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研究生: 劉家佑
Chia-Yu Liu
論文名稱: 添加Sn-10.0 wt.% Cu 於Sn-3.0 wt.% Ag-0.5 wt.% Cu 形成複合銲料之性質研究
The Properties of Composite Solders of Sn-3.0 wt.% Ag- 0.5 wt.% Cu alloy Added with Sn-10.0 wt.% Cu alloy
指導教授: 顏怡文
Yee-Wen Yen
莊鑫毅
Hsin-I Chuang
口試委員: 陳志銘
Chih-ming Chen
蔡孟霖
Meng-Lin Tsai
學位類別: 碩士
Master
系所名稱: 工程學院 - 材料科學與工程系
Department of Materials Science and Engineering
論文出版年: 2019
畢業學年度: 107
語文別: 中文
論文頁數: 87
中文關鍵詞: 複合銲料Sn-Ag-Cu無鉛銲料
外文關鍵詞: Composite Solders, Sn-Ag-Cu lead-free solder
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  • 摘要i Abstractiii 誌謝v 目錄vii 圖目錄ix 表目錄xii 第一章、前言1 第二章、文獻回顧3 2-1 電子構裝技術3 2-1.1電子構裝簡介3 2-1.2 回銲技術5 2-2無鉛銲料7 2-2.1 無鉛銲料介紹7 2-2.2 錫(Sn)9 2-2.3 錫-銅(Sn-Cu)9 2-2.4 錫-銀-銅(Sn-Ag-Cu)10 2-3 複合銲料相關研究文獻12 2-4 複合銲料性質分析15 2-4.1 熱分析15 2-4.2 溶解性質17 2-4.3 濕潤性質18 第三章、實驗方法20 3-1 銲料製備20 3-2 熱分析21 3-3 金相處理23 3-4 複合銲料觀察與分析23 3-5 溶解分析24 3-6 濕潤性質分析25 3-7 流動現象觀察27 第四章、結果與討論29 4-1 熱分析29 4-2 不同回銲次數後金相觀察40 4-3 溶解實驗金相觀察51 4-4 潤濕性質分析55 4-4.1潤濕性分析與計算55 4-4.2 SAC-xS10C銲料潤濕性質57 4-5 SAC-xS10C銲料流動現象觀察64 第五章、結論65 第六章、參考文獻67

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