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研究生: 黃彥儒
Yan-Ru Huang
論文名稱: CMOS影像感測器之微型多層非球面透鏡組瑕疵檢測系統之開發與研究
Reaserch and Development of CMOS Image Sensor Micro Multi-Layer Nonspherical Lens Module Inspection System
指導教授: 郭中豐
Chung-Feng Kuo
口試委員: 黃昌群
Chang-Chiun Huang
趙新民
Shin-Min Chao
學位類別: 碩士
Master
系所名稱: 工程學院 - 自動化及控制研究所
Graduate Institute of Automation and Control
論文出版年: 2014
畢業學年度: 102
語文別: 中文
論文頁數: 98
中文關鍵詞: 瑕疵檢測亮度校正管制界限法區域成長支持向量機
外文關鍵詞: defect inspection, control limit method, illumination correction, region growing, support vector machine
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本研究針對互補式金屬氧化物半導體影像感測器(CMOS image sensor, CIS)微型多層非球面透鏡組開發一套光學檢測系統。因CIS微型多層非球面透鏡組之構造為多層非球面透鏡之組合,當光線透過非球面透鏡組時,會在不同層上發生折射及反射,導致所擷取之影像產生環形光暈,進而影響後續進行瑕疵判別,且為考慮拍攝影像時之影像清晰度與檢測之瑕疵大小,採用之鏡頭景深較淺(0.4mm)無法涵蓋整個樣本影像之高度(1.6mm),使得擷取到的影像無法一次性對待測物進行全檢。上述兩種情況都會使後續進行瑕疵檢測產生問題,因此本研究自行設計軟硬體設備,並搭配所開發的影像處理流程,進而克服上述問題並建立CIS微型多層非球面透鏡組之瑕疵檢測系統。
本研究提出一套CIS微型多層非球面透鏡組之瑕疵檢測演算法,主要分為三階段,第一階段為影像前處理,利用霍夫測圓進行影像定位並切割感興趣區間,接著使用single-scale Retinex(SSR)亮度校正法來消除或降低光暈現象所造成的亮度不均之問題;第二階段為瑕疵檢測流程,分為大範圍瑕疵及細微瑕疵之檢測流程。利用Kuwahara濾波器、管制界限法、影像遮罩、區域成長以及形態學等方法分割待測物上的瑕疵,並且為克服景深無法覆蓋待測物高度之問題,本研究自行開發實驗機台,利用Z軸移動平台進行多層影像的擷取,且為避免大面積瑕疵影響附近層所拍攝的成像品質,利用瑕疵完整度與其瑕疵銳利度來進行判別,藉此消除大面積瑕疵造成的影響,進而準確地對瑕疵進行分割並計算其特徵值;第三階段進行瑕疵辨識,利用支持向量機進行分類,實驗結果顯示,瑕疵分類準確率為97.97%,證實本研究所設計之軟硬體設備能有效的對CIS微型多層非球面透鏡組進行瑕疵檢測與分類。


This paper developed an optical inspection system of CMOS image sensor (CIS) micro multi-layer non-spherical lens module. However, the CIS lens module structure was multi-layer. When light passed through the non-spherical lens module, it will cause a halo because of reflection and refraction. It led defect is difficult to be found. When acquiring the image, the image resolution and size of defects needed to be considered. It caused the magnification lens’s depth of field does not cover the height of the inspected object. The mentioned two cases would be difficult to perform a follow-up defect detection so this paper developed solutions these problem, and developed a CIS micro multi-layer non-spherical lens module inspection system.
The CIS micro multi-layer non-spherical lens module inspection system consisted three main components: (1) Image preprocessing, (2) Defect inspection procedure, and (3) Defect recognition. The first component mainly used Hough transform to detect circle and to segment region of interest (ROI), and then amended illumination unevenness by using single-scale Retinex. The second component used the Kuwahara filter, control limit method, region growing, etc to segment the defect. In order to solve the problem of lens’s depth field not covering the inspected object’s height, the multi-image was acquired. This paper proposed a way to avoid major defect that influenced different layers image by judging defect unabridged rate and defect sharp rate, and calculated the defect feature. Finally, this study used a support vector machine to recognize different kinds of defect. The experimental result showed the accuracy of defect recognition is 97.97 %. This paper proposed an optical inspection system of CMOS image sensor micro multi-layer non-spherical lens module that effectively detected and recognized the defects.

摘要 I Abstract III 致謝 V 目錄 VI 圖目錄 X 表目錄 XIII 第1章 緒論 1 1.1 研究背景與動機 1 1.2 文獻回顧 3 1.2.1 自動化光學檢測系統 3 1.2.2 亮度校正 5 1.2.3 影像強化 7 1.2.4 分類器 8 1.3 研究目的 10 1.4 論文架構 11 第2章 CIS微型多層非球面透鏡組介紹 13 2.1 CIS微型多層非球面透鏡組之結構 13 2.2 CIS微型多層非球面透鏡組之製造過程 14 2.3 CIS微型多層非球面透鏡組製程中常見瑕疵 16 2.3.1 亮點及暗點 16 2.3.2 刮傷 17 2.3.3 異物 17 2.3.4 孔洞 17 2.3.5 缺口 18 2.3.6 殘膠 18 2.4 瑕疵定義 18 第3章 亮度校正 21 3.1 Retinex 演算法 21 3.1.1 Single-Scale Retinex 22 3.1.2 Multiple-Scale Retinex 24 3.1.3 MSR with Color Restoration 26 3.1.4 使用Retinex法之結論 27 第4章 研究方法 30 4.1 數位影像處理技術 30 4.1.1 數位影像表示方法 30 4.1.2 霍夫轉換 31 4.1.3 Kuwahara濾波器 34 4.1.4 區域成長 35 4.1.5 方向性區域成長 36 4.2 管制界限法 37 4.3 形態學 39 4.3.1 連通物件標記 40 4.3.2 膨脹 41 4.3.3 侵蝕 42 4.3.4 閉合與斷開 42 4.3.5 洞的填充 45 4.4 影像特徵 45 4.4.1 面積 46 4.4.2 長寬比 46 4.4.3 似圓性 46 4.4.4 平均灰階值 47 4.4.5 灰階差 47 4.5 支持向量機 47 4.5.1 線性支持向量機 48 4.5.2 非線性支持向量機 51 4.5.3 交叉驗證 54 第5章 實驗機台規劃與方法驗證 56 5.1 影像擷取系統與電腦硬體設備 56 5.2 實驗機台架構 57 5.3 瑕疵檢測流程 59 5.4 影像檢測流程 61 5.4.1 拍攝樣本影像 61 5.4.2 影像定位 63 5.4.3 亮度校正 64 5.4.4 缺口瑕疵檢測流程 64 5.4.5 殘膠瑕疵檢測流程 67 5.4.6 透鏡之細微瑕疵檢測流程 69 5.4.7 判別多層影像 69 5.4.8 瑕疵特徵分析 74 5.4.9 瑕疵分類 77 第6章 結論與未來研究方向 78 6.1 結論 78 6.2 未來研究方向 79 參考文獻 80

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