natali, A. Pe′pin, H.M. Janssen , R.P. Sijbesma, “ Room-temperature and low-pressure nanoimprint lithography”, Microelectronic Engineering,Vol.61, pp. 371–377, 2002.
[12] T. Leveder , S. Landis , L. Davoust , N. Chaix, “Optimization of demolding temperature for throughput improvement of nanoimprint lithography”, Microelectronic Engineer,Vol.84, No.9, pp.953–957, 2007.
[13] J.M. Li, C. Liu, J. Peng, “Effect of hot embossing process parameters on polymer flow and microchannel accuracy produced without vacuum”, Journal of materials processing technology, Vol. 207, No.1,pp.163–171, 2008.
[14] K. Mohamed, M.M. Alkaisi, J. Smaill, “Resist deformation at low temperature in nanoimprint lithography”, Current Applied Physics, Vol. 6, No.3,pp.486–490, 2006.
[15] H.C. Scheer, N. Bogdanski, M. Wissen, S. MOllenbeck, “Imprintability of polymers for thermal nanoimprint”, Microelectronic Engineering, Vol. 85,No.5, pp.890–896, 2008.
[16] S. Lan, H.J. Lee, S.H. Lee, J Ni, X. Lai , H.W.Lee , J.H. Song ,M G. Lee, “Experimental and numerical study on the viscoelastic property of polycarbonate near glass transition temperature for micro thermal imprint process”, Materials and Design, Vol. 30, No.9, pp.3879–3884, 2009.
[17] T.E. Kimerling, W. Liu, B.H. Kim, D. Yao, “Rapid hot embossing of polymer microfeatures”, Microsystem Technologies, Vol.207, No.1, pp.730-735, 2006.
[18] S.K. Hong, Y.M. Heo, J.J. Kang, “Replication of polymeric micro patterns by rapid thermal pressing with induction heating apparatus”, 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, January 6-9,Sanya,China, 2008.
[19] S. Lan, H.J. Lee, E.H. Kim, J. Ni, S.H. Lee, X. Lai, J.H Song, N.K. Lee, M.G. Lee “ A parameter study on the micro hot embossing process of glassy polymer for pattern replication”, Microelectronic Engineering, Vol.81, No.12, 2009.
[20] http://www.apic.com.tw/products/cax_tracepro.html
[21] 謝天嘉, “LED 7吋背光模組的設計”，國立清華大學， 碩士論文，2007年
[22] 蔡宏營, “奈米轉印技術介紹”, 工研院機械所 中華民國力學學會會訊, 104期, 2003
[23] S.Y. Chou, P.R. Krauss, W. Zhang, L. Guo, and L. Zhuang, “Sub-10 nm imprint lithography and applications”, J. Vac. Sci Technol. B 15(6), pp. 2897-2904,Nov/Dec, 1997.