研究生: |
劉家佑 Chia-Yu Liu |
---|---|
論文名稱: |
添加Sn-10.0 wt.% Cu 於Sn-3.0 wt.% Ag-0.5 wt.% Cu 形成複合銲料之性質研究 The Properties of Composite Solders of Sn-3.0 wt.% Ag- 0.5 wt.% Cu alloy Added with Sn-10.0 wt.% Cu alloy |
指導教授: |
顏怡文
Yee-Wen Yen 莊鑫毅 Hsin-I Chuang |
口試委員: |
陳志銘
Chih-ming Chen 蔡孟霖 Meng-Lin Tsai |
學位類別: |
碩士 Master |
系所名稱: |
工程學院 - 材料科學與工程系 Department of Materials Science and Engineering |
論文出版年: | 2019 |
畢業學年度: | 107 |
語文別: | 中文 |
論文頁數: | 87 |
中文關鍵詞: | 複合銲料 、Sn-Ag-Cu無鉛銲料 |
外文關鍵詞: | Composite Solders, Sn-Ag-Cu lead-free solder |
相關次數: | 點閱:227 下載:0 |
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[1] H. Y. Hsiao, C. M. Liu, H. W. Lin, T. C. Liu, C. L. Lu, Y. S. Huang, K. N. Tu, “Unidirectional growth of microbumps on (111)-oriented and nanotwinned Copper,” Science, 336(6084) (2012) 1007-1010
[2] C. M. L. Wu, D. Q. Yu, C. M. T. Law, L. Wang, “Properties of lead-free solder alloys with rare earth element additions,” Materials Science and Engineering: R: Reports, 44(1) (2004) 1-44
[3] “WEEE Regulations” EU-Directive 96/EC, (2002)
[4] “RoHS Regulations” EU-Directive 95/EC, (2002)
[5] H. Hao, Y. Shi, Z. Xia, Y. Lei, F. Guo, “Microstructure evolution of SnAgCuEr lead-free solders under high temperature aging,” Journal of Electronic Materials, 37(1) (2008) 2-8
[6] K. W. Moon, W. J. Boettinger, U. R. Kattner, F. S. Biancaniello, C. A. Handwerker, “Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys,” Journal of electronic materials, 29(10) (2000) 1122-1136
[7] D. P. Seraphim, R. C. Lasky, C. Y. Li, “Principles of electronic packaging,” McGraw-Hill College, New York, (1989)
[8] J. H. Lau, C. P. Wong, W. Nakayama, J. L. “Prince, electronic packaging: design, materials, process, and reliability,” McGraw-Hill, New York, (1998)
[9] 田民波/著、顏怡文/教訂,「半導體電子元件構裝技術」,五南圖書出版社,台北 (2005)
[10] J. E. Morris, Workshop, “The design and processing technology of electronic Packaging,” (1997)
[11] 林定皓,「電子構裝技術概論」,台灣電路板協會,(2010)
[12] E. H. Amalua, W. K. Lau, N. N. Ekere, R. S. Bhatti, S. Mallik, K. C. Otiaba, G. Takyi, “A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits,” Microelectronic Engineering, 88(7) (2011) 1610-1617
[13] M. Abtew, G. Selvaduray, “Lead-free solders in microelectronics,” Materials Science and Engineering: R: Reports, 27(5-6) (2000) 95-141.
[14] K. N. Tu, J. C. M. Li, “Spontaneous whisker growth on lead-free solder finishes,” Materials Science and Engineering: A, 409(1-2) (2005) 131-139.
[15] K. Fakpan, R. Canyook, “Effects of Sb and Zn addition on mechanical properties and corrosion resistance of Sn-Ag-Cu Solders,” Key Engineering Materials, 728 (2017) 129-134
[16] N. C. Lee, “Getting ready for lead-free solders,” Soldering & surface mount technology, 9(2) (1997) 65-69
[17] 魏弘堯,「¬在BGA製程中以銦作為UBM層對接點界面型態與機械性質之探討」,碩士論文,國立台灣科技大學材料究所,(2006)
[18] S. K. Kang, D. Y. Shih, D. Leonard, D. W. Henderson, T. Gosselin, S. I. Cho, W. K. Choi, “Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying,” JOM, 56(6) (2004) 34
[19] I. E. Anderson, “Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications,” Journal of Materials Science: Materials in Electronics, 18(1-3) (2007) 55-76
[20] N. Saunders, A. P. Miodownik, “ASM Handbook vol. 3 Alloy Phase Diagrams,” edited by H. Baker, Materials Park, Ohio: ASM International, (1990)
[21] I. Karakaya, W. T. Thompson, “ASM Handbook vol. 3 Alloy Phase Diagrams,” edited by H. Baker, ASM International, Materials Park, Ohio, (1987)
[22] K. S. Kim, S. H. Huh, K. Suganuma, “Effects of cooling speed on microstructure and tensile properties of Sn-Ag-Cu alloys,” Materials science and engineering: a, 333(1-2) (2002) 106-114
[23] S. H. Huh, K. S. Kim, K. Suganuma, “Effect of Ag addition on the microstructural and mechanical properties of Sn-Cu eutectic solder,” Materials Transactions, 42(5) (2001) 739-744
[24] F. Guo, “Composite-lead free electronic solders,” Journal of Materials Science: Materials in Electronics, 18(1-3) (2007) 129-145
[25] S. Y. Hwang, J. W. Lee, Z.H. Lee, “Microstructure of a lead-free composite solder produced by an in-situ process,” Journal of Electronic Materials, 31(11) (2002) 1304-1308
[26] D. C. Lin, T. S. Srivatsan, G. X. Wang, R. Kovacevic, “Microstructural development of a rapidly cooled eutectic Sn-3.5% Ag solder reinforced with copper powder,” Powder Technology, 166(1) (2006) 38-46
[27] B. I. Noh, J. H. Choi, J. W. Yoon, S. B. Jung, “Effect of cerium content on wettability, microstructure and mechanical properties of Sn-Ag-Ce solder alloys,” Journal of Alloys and Compounds, 499(2) (2010) 154-159.
[28] P. Babaghorbani, S. M. L. Nai, M. Gupta, “Reinforcements at nanometer length scale and the electrical resistivity of lead-free solders,” Journal of Alloys and Compounds, 478(1-2) (2009) 458-461
[29] A. Nadia, A. S. M. A. Haseeb, “Effect of addition of copper particles of different size to Sn-3.5Ag solder,” Journal of Materials Science Materials in Electronics, 23(1) (2012) 86-93
[30] H. T. Lee, Y. H. Lee, “Adhesive strength and tensile fracture of Ni particles enhanced Sn-Ag composite solder joint,” Materials Science and Engineering: A, 419(1-2) (2006) 172-180.
[31] M. He, N. D. Leon, V. L. Acoff, “Effect of Bi on the microstructure and tensile behavior of Sn-3.7Ag solders,” Soldering & Surface Mount Technology, 22(3) (2010) 4-9
[32] L. Zhang, W. Tao, J. Liu, Y. Zhang, Z. Cheng, C. Andersson, Y. Gao, Q. Zhai, “Manufacture, microstructure and microhardness analysis of Sn-Bi lead-free solder reinforced with Sn-Ag-Cu nano-particles,” International Conference on Electronic Packaging Technology& High Density Packaging (ICEPT-HDP), (2008) 1-5
[33] B. An, C. M. L. Wu, “Evaluation of wettability of composite solder alloy reinforced with silver and copper particles,” International Conference on Electronic Packaging Technology (ICEPT), (2007) 1-6.
[34] K. Bukat, M. Koscielski, J. Sitek, M. Jakubowska, A. Mlozniak, der “Silver nanoparticles effect on the wettability of Sn-Ag-Cu sol pastes and solder joints microstructure on copper,” Soldering & Surface Mount Technology, 23(3) (2011) 150-160.
[35] M. Koscielski, K. Bukat, M. Jakubowska, A. Mlozniak, “Application of silver nanoparticles to improve wettability of SnAgCu solder paste,” International Spring Seminar on Electronics Technology (ISSE), (2010) 473-477
[36] P. Liu, P. Yao, J. Liu, “Evolution of the interface and shear strength between SnAgCu-xNi solder and Cu substrate during isothermal aging at 150°C,” Journal of Alloys and Compounds, 486(1-2) (2009) 474-479
[37] M. M. Arafat, A. S. M. A. Haseeb, “Interfacial reaction and dissolution behavior of Cu substrate in molten Sn-3.8Ag-0.7Cu-nano Mo composite solder,” Electronics Packaging Technology Conference (EPTC) (2009) 953-956
[38] M. M. Arafat, A. S. M. A. Haseeb, Mohd Rafie Johan, “Interfacial reaction and dissolution behavior of Cu substrate in molten Sn-3.8Ag-0.7Cu in the presence of Mo nanoparticles,” Soldering & Surface Mount Technology, 23(3) (2011) 140-149
[39] V. Sivasubramaniam, N. S. Bosco, J. J. Rusch, J. Cugnoni, J. Botsis, “Interfacial intermetallic growth and strength of composite lead-free solder alloy through isothermal aging”, Journal of Electronic Materials, 37(10) (2008) 1598-1604.
[40] C. P Peng, J. Shen, W. D. Xie, J. Chen, C. P. Wu, X. C. Wang, “Influence of minor Ag nano-particles additions on the microstructure of Sn30Bi0.5Cu solder reacted with a Cu substrate,” Journal of Materials Science Materials in Electronics, 22(7) (2011) 797-806
[41] Q. Chen, G. Li, “Effect of dopants on wettability and microstructure evolution of lead-free solder joints,” International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) (2010) 314-318
[42] S. M. L. Nai, M. Gupta, J. Wei, “Development of novel lead-free solder composites using carbon nanotube reinforcements,” International Journal of Nanoscience, 4 (2005) 423-429.
[43] S. M. L. Nai, J. Wei, M. Gupta, “Multi-walled carbon nanotubes reinforced lead-free solder composites,” SIMTech technical report, 9(4) (2008) 195-199.
[44] A. Sharif , Y. C. Chan, “Dissolution kinetics of BGA Sn–Pb and Sn–Ag solders with Cu substrates during reflow,” Materials Science and Engineering: B, 106(2) (2004) 126-131
[45] M. L. Huang, T. Loeher, A. Ostmann, H. Reichl, “Role of Cu in dissolution kinetics of Cu metallization in molten Sn-based solders,” Applied Physics Letter, 86 (2005)
[46] J. W. Han, H. G. Lee, J. Y. Park, “Numerical simulation of dynamic wetting behavior in the wetting balance method,” Materials Transactions, 43(8) (2002) 1816-1820
[47] J. Y. Park, C. S. Kang, J. P. Jung, “The analysis of the withdrawal force curve of the wetting curve using 63Sn-37Pb and 96.5Sn-3.5Ag eutectic solders,” Journal of Electronic Materials, 28(11) (1999) 1256-1262
[48] F. G. Yost, “The Metal Science of Joining,” edited by M. J. Cieslak (1992)
[49] S. W. Chen, C. C. Lin, C. M. Chen, “Determination of the melting and solidification characteristics of solders using differential scanning calorimetry,” Metallurgical and Materials Transactions A, 29(7) (1998) 1965-1972
[50] M. M. Billah, K. M. Shorowordi, A. Sharif, “Effect of micron size Ni particle addition in Sn-8Zn-3Bi lead-free solder alloy on the microstructure, thermal and mechanical properties,” Journal of Alloys and Compounds, 585 (2014) 32-39
[51] K. M. Kumar, V. Kripesh, A. A.O. Tay, “Single-wall carbon nanotube (SWCNT) functionalized Sn-Ag-Cu lead-free composite solders,” Journal of Alloys and Compounds, 450 (2008) 229-237
[52] W. Zhai, W.L. Wang, D.L. Geng, B. Wei, “A DSC analysis of thermodynamic properties and solidification characteristics for binary Cu–Sn alloys,” Acta Materialia, 60 (2012) 6518–6527
[53] 傅淑玫,「¬添加多壁奈米碳管於Sn-3.0Ag-0.5Cu無鉛銲料之性質研究」,碩士論文,國立台灣科技大學材料究所,(2011)