由於乙太網路的頻寬需求快速成長，本篇論文設計製作整合光次模組，高頻測試板以及時脈資料回復器的軟性印刷電路板與高速印刷電路板，並規劃100GBASE-LR4 光傳送接收模組之雛形。此外也對4×25G 光傳收模組，進行初步的量測。藉由實作與模擬來設計軟性印刷電路板及高速印刷電路板。在高速印刷電路板上除了利用差動訊號傳輸線來達到減少共模雜訊，傳輸線設計使用更高頻的基板。利用軟性印刷電路板達到可折撓、立體配線及提升系統的配線密度等優點來連接光次模組與高速印刷電路板，也在接合點上的優化來達到頻寬可達25 GHz 以上的傳輸線。量測上眼形圖信雜比可達10，對接量測到誤碼率最好可至10-13以下，經過20 公里傳輸仍可達10-3以下。並藉由多功器與解多功器可完成單條光纖傳輸100 Gb/s。可做為未來發展100 G 甚至400 G 光傳收
模組之雛形。

This thesis focuses on the design and realization of flexible printed circuit boards and high-speed printed circuit boards to integrate the optical subassembly (OAS), high-speed testing fixture, and the clock data
recovery circuits. The layout of the prototype of 100GBASE-LR4 optical
transceiver modules and the measurements for the 4X25G optical
transceiver module are also presented. After deliberate design and verification with simulations, we have successful realized the flexible printed circuit boards and high-speed printed circuit board. The designs of the circuit boards incorporate not only differential transmission lines to reduce common mode noise, but also high-frequency substrates to enhance the frequency response of the transmission line. The flexible printed circuit boards allow foldable and flexible assembly as well as to improve the three-dimensional wiring density in connecting an OSA and the high-speed printed circuit board. With these designs, we have improved the interface between our flexible printed circuit boards and the high-speed printed circuit boards to achieve a bandwidth greater than 25 GHz. The measurement results show the signal-to-noise ratio of up to 10. Back-to-back connection with our module yields a bit error below 10-13. After transmitting along 20-km single mode fiber, the bit error rate can be below 10-3. After wavelength multiplexing and de-multiplexing, we have realized an optical transceiver prototype capable of transmitting 100Gb/s data with 4 wavelength channels. This work lays a framework for realizing 100Gb/s and future 400Gb/s transceiver modules.

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