線鋸加工為製作半導體基板的一項重要製程之一，其中固定磨料鑽石加工有逐漸取代游離磨料鑽石加工的趨勢，原因在於切削效率的提升及汙染較少，但在固定磨料鑽石線材的品質評斷方面沒有一套明確的標準，故本研究期望利用實驗室開發的鑽石線材測試機進行A、K兩款固定磨料鑽石線材的評估測試，藉由不同時間參數的切削力觀測與切削位移量觀測，比較切削線材的切削效率 實驗後對於切削線材進行磨耗觀測，進而推導出磨削比的大小，最後針對切削力與位移量數據進行曲線擬合的處理，藉此開發出一套評估線材優劣的數學模型，利用此模型進行線材評估，縮短線材於開發技術上所需上機測試的時間。將擬合之結果與實驗數據進行比較，得知A線材在切削時，能夠得到較高的切削力，且磨耗量低於K線材，磨削比方面A線材是K線材的1.1~1.4倍，利用曲線擬合技術已成功開發出一套評斷線材切削效率及比較線材磨耗高低的數學模型，可以利用此模型進行線材優劣的評估分析，綜合實驗結果與曲線擬合結果，評斷出A線材的線材品質優於K線材，能產生較好的切削效率，以及較高的抗磨耗性，使線鋸切片過程的品質提升。

Wire sawing process is one of the most important process of making wafer substrate. Due to the fact that fixed diamond wire sawing has higher efficiency and less pollution. It is a trend that free abrasive wire saw is replaced by fixed diamond wire saw. Since there haven’t established a specific procedure to evaluate the quality of fixed diamond wire. Therefore, we evaluate and test the two types of fixed diamond wires. In this study with wire testing machine developed by our research group. By observing cutting force and slicing depth, we can compare the cutting efficiency of different wires. In this experiment, the grinding ratio is included by the observing wire’s wear loss and slicing depth. After testing, cutting force and slicing depth are analyzed with the curve fitting. In this way, a set of mathematic model can be developed to evaluate the quality of the wire. From the results, the wire A is better on cutting force and wear loss than wire K, and the grinding ratio of wire A is 1.1-1.4 times better than that of wire K. These results show that wire A is more efficient in slicing silicon ingot than wire K.

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