本論文依據不同高速傳輸介面，提出四款皆可應用於電子裝置之高速連接器，分別為RJ-45、USB Type-C、軟性電路板與板對板連接器、WiGig連接器。首先介紹連接器之基本特性與高速電路理論，建立相關觀念而有利於減少研發時間。同時與合作廠商之機構工程師共同研發，並應用電磁模擬軟體來分析連接器在高速訊號傳輸下之影響，進而改善其電氣特性，包含阻抗調整、傳輸路徑優化與串音干擾防治等，以達到符合規範之設計。第一款連接器為符合10GBASE-T之直立式RJ-45母端連接器，其四通道總傳輸速率可達10Gbps。此外亦提出一款以PCB板實現理想公端，可做為公端測試板，使RJ-45模組可應用於乙太網路銅纜傳輸。第二款為USB Type-C連接器，符合USB 3.1 Gen2規範，其單通道傳輸速率可達10Gbps，主要為解決高速模轉換問題。第三款為軟性電路板與板對板連接器，可應用於USB Type-C母端與系統板間良好訊號傳輸之連接方式。最後一款為WiGig連接器，隨著第五代行動通訊相關應用逐漸出現於市場，取代Wi-Fi之WiGig為其中之一，為毫米波無線網路傳輸介面，其應用頻段在60Ghz而傳輸速率可達7Gbps。本論文所提出之概念與方法可應用於電子裝置之高速連接器設計，來提升其高速訊號傳輸品質，期望能為連接器產業帶來更大效益。

This thesis proposes four high speed connectors for electronic devices depending on different high speed transmission types. First, this study introduces the basic characteristics of the connector structures and high frequency theory to establish those concepts. It is helpful for reducing research and design time by working together with mechanical engineers from a cooperated company. In the meantime, all proposed designs use an electromagnetic simulation software to analyze their performance at high speed transmission and develop the product which can satisfy electronic specifications including good impedance matching, low transmission loss and minimal crosstalk. The first proposed design is a vertical RJ-45 receptacle, which is based on 10GBASE-T with a four-channel date rate up to 10Gbps. Besides, this section also implements the idea plug using three-layers PCB. It can be used to plug a test board and validate the RJ-45 module for Ethernet. The second one is USB Type-C, which is based on USB 3.1 Gen 2 and the data rate is up to 10Gbps per channel. This study focuses on solving the mode conversion issue. The third one is FPC and board to board connector, which is to connect between USB Type-C receptacle and phone system board. The final one is WiGig connector. More and more applications appear at the market due to the 5th generation mobile network, including WiGig, which operates at 60GHz with a wireless date rate up to 7Gbps. It may replace Wi-Fi and is ten times faster than Wi-Fi. The proposed concepts and methods in this thesis may be applied to electronic devices for improving their quality to bring benefits to connector industry.

[1] 許葆鑫，「應用於光纖與乙太網路之高速連接器」，國立臺灣科技大學，中華民國104年7月。
[2] 正淩科技，「連接器接腳技術參考資料」。
[3] D.M. Pozar, Microwave Engineering, 4rd ed, John Wiley & Sons, Nov. 2011.
[4] E. Bogatin, Signal Integrity-Simplified, Prentice Hall, 2003.
[5] H. Johnson, M. Graham, High-Speed Signal Propagation Advanced Black Magic, Prentice Hall PTR, 2003.
[6] Stephen H. Hall, Garrett W. Hall, and James A. McCall, High-Speed Digital System Design: A Handbook of Interconnect Theory and Design Practices, John Wiley & Sons, 2000.
[7] 是德科技，「評估示波器的取樣率 vs. 取樣的詳實度(應用說明)」，中華民國103年。
[8] S. H. Hall, H. L. Heck, Advanced Signal Integrity for High-Speed Digital Design, John Wiley & Sons, 2009.
[9] Keysight Technologies, “Understanding Oscilloscope Frequency Response and Its Effect on Rise-Time Accuracy(Application Note),” 2014.
[10] 太克科技，「太克科技量測技術研討會課程資料」。
[11] Douglas Brooks, Signal Integrity Issues and Printed Circuit Board Design, Prentice Hall, 2004.
[12] H. W. OTT, Electromagnetic Compatibility Engineering, John Wiley & Sons, 2009.
[13] IEEE Std. 802.3-2015, “IEEE Standard for Ethernet Section Four,” 2015.
[14] IEC 60603-7-41, “Connectors for electronic equipment - Part7-41 : Detail specification for 8-way, unshielded, free and fixed connectors, for data transmissions with frequencies up to 500 MHz,” 2010.
[15] TE Connectivity, “Modular Jacks - Single Port PCB Mount,” 2012.
[16] Intel, “10GBASE-T Magnetics and Connector Specification,” Jan. 2012.
[17] Brian Rautio, John Connrod, “Comparing Microstrip and CPW Performance,” Microwave Journal China, 2012.
[18] David K. Cheng, Fundamentals of Engineering Electromagnetics, Addison-Wesley, 1993.
[19] Mark I. Montrose, EMC and the Printed Circuit Board: Design, Theory, and Layout Made Simple, IEEE Press, 2000.
[20] Wikipedia, “USB,” [Online]. Available:https://en.wikipedia.org/wiki/USB
[21] USB Implementers Forum(USB-IF), “USB Type-C Cable and Connector Specification,” [Online]. Available:http://www.usb.org/developers/usbtypec/
[22] USB Implementers Forum(USB-IF), “USB Type-C Cable and Connector Specification Release 1.1,” Apr. 2015.
[23] 陳彥仁，「應用於電子產品與行動通訊基地台之高速連接器設計」，國立臺灣科技大學，中華民國105年7月。
[24] iFixit, “iPhone 7 Teardown” [Online].
Available:https://www.ifixit.com/Teardown/iPhone+7+Teardown/67382
[25] Repairs Universe, “Asus Zenfone 3 Repair Guides” [Online].
Available:http://www.repairsuniverse.com/asus-zenfone-3-repair-guides.html
[26] Wikipedia, “WiGig,” [Online]. Available:https://zh.wikipedia.org/wiki/WiGig