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研究生： 趙國興
Kuo-Sing Chao
論文名稱： Sn-9Zn無鉛銲料與Au/Ni/SUS304基材界面反應的研究
The Study of Interfacial Reactions betweenSn-9Zn Lead-Free Solder and Au/Ni/SUS304 Substrate
指導教授： 顏怡文
Yee-wen Yen
口試委員: 鄭偉鈞
Wei-chun Cheng
郭俞麟
Yu-Lin Kuo
吳子嘉
Albert T. Wu
陳志銘
Chih-Ming Chen
洪伯達
Po-Da Hong
學位類別： 碩士
Master
系所名稱： 工程學院 - 材料科學與工程系
Department of Materials Science and Engineering
論文出版年： 2008
畢業學年度： 96
語文別： 中文
論文頁數： 85
中文關鍵詞： 無鉛銲料 、Sn-9Zn 、界面反應
外文關鍵詞： Lead-free solder, Sn-9Zn, interfacial reaction
相關次數： 點閱：363  下載：2 
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    • 無鉛銲料是電子構裝產業中最熱門的議題，以Sn-9Zn為主的無鉛銲料因價格低廉，已成為工業界研究的焦點。另一方面，Sn-9Zn無鉛銲料與Au/Ni/SUS304基材的界面反應鮮少被研究討論。
    本研究在探討Sn-9Zn無鉛銲料與Au/Ni/SUS304基材進行液-固界面反應，反應溫度為240、255與270℃，反應時間為1、2、3、4 與5小時，觀察界面反應生成的介金屬相種類與形態。
    Sn-9Zn與Au/Ni/SUS304液-固界面反應的結果顯示，於界面處皆只生成一平坦狀介金屬相，以EPMA分析可知其介金屬為Ni5Zn21相，無發現其他介金屬相存在。觀察其厚度成長情形，發現隨反應溫度升高及反應時間增長其介金屬相成長增厚，其厚度與反應時間的平方根呈線性關係(n=0.5)，符合動力學上的拋物線定律。Ni5Zn21相生長速率常數k值，隨著反應溫度的上升而變大，其反應活化能為112.5kJ/mole。

    Lead-free solder as Sn-9Zn so cheap has attracted extensive studies recently. On the other hand, the interfacial reaction between the Sn-9Zn based solders and Au/Ni/SUS304 substrate were rarely studied before.
    This study investigated the interfacial reaction between Sn-9Zn lead-free solder and Au/Ni/SUS304 substrate. The liquid-solid reaction temperature at 240、255 and 270℃, reacted 1、2、3、4 and 5 hour.
    After reaction, we analyzed the species of IMCs and observed morphology of IMCs. The thickness of the reaction layers increased with higher temperature and longer reaction time. The growth of IMC formed at interface between Sn-9Zn lead-free solder and Au/Ni/SUS304 substrate was diffusion controlled(n=0.5), and their growth rates were described by using the parabolic law. EPMA results revealed, only a continuous Ni5Zn21 was found between Sn-9Zn lead-free solder and Au/Ni/SUS304 substrate. The IMCs content of others were not observed at all. The k values of Ni5Zn21 growth rate constant increased with higher temperature, and the activation energy of growth was 112.5 kJ/mol.

    中文摘要I 英文摘要II 誌謝III 目錄IV 圖目錄VII 表目錄X 第一章 前言 1 第二章 文獻回顧4 2.1 電子構裝技術4 2.2 無鉛銲料10 2.3 Sn-9Zn無鉛銲料及Au/Ni/SUS304基材相關的二、三元系 統相圖16 2.3-1 Sn-Ni 二元系統相圖16 2.3-2 Sn-Zn 二元系統相圖17 2.3-3 Ni-Zn 二元系統相圖18 2.3-4 Fe-Zn 二元系統相圖19 2.3-5 Fe-Sn 二元系統相圖20 2.3-6 Fe-Ni 二元系統相圖21 2.3-7 Au-Zn 二元系統相圖22 2.3-8 Au-Sn 二元系統相圖23 2.3-9 Au-Ni 二元系統相圖25 2.3-10 Au-Fe 二元系統相圖26 2.3-11 Sn-Zn-Ni 三元系統相圖27 2.4 液-固界面反應28 2.5 擴散控制反應與界面控制反應31 2.6 界面反應相關文獻回顧33 2.6-1 Sn/Ni界面反應33 2.6-2 Sn-9Zn/Ni界面反應36 第三章 實驗方法37 3.1 Sn-9Zn無鉛銲料與相關實驗材料37 3.2 反應偶製作38 3.3 反應偶處理40 3.4 反應偶試片量測與分析40 第四章 結果與討論44 4.1 Sn-9Zn/Au/Ni/SUS304反應偶的介金屬相種類與形態44 4.2 Sn-9Zn/Au/Ni/SUS304反應偶的介金屬相厚度變化趨勢53 4.3 Sn-9Zn/Au/Ni/SUS304反應偶的蝕刻形態56 4.4 Sn-9Zn/Au/Ni/SUS304反應偶的界面反應動力學58 第五章 結論63 第六章 參考文獻64

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