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研究生： 張素婧
Clarissa Changraini
論文名稱： 氣體種類效應於大氣電漿處理有機保焊膜/裸銅基板之研究
The Effect of Atmospheric Pressure Plasma with Various Gas Sources on Bare Copper with Surface Finishing OSP
指導教授： 郭俞麟
Yu-Lin Kuo
口試委員: Anak Agung Sagung Dewi Afiati
Anak Agung Sagung Dewi Afiati
顏怡文
Yee-Wen Yen
學位類別： 碩士
Master
系所名稱： 工程學院 - 機械工程系
Department of Mechanical Engineering
論文出版年： 2021
畢業學年度： 109
語文別： 英文
論文頁數： 108
中文關鍵詞： 常壓等離子體 、表面清潔 、氧化 、焊料潤濕性 、親水的 、疏水性 、金屬間化合物 、OSP 表面處理
外文關鍵詞： atmospheric pressure plasma, surface cleaning, oxidation, solder wettability, hydrophilic, hydrophobicity, intermetallic compound, OSP surface finishing
相關次數： 點閱：260  下載：0 
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    • 表面貼裝技術 (SMT) 是半導體器件中用於將電子元件連接到印刷電路板 (PCB) 表面的組裝方法。氧化層通常出現在PCB表面，導致潤濕性下降。在本研究中，APP 系統用於減少或去除 PCB 表面出現的氧化層。帶有有機可焊性防腐劑 (OSP) 表面處理的裸銅作為 PCB，以及來自 Nihon Superior Co., LTD 的 SAC 305（96.5% Sn、3% Ag 和 0.5% Cu）焊球作為焊接材料。該實驗使用帶有旋轉頭的大氣壓等離子體壓力噴射（APPJ）系統。 APPJ 使用四種不同的氣源，即壓縮乾燥空氣 (CDA)、H2O 蒸汽（CDA 作為主要氣體）、氮氣 (N2) 和與氫氣混合的氮氣 (N2/H2) 。本研究的目的是利用強大的方法即APP的離子轟擊過程來提高PCB的表面潤濕性，並觀察每種氣體源對PCB表面的影響。進行了光學發射光譜 (OES)、接觸角、光學顯微鏡、場發射掃描電子顯微鏡 (FE-SEM) 和 X 射線光電子能譜 (XPS) 分析。應用在這種帶有 OSP 表面處理的裸銅上的 APP 清潔處理顯著改善了潤濕性。分析結果表明，使用H2O蒸汽氣源的等離子體處理在提高表面潤濕性方面效果更好。

    The surface-mount technology (SMT) is the assembly method in semiconductor devices that used for connected the electronic components onto the printed circuit board (PCB) surface. The oxide layer usually occurred on the surface of the PCB which is caused a degradation of the wettability. In this study, APP system was used to decreasing or removing the oxide layer that occurred on the PCB surface. Bare copper with organic solderability preservative (OSP) surface finishing as a PCB, and SAC 305 (96.5% Sn, 3% Ag, and 0.5% Cu) solder ball from Nihon Superior Co., LTD for the soldering material. This experiment was used atmospheric plasma pressure jet (APPJ) system with a rotation head. The APPJ used with a four different gas sources i.e., compress dry air (CDA), H2O vapour (CDA as the main gas), nitrogen (N2), and nitrogen mixed with hydrogen (N2/H2). The objectives of this study are focused on improving the surface wettability of PCB utilizing the powerful method namely ion bombardment process of APP and observed the effect of each gas sources on the PCB surface. The optical emission spectroscopy (OES), contact angle, optical microscope, field emission scanning electron microscope (FE-SEM) and X-ray photoelectron spectroscopy (XPS) analysis was performed. The APP cleaning treatment that applied on this bare copper with OSP surface finishing given a significant improvement wettability. The analysis result shown that the plasma treatment using the H2O vapour gas source had the greater result in the term of improving the surface wettability.

    摘要 ii ABSTRACT iii TABLE OF CONTENT iv LIST OF FIGURES vii LIST OF TABLES x CHAPTER 1 1 1. 1 Background 1 1. 2 Research Objective 2 CHAPTER 2 3 2.1 Integrated Circuit History 3 2.2 Manufacturing of an Integrated Circuit Packaging 4 2.2.1 Wafer Fabrication (Front-End) Process 5 2.2.2 Assembly (Back–End) Process 8 2.3 Introduction of Surface Mount Technology, Solders and Soldering 13 2.3.1 History and Benefits 13 2.3.2 Surface Mount Soldering Process 15 2.3.3 Wave Soldering 16 2.3.4 Reflow Soldering 19 2.4 Soldering 21 2.4.1 Requirements of the Soldering Process 22 2.4.2 Solder Spreading 25 2.4.3 Metallurgical Properties of Solder 27 2.4.4 Intermetallic Compounds (IMCs) 32 2.4.5 Flux 38 2.5 Plasma – The Fourth State of Matter 43 2.5.1 History of Plasma 43 2.5.2 Fundamentals of Plasma 44 2.6 Atmospheric Plasma System 46 2.6.1 Dielectric Barrier Discharge Systems 49 2.6.2 Atmospheric Plasma Surface Modification Effects 50 CHAPTER 3 54 3.1 Design of Experiment (DoE) 54 3.2 Materials and Tools 55 3.3 Research Variables 59 3.4 Atmospheric – Pressure Plasma Jet (APPJ) Cleaning Methodology 59 3.5 Solder Ball Mounting Methodology 61 3.6 Material Analysis Equipment 61 3.6.1 Optical Emission Spectroscopy (OES) 61 3.6.2 Water Contact Angle Instrument 62 3.6.3 Optical Microscope (OM) 63 3.6.4 Field Emission Scanning Electron Microscopes (FE-SEM) 65 3.6.5 X-ray Photoelectron Spectroscopy (XPS) 66 CHAPTER 4 67 4. 1 Data Analysis of OES Result 67 4.2 Data Analysis of Contact Angle Result 71 4.3 Data Analysis of Optical Microscope 73 4.4 Data Analysis of Field Emissions Scanning Electron Microscopes 75 4.5 Data Analysis of X-ray Photoelectron Spectroscopy 78 4.6 Mechanism of Plasma Treatment 84 4.7 Chemical Reaction of Atmospheric Pressure Plasma 86 CHAPTER 5 89 REFERENCES 91

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