本論文探討利用LIGA 製程來製作微透鏡，有別於一般電鑄後的微
透鏡陣列填充率不高之限制，藉由電鑄來形成高填充率的微透鏡陣列模
仁，進而提供更高的光線收集效率。主要製程步驟為先在矽基材上，利
用黃光微影製程製作直徑大小為100μm 的光阻圓柱(AZ4620)，再用熱
熔完成微透鏡陣列。後續估算出電鑄時間，透過電鑄來得到高填充率的
電鑄模仁。接著再利用田口實驗，來改善電鑄模仁的表面品質，讓粗糙
度最低且表面品質最佳。本實驗使用簡易的旋轉塗佈機等機械設備、一
道黃光微影製程、簡單的製作過程和低材料費、不須刻意安排光阻之間
的排列。本論文針對設計的光罩尺寸，初始設計電鑄時間需要99 分鐘，
可形成粗糙度0.37μm 高填充率的鎳模仁。經過田口實驗以後，電鑄時
間變成120 分鐘，可得到表面粗糙度為0.10μm 的高填充率鎳模仁。

In this thesis it primarily concerns about making use of the LIGA
manufacturing process to make microlens which is different from the
limitation of low fill-factor microlens array made by regular electroforming.
The high fill-factor microlens array mold could be made by electroforming
that provides more light efficiency. The main process is using
photo-lithography manufacturing process to get photo resist
cylinder(AZ4620)whose diameter is 100μm on silicon wafer, then using
thermo-reflow to get mirolens array.
After that, we calculate the time of electrofoming to make the
electroforming mold which has 100% fill-factor. We also do analysis by
Taguchi method to improve the surface quality of electroforming mold
which has lowest roughness and best surface quality. This experiment use
simple spin coater, one photo-lithography manufacturing process, simple
manufacture process and does not have sedulously to arrange between photo
resisits. The designed photomask in this thesis needs 99 minutes for the
initial design electroforming time and forms nickel mold which has
roughness 0.37μm and high fill-factor. After Taguchi experiment, the
electroforming time is 120 minutes and the nickel mold is obtained with
surface roughness 0.10μm and high fill factor.

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