本研究以C5191 (Cu-4.0wt%Sn-0.2wt%P)、C7521 (Cu-18.0wt% Ni)、C2680 (Cu-18.0wt%Zn)之基材金屬，分別經過Sn-10%wtPb/Ni-P、Sn/Ni-P及Au/Ni-P等不同鍍層處理後，再操作濕潤天平，以熔融之Sn-0.7wt%Cu (SC)、Sn-3.0wt%Ag-0.5wt%Cu (SAC)、Sn-58wt% Bi (SB)銲料分別量測濕潤性。另同樣以Sn-37wt%Pb (SP)銲料做測試對照，並進一步解析與銲點之剪切強度之對應比較。
實驗結果顯示在260 ℃下，C5191之鍍層試片的濕潤時間在0.19-1.56秒之間，濕潤力則在0.15-0.83 mN之間。C7521之鍍層試片的濕潤時間在0.16-1.30秒之間，濕潤力則在0.24-0.84 mN之間。C2680之鍍層試片的濕潤時間則在0.14-1.41秒之間，濕潤力則在0.27-0.83 mN之間。其中SB銲料對三種基材金屬之Au/Ni-P鍍層試片上之濕潤性皆呈不濕潤(non-wetting)狀態。另在SP銲料中，C5191之鍍層試片之濕潤時間是在0.18-0.68秒之間，濕潤力則在0.38-0.78 mN之間。C7521之鍍層試片之濕潤時間是在0.22-0.69秒之間，濕潤力則在0.46- 0.81 mN之間。C2680之鍍層試片之濕潤時間是在0.20-0.63秒之間，濕潤力則在0.45-0.76 mN之間。
在濕潤時間為指標，三種基材鍍層試片較佳的濕潤性均發生在Sn-Pb/Ni-P鍍層試片上，依次為Sn/Ni-P與Au/Ni-P鍍層試片。在銲料對濕潤時間之表現，皆以在SP銲料中之表現最佳，依次為在SAC、SC及SB銲料。
在濕潤力為指標上，三種基材鍍層試片最大濕潤力Fm的表現皆以Sn-Pb/Ni-P鍍層試片的濕潤力表相對較大，依次為在Sn/Ni-P與Au/Ni-P鍍層試片。於四種銲料中濕潤力之表現上皆以SB銲料之表現為最差。另顯示濕潤性之結果是受到鍍層的不同所影響。
在濕潤角(θ)之計算上，對C5191之Sn-Pb/Ni-P、Sn/Ni-P與Au/Ni-P鍍層三種試片，於SP銲料時各為 20.3°、37.5°與53.0°，於SC銲料時各為29.1°、31.2°與 69.0°，在SAC銲料時各為 19.0°、37.7°與53.3°，於SB銲料時各為17.9°、58.7°及non-wetting。
三種基材之鍍層試片與四種銲料反應之銲點強度，於含微鉛之Sn-Pb/Ni-P之鍍層試片與SB銲料有較佳之銲點強度;另在銲點強度與濕潤性相對應比較，引腳基材如為含微鉛量之Sn-Pb/Ni-P鍍層會較Sn/Ni-P鍍層有較佳之濕潤性與銲點強度。

The wettability and mechanical properties between Sn-0.7wt%Cu, Sn-3.0wt%Ag-0.5wt%Cu, Sn-58wt%Bi and Sn-37wt.%Pb solders under Sn- Pb/Ni-P, Sn/Ni-P and Au/Ni-P plating finished on C5191 (Cu-4.0wt%Sn -0.2wt%P), C7521 (Cu-18.0wt%Ni) and C2680 (Cu-18.0wt%Zn) substrates were investigated in this work, which includes the wetting balance and shear strength measurement.
A vertical substrate plate is immersed into a molten solder bath. The force performed on the plate is measured by utilizing a wetting balance. Experimental results demonstrate the basic wettability of diverse lead-free solders on difference substrate’s plating finished by a wetting balance, such as wetting time, wetting force, contact angle and surface tension.
Moreover, the solder’s wettability compared with the shear strength of the joints under difference substrate’s plating finished. The results of this studying, it clarifies the shear strength of joints varies by plating finished, irrespective of the under substrate. And Pb additions as small as 10% composition in Sn plating finished, it will be improved wettability due to soldering and strength of the joints.

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